A review of data mining applications in semiconductor manufacturing

The authors acknowledge Fundacao para a Ciencia e a Tecnologia (FCT-MCTES) for its financial support via the project UIDB/00667/2020 (UNIDEMI).For decades, industrial companies have been collecting and storing high amounts of data with the aim of better controlling and managing their processes. However, this vast amount of information and hidden knowledge implicit in all of this data could be utilized more efficiently. With the help of data mining techniques unknown relationships can be systematically discovered. The production of semiconductors is a highly complex process, which entails several subprocesses that employ a diverse array of equipment. The size of the semiconductors signifies a high number of units can be produced, which require huge amounts of data in order to be able to control and improve the semiconductor manufacturing process. Therefore, in this paper a structured review is made through a sample of 137 papers of the published articles in the scientific community regarding data mining applications in semiconductor manufacturing. A detailed bibliometric analysis is also made. All data mining applications are classified in function of the application area. The results are then analyzed and conclusions are drawn.publishersversionpublishe

MFRL-BI: Design of a Model-free Reinforcement Learning Process Control Scheme by Using Bayesian Inference

Design of process control scheme is critical for quality assurance to reduce variations in manufacturing systems. Taking semiconductor manufacturing as an example, extensive literature focuses on control optimization based on certain process models (usually linear models), which are obtained by experiments before a manufacturing process starts. However, in real applications, pre-defined models may not be accurate, especially for a complex manufacturing system. To tackle model inaccuracy, we propose a model-free reinforcement learning (MFRL) approach to conduct experiments and optimize control simultaneously according to real-time data. Specifically, we design a novel MFRL control scheme by updating the distribution of disturbances using Bayesian inference to reduce their large variations during manufacturing processes. As a result, the proposed MFRL controller is demonstrated to perform well in a nonlinear chemical mechanical planarization (CMP) process when the process model is unknown. Theoretical properties are also guaranteed when disturbances are additive. The numerical studies also demonstrate the effectiveness and efficiency of our methodology.Comment: 31 pages, 7 figures, and 3 table

Sensor-Based Monitoring and Inspection of Surface Morphology in Ultraprecision Manufacturing Processes

This research proposes approaches for monitoring and inspection of surface morphology with respect to two ultraprecision/nanomanufacturing processes, namely, ultraprecision machining (UPM) and chemical mechanical planarization (CMP). The methods illustrated in this dissertation are motivated from the compelling need for in situ process monitoring in nanomanufacturing and invoke concepts from diverse scientific backgrounds, such as artificial neural networks, Bayesian learning, and algebraic graph theory. From an engineering perspective, this work has the following contributions:1. A combined neural network and Bayesian learning approach for early detection of UPM process anomalies by integrating data from multiple heterogeneous in situ sensors (force, vibration, and acoustic emission) is developed. The approach captures process drifts in UPM of aluminum 6061 discs within 15 milliseconds of their inception and is therefore valuable for minimizing yield losses.2. CMP process dynamics are mathematically represented using a deterministic multi-scale hierarchical nonlinear differential equation model. This process-machine inter-action (PMI) model is evocative of the various physio-mechanical aspects in CMP and closely emulates experimentally acquired vibration signal patterns, including complex nonlinear dynamics manifest in the process. By combining the PMI model predictions with features gathered from wirelessly acquired CMP vibration signal patterns, CMP process anomalies, such as pad wear, and drifts in polishing were identified in their nascent stage with high fidelity (R2 ~ 75%).3. An algebraic graph theoretic approach for quantifying nano-surface morphology from optical micrograph images is developed. The approach enables a parsimonious representation of the topological relationships between heterogeneous nano-surface fea-tures, which are enshrined in graph theoretic entities, namely, the similarity, degree, and Laplacian matrices. Topological invariant measures (e.g., Fiedler number, Kirchoff index) extracted from these matrices are shown to be sensitive to evolving nano-surface morphology. For instance, we observed that prominent nanoscale morphological changes on CMP processed Cu wafers, although discernible visually, could not be tractably quantified using statistical metrology parameters, such as arithmetic average roughness (Sa), root mean square roughness (Sq), etc. In contrast, CMP induced nanoscale surface variations were captured on invoking graph theoretic topological invariants. Consequently, the graph theoretic approach can enable timely, non-contact, and in situ metrology of semiconductor wafers by obviating the need for reticent profile mapping techniques (e.g., AFM, SEM, etc.), and thereby prevent the propagation of yield losses over long production runs.Industrial Engineering & Managemen

