A testability metric for path delay faults and its application

Abstract — In this paper, we propose a new testability metric for path delay faults. The metric is computed efficiently using a non-enumerative algorithm. It has been validated through extensive experiments and the results indicate a strong correlation between the proposed metric and the path delay fault testability of the circuit. We further apply this metric to derive a path delay fault test application scheme for scan-based BIST. The selection of the test scheme is guided by the proposed metric. The experimental results illustrate that the derived test application scheme can achieve a higher path delay fault coverage in scan-based BIST. Because of the effectiveness and efficient computation of this metric, it can be used to derive other design-for-testability techniques for path delay faults. I

VLSI Testing and Test Power

This paper first reviews the basics of VLSI testing, focusing on test generation and design for testability. Then it discusses the impact of test power in scan testing, and highlights the need for low-power VLSI testing.2011 International Green Computing Conference and Workshops (IGCC 2011), July 25-28, 2011, Orlando, FL, US

CA-BIST for asynchronous circuits: a case study on the RAPPID asynchronous instruction length decoder

Journal ArticleThis paper presents a case study in low-cost noninvasive Built-In Self Test (BIST) for RAPPID, a largescale 120,000-transistor asynchronous version of the Pentium® Pro Instruction Length Decoder, which runs at 3.6 GHz. RAPPID uses a synchronous 0.25 micron CMOS library for static and domino logic, and has no Design-for-Test hooks other than some debug features. We explore the use of Cellular Automata (CA) for on-chip test pattern generation and response evaluation. More specifically, we look for fast ways to tune the CA-BIST to the RAPPID design, rather than using pseudo-random testing. The metric for tuning the CA-BIST pattern generation is based on an abstract hardware description model of the instruction length decoder, which is independent of implementation details, and hence also independent of the asynchronous circuit style. Our CA-BI ST solution uses a novel bootstrap procedure for generating the test patterns, which give complete coverage for this metric, and cover 94% of the testable stuck-at faults for the actual design at switch level. Analysis of the undetected and untestable faults shows that the same fault effects can be expected for a similar clocked circuit. This is encouraging evidence that testability is no excuse to avoid asynchronous design techniques in addition to high-performance synchronous solutions

CA-BIST for asynchronous circuits: a case study on the RAPPID asynchronous instruction length decoder

Journal ArticleThis paper presents a case study in low-cost noninvasive Built-In Self Test (BIST) for RAPPID, a largescale 120,000-transistor asynchronous version of the Pentium® Pro Instruction Length Decoder, which runs at 3.6 GHz. RAPPID uses a synchronous 0.25 micron CMOS library for static and domino logic, and has no Design-for-Test hooks other than some debug features. We explore the use of Cellular Automata (CA) for on-chip test pattern generation and response evaluation. More specifically, we look for fast ways to tune the CA-BIST to the RAPPID design, rather than using pseudo-random testing. The metric for tuning the CA-BIST pattern generation is based on an abstract hardware description model of the instruction length decoder, which is independent of implementation details, and hence also independent of the asynchronous circuit style. Our CA-BI ST solution uses a novel bootstrap procedure for generating the test patterns, which give complete coverage for this metric, and cover 94% of the testable stuck-at faults for the actual design at switch level. Analysis of the undetected and untestable faults shows that the same fault effects can be expected for a similar clocked circuit. This is encouraging evidence that testability is no excuse to avoid asynchronous design techniques in addition to high-performance synchronous solutions

A Defect-tolerant Cluster in a Mesh SRAM-based FPGA

International audienceIn this paper, we propose the implementation of multiple defect-tolerant techniques on an SRAM-based FPGA. These techniques include redundancy at both the logic block and intra-cluster interconnect. In the logic block, redundancy is implemented at the multiplexer level. Its efficiency is analyzed by injecting a single defect at the output of a multiplexer, considering all possible locations and input combinations. While at the interconnect level, fine grain redundancy is introduced which not only bypasses defects but also increases routability. Taking advantage of the sparse intra-cluster interconnect structures, routability is further improved by efficient distribution of feedback paths allowing more flexibility in the connections among logic blocks. Emulation results show a significant improvement of about 15% and 34% in the robustness of logic block and intra-cluster interconnect respectively. Furthermore, the impact of these hardening schemes on the testability of the FPGA cluster for manufacturing defects is also investigated in terms of maximum achievable fault coverage and the respective cost

Quiescent current testing of CMOS data converters

Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed

On Flip-Flop Selection for Multi-cycle Scan Test with Partial Observation in Logic BIST

Multi-cycle test with partial observation for scan-based logic BIST is known as one of effective methods to improve fault coverage without increase of test time. In the method, the selection of flip-flops for partial observation is critical to achieve high fault coverage with small area overhead. This paper proposes a selection method under the limitation to a number of flip-flops. The method consists of structural analysis of CUT and logic simulation of test vectors, therefore, it provides an easy implementation and a good scalability. Experimental results on benchmark circuits show that the method obtains higher fault coverage with less area overhead than the original method. Also the relation between the number of selected flip-flops and fault coverage is investigated.27th IEEE ASIAN TEST SYMPOSIUM (ATS\u2718), 15-18 October 2018, Hefei, Chin

