Printed Circuit Board (PCB) design process and fabrication

This module describes main characteristics of Printed Circuit Boards (PCBs). A brief history of PCBs is introduced in the first chapter. Then, the design processes and the fabrication of PCBs are addressed and finally a study case is presented in the last chapter of the module.Peer ReviewedPostprint (published version

Design, processing and testing of LSI arrays hybrid microelectronics task

Those factors affecting the cost of electronic subsystems utilizing LSI microcircuits were determined and the most efficient methods for low cost packaging of LSI devices as a function of density and reliability were developed

Lean manufacturing applied to a wiring production process

This project was carried out at a company in the electric mobility sector, which manufactures chargers for electric vehicles, specifically in the wiring section. The main objective of the developed work was to improve the production processes in order to enhance responsiveness to the growing demand. After analyzing the processes in the section, the objectives were outlined to enable the improvement of some practices in the production department, such as the ones related to the organization of the raw material supermarket, as well as the calculation of the wiring consumption by chargers, and the implementation of a production control system. After the improvement actions were implemented, it was possible to observe a 14,9% reduction in the changeover process of the cable cutting process; weekly wiring consumptions were estimated, and procedures were defined to generate orders of