Monolithic ultrasound fingerprint sensor.

This paper presents a 591×438-DPI ultrasonic fingerprint sensor. The sensor is based on a piezoelectric micromachined ultrasonic transducer (PMUT) array that is bonded at wafer-level to complementary metal oxide semiconductor (CMOS) signal processing electronics to produce a pulse-echo ultrasonic imager on a chip. To meet the 500-DPI standard for consumer fingerprint sensors, the PMUT pitch was reduced by approximately a factor of two relative to an earlier design. We conducted a systematic design study of the individual PMUT and array to achieve this scaling while maintaining a high fill-factor. The resulting 110×56-PMUT array, composed of 30×43-μm2 rectangular PMUTs, achieved a 51.7% fill-factor, three times greater than that of the previous design. Together with the custom CMOS ASIC, the sensor achieves 2 mV kPa-1 sensitivity, 15 kPa pressure output, 75 μm lateral resolution, and 150 μm axial resolution in a 4.6 mm×3.2 mm image. To the best of our knowledge, we have demonstrated the first MEMS ultrasonic fingerprint sensor capable of imaging epidermis and sub-surface layer fingerprints

Future of smart cardiovascular implants

Cardiovascular disease remains the leading cause of death in Western society. Recent technological advances have opened the opportunity of developing new and innovative smart stent devices that have advanced electrical properties that can improve diagnosis and even treatment of previously intractable conditions, such as central line access failure, atherosclerosis and reporting on vascular grafts for renal dialysis. Here we review the latest advances in the field of cardiovascular medical implants, providing a broad overview of the application of their use in the context of cardiovascular disease rather than an in-depth analysis of the current state of the art. We cover their powering, communication and the challenges faced in their fabrication. We focus specifically on those devices required to maintain vascular access such as ones used to treat arterial disease, a major source of heart attacks and strokes. We look forward to advances in these technologies in the future and their implementation to improve the human condition

Space division multiplexing chip-to-chip quantum key distribution

Quantum cryptography is set to become a key technology for future secure communications. However, to get maximum benefit in communication networks, transmission links will need to be shared among several quantum keys for several independent users. Such links will enable switching in quantum network nodes of the quantum keys to their respective destinations. In this paper we present an experimental demonstration of a photonic integrated silicon chip quantum key distribution protocols based on space division multiplexing (SDM), through multicore fiber technology. Parallel and independent quantum keys are obtained, which are useful in crypto-systems and future quantum network

A wireless ultrasonic NDT sensor system

Ultrasonic condition monitoring technologies have been traditionally utilized in industrial and construction environments where structural integrity is of concern. Such techniques include active systems with either single or multiple transmit-receiver combinations used to obtain defect positioning and magnitude. Active sensors are implemented in two ways; in a thickness operation mode, or as an area-mapping tool operating over longer distances. In addition, passive ultrasonic receivers can be employed to detect and record acoustic emission activity. Existing equipment requires cabling for such systems leading to expensive, complicated installations. This work describes the development and operation of a system that combines these existing ultrasonic technologies with modern wireless techniques within a miniaturized, battery-operated design. A completely wireless sensor has been designed that can independently record and analyze ultrasonic signals. Integrated into the sensor are custom ultrasonic transducers, associated analogue drive and receive electronics, and a Texas Instruments Digital Signal Processor (DSP) used to both control the system and implement the signal processing routines. BlueTooth wireless communication is used for connection to a central observation station, from where network operation can be controlled. Extending battery life is of prime importance and the device employs several strategies to do this. Low voltage transducer excitation suffers from poor signal-to-noise ratios, which can be enhanced by signal processing routines implemented on the DSP. Routines investigated include averaging, digital filtering and pulse compression

Concurrent focal-plane generation of compressed samples fromtime-encoded pixel values

Compressive sampling allows wrapping the relevant content of an image in a reduced set of data. It exploits the sparsity of natural images. This principle can be employed to deliver images over a network under a restricted data rate and still receive enough meaningful information. An efficient implementation of this principle lies in the generation of the compressed samples right at the imager. Otherwise, i. e. digitizing the complete image and then composing the compressed samples in the digital plane, the required memory and processing resources can seriously compromise the budget of an autonomous camera node. In this paper we present the design of a pixel architecture that encodes light intensity into time, followed by a global strategy to pseudo-randomly combine pixel values and generate, on-chip and on-line, the compressed samples.Ministerio de Economía y Competitividad TEC 2015-66878-C3-1-RJunta de Andalucía TIC 2338-2013Office of Naval Research (USA) N000141410355CONACYT (Mexico) MZO-2017-29106

TDC Chip and Readout Driver Developments for COMPASS and LHC-Experiments

A new TDC-chip is under development for the COMPASS experiment at CERN. The ASIC, which exploits the 0.6 micrometer CMOS sea-of-gate technology, will allow high resolution time measurements with digitization of 75 ps, and an unprecedented degree of flexibility accompanied by high rate capability and low power consumption. Preliminary specifications of this new TDC chip are presented. Furthermore a FPGA based readout-driver and buffer-module as an interface between the front-end of the COMPASS detector systems and an optical S-LINK is in development. The same module serves also as remote fan-out for the COMPASS trigger distribution and time synchronization system. This readout-driver monitors the trigger and data flow to and from front-ends. In addition, a specific data buffer structure and sophisticated data flow control is used to pursue local pre-event building. At start-up the module controls all necessary front-end initializations.Comment: 5 pages, 4 figure