Algorithms for Power Aware Testing of Nanometer Digital ICs

At-speed testing of deep-submicron digital very large scale integrated (VLSI) circuits has become mandatory to catch small delay defects. Now, due to continuous shrinking of complementary metal oxide semiconductor (CMOS) transistor feature size, power density grows geometrically with technology scaling. Additionally, power dissipation inside a digital circuit during the testing phase (for test vectors under all fault models (Potluri, 2015)) is several times higher than its power dissipation during the normal functional phase of operation. Due to this, the currents that flow in the power grid during the testing phase, are much higher than what the power grid is designed for (the functional phase of operation). As a result, during at-speed testing, the supply grid experiences unacceptable supply IR-drop, ultimately leading to delay failures during at-speed testing. Since these failures are specific to testing and do not occur during functional phase of operation of the chip, these failures are usually referred to false failures, and they reduce the yield of the chip, which is undesirable. In nanometer regime, process parameter variations has become a major problem. Due to the variation in signalling delays caused by these variations, it is important to perform at-speed testing even for stuck faults, to reduce the test escapes (McCluskey and Tseng, 2000; Vorisek et al., 2004). In this context, the problem of excessive peak power dissipation causing false failures, that was addressed previously in the context of at-speed transition fault testing (Saxena et al., 2003; Devanathan et al., 2007a,b,c), also becomes prominent in the context of at-speed testing of stuck faults (Maxwell et al., 1996; McCluskey and Tseng, 2000; Vorisek et al., 2004; Prabhu and Abraham, 2012; Potluri, 2015; Potluri et al., 2015). It is well known that excessive supply IR-drop during at-speed testing can be kept under control by minimizing switching activity during testing (Saxena et al., 2003). There is a rich collection of techniques proposed in the past for reduction of peak switching activity during at-speed testing of transition/delay faults ii in both combinational and sequential circuits. As far as at-speed testing of stuck faults are concerned, while there were some techniques proposed in the past for combinational circuits (Girard et al., 1998; Dabholkar et al., 1998), there are no techniques concerning the same for sequential circuits. This thesis addresses this open problem. We propose algorithms for minimization of peak switching activity during at-speed testing of stuck faults in sequential digital circuits under the combinational state preservation scan (CSP-scan) architecture (Potluri, 2015; Potluri et al., 2015). First, we show that, under this CSP-scan architecture, when the test set is completely specified, the peak switching activity during testing can be minimized by solving the Bottleneck Traveling Salesman Problem (BTSP). This mapping of peak test switching activity minimization problem to BTSP is novel, and proposed for the first time in the literature. Usually, as circuit size increases, the percentage of don’t cares in the test set increases. As a result, test vector ordering for any arbitrary filling of don’t care bits is insufficient for producing effective reduction in switching activity during testing of large circuits. Since don’t cares dominate the test sets for larger circuits, don’t care filling plays a crucial role in reducing switching activity during testing. Taking this into consideration, we propose an algorithm, XStat, which is capable of performing test vector ordering while preserving don’t care bits in the test vectors, following which, the don’t cares are filled in an intelligent fashion for minimizing input switching activity, which effectively minimizes switching activity inside the circuit (Girard et al., 1998). Through empirical validation on benchmark circuits, we show that XStat minimizes peak switching activity significantly, during testing. Although XStat is a very powerful heuristic for minimizing peak input-switchingactivity, it will not guarantee optimality. To address this issue, we propose an algorithm that uses Dynamic Programming to calculate the lower bound for a given sequence of test vectors, and subsequently uses a greedy strategy for filling don’t cares in this sequence to achieve this lower bound, thereby guaranteeing optimality. This algorithm, which we refer to as DP-fill in this thesis, provides the globally optimal solution for minimizing peak input-switching-activity and also is the best known in the literature for minimizing peak input-switching-activity during testing. The proof of optimality of DP-fill in minimizing peak input-switching-activity is also provided in this thesis

Scan Test Coverage Improvement Via Automatic Test Pattern Generation (Atpg) Tool Configuration

The scan test coverage improvement by using automatic test pattern generation (ATPG) tool configuration was investigated. Improving the test coverage is essential in detecting manufacturing defects in semiconductor industry so that high quality products can be supplied to consumers. The ATPG tool used was Mentor Graphics Tessent TestKompress (version 2014.1). The study was done by setting up a few experiments of utilizing and modifying ATPG commands and switches, observing the test coverage improvement from the statistical reports provided during pattern generation process and providing relatable discussions. By modifying the ATPG commands, it can be expected to have some improvement in the test coverage. The scan test patterns generated were stuck-at test patterns. Based on the experiments done, comparison was made on the different coverage readings and the most optimized method and flow of ATPG were determined. The most optimized flow gave an improvement of 0.91% in test coverage which is acceptable since this method does not involve a change in design. The test patterns generated were converted and tested using automatic test equipment (ATE) to observe its performance on real silicon. The test coverage improvement using ATPG tool instead of the design-based method is important as a faster workaround for back-end engineers to provide high quality test contents in such a short product development duration