Smart Feature Selection to enable Advanced Virtual Metrology

The present dissertation enhances the research in computer science, especially state of the art Machine Learning (ML), in the field of process development in Semiconductor Manufacturing (SM) by the invention of a new Feature Selection (FS) algorithm to discover the most important equipment and context parameters for highest performance of predicting process results in a newly developed advanced Virtual Metrology (VM) system. In complex high-mixture-low-volume SM, chips or rather silicon wafers for numerous products and technologies are manufactured on the same equipment. Process stability and control are key factors for the production of highest quality semiconductors. Advanced Process Control (APC) monitors manufacturing equipment and intervenes in the equipment control if critical states occur. Besides Run-To-Run (R2R) control and Fault Detection and Classification (FDC) new process control development activities focus on VM which predicts metrology results based on productive equipment and context data. More precisely, physical equipment parameters combined with logistical information about the manufactured product are used to predict the process result. The compulsory need for a reliable and most accurate VM system arises to imperatively reduce time and cost expensive physical metrology as well as to increase yield and stability of the manufacturing processes while concurrently minimizing economic expenditures and associated data flow. The four challenges of (1) efficiency of development and deployment of a corporate-wide VM system, (2) scalability of enterprise data storage, data traffic and computational effort, (3) knowledge discovery out of available data for future enhancements and process developments as well as (4) highest accuracy including reliability and reproducibility of the prediction results are so far not successfully mastered at the same time by any other approach. Many ML techniques have already been investigated to build prediction models based on historical data. The outcomes are only partially satisfying in order to achieve the ambitious objectives in terms of highest accuracy resulting in tight control limits which tolerate almost no deviation from the intended process result. For optimization of prediction performance state of the art process engineering requirements lead to three criteria for assessment of the ML algorithm for the VM: outlier detection, model robustness with respect to equipment degradation over time and ever-changing manufacturing processes adapted for further development of products and technologies and finally highest prediction accuracy. It has been shown that simple regression methods fail in terms of prediction accuracy, outlier detection and model robustness while higher-sophisticated regression methods are almost able to constantly achieve these goals. Due to quite similar but still not optimal prediction performance as well as limited computational feasibility in case of numerous input parameters, the choice of superior ML regression methods does not ultimately resolve the problem. Considering the entire cycle of Knowledge Discovery in Databases including Data Mining (DM) another task appears to be crucial: FS. An optimal selection of the decisive parameters and hence reduction of the input space dimension boosts the model performance by omitting redundant as well as spurious information. Various FS algorithms exist to deal with correlated and noisy features, but each of its own is not capable to ensure that the ambitious targets for VM can be achieved in prevalent high-mixture-low-volume SM. The objective of the present doctoral thesis is the development of a smart FS algorithm to enable a by this advanced and also newly developed VM system to comply with all imperative requirements for improved process stability and control. At first, a new Evolutionary Repetitive Backward Elimination (ERBE) FS algorithm is implemented combining the advantages of a Genetic Algorithm (GA) with Leave-One-Out (LOO) Backward Elimination as wrapper for Support Vector Regression (SVR). At second, a new high performance VM system is realized in the productive environment of High Density Plasma (HDP) Chemical Vapor Deposition (CVD) at the Infineon frontend manufacturing site Regensburg. The advanced VM system performs predictions based on three state of the art ML methods (i.e. Neural Network (NN), Decision Tree M5’ (M5’) & SVR) and can be deployed on many other process areas due to its generic approach and the adaptive design of the ERBE FS algorithm. The developed ERBE algorithm for smart FS enhances the new advanced VM system by revealing evidentially the crucial features for multivariate nonlinear regression. Enabling most capable VM turns statistical sampling metrology with typically 10% coverage of process results into a 100% metrological process monitoring and control. Hence, misprocessed wafers can be detected instantly. Subsequent rework or earliest scrap of those wafers result in significantly increased stability of subsequent process steps and thus higher yield. An additional remarkable benefit is the reduction of production cycle time due to the possible saving of time consuming physical metrology resulting in an increase of production volume output up to 10% in case of fab-wide implementation of the new VM system

Manufacturing Metrology

Metrology is the science of measurement, which can be divided into three overlapping activities: (1) the definition of units of measurement, (2) the realization of units of measurement, and (3) the traceability of measurement units. Manufacturing metrology originally implicates the measurement of components and inputs for a manufacturing process to assure they are within specification requirements. It can also be extended to indicate the performance measurement of manufacturing equipment. This Special Issue covers papers revealing novel measurement methodologies and instrumentations for manufacturing metrology from the conventional industry to the frontier of the advanced hi-tech industry. Twenty-five papers are included in this Special Issue. These published papers can be categorized into four main groups, as follows: Length measurement: covering new designs, from micro/nanogap measurement with laser triangulation sensors and laser interferometers to very-long-distance, newly developed mode-locked femtosecond lasers. Surface profile and form measurements: covering technologies with new confocal sensors and imagine sensors: in situ and on-machine measurements. Angle measurements: these include a new 2D precision level design, a review of angle measurement with mode-locked femtosecond lasers, and multi-axis machine tool squareness measurement. Other laboratory systems: these include a water cooling temperature control system and a computer-aided inspection framework for CMM performance evaluation

Methodology for the development of in-line optical surface measuring instruments with a case study for additive surface finishing

The productivity rate of a manufacturing process is limited by the speed of any measurement processes at the quality control stage. Fast and effective in-line measurements are required to overcome this limitation. Optical instruments are the most promising methods for in-line measurement because they are faster than tactile measurements, able to collect high-density data, can be highly flexible to access complex features and are free from the risk of surface damage. In this paper, a methodology for the development of fast and effective in-line optical measuring instruments for the surfaces of parts with millimetre- to micrometre-size is presented and its implementation demonstrated on an industrial case study in additive manufacturing. Definitions related to in-line measurement and barriers to implementing in-line optical measuring instruments are discussed

Advances in optical surface figuring by reactive atom plasma (RAP)

In this thesis, the research and development of a novel rapid figuring procedure for large ultra-precise optics by Reactive Atom Plasma technology is reported. The hypothesis proved in this research is that a metre scale surface with a form accuracy of ~1 μm PV can be figure corrected to 20 – 30 nm RMS in ten hours. This reduces the processing time by a factor ten with respect to state-of-the-art techniques like Ion Beam Figuring. The need for large scale ultra-precise optics has seen enormous growth in the last decade due to large scale international research programmes. A bottleneck in production is seen in the final figure correction stage. State-of-the-art processes capable of compliance with requisites of form accuracy of one part in 108 (CNC polishing, Magneto-Rheological Finishing and Ion Beam Figuring) have failed to meet the time and cost frame targets of the new optics market. Reactive Atom Plasma (RAP) is a means of plasma chemical etching that makes use of a Radio Frequency Inductively Coupled Plasma (ICP) torch operating at atmospheric pressure. It constitutes an ideal figuring alternative, combining the advantages of a non-contact tool with very high material removal rates and nanometre level repeatability. Despite the rapid figuring potential of this process, research preceding the work presented in this manuscript had made little progress towards design and implementation of a procedure for metre-class optics. The experimental work performed in this PhD project was conducted on Helios 1200, a unique large-scale RAP figuring facility at Cranfield University. Characterisation experiments were carried out on ULE and fused silica surfaces to determine optimum process parameters. Here, the influence of power, surface distance, tool speed and surface temperature was investigated. Subsequently, raster-scanning tests were performed to build an understanding on spaced multiple passes ... [cont.].SAS Prize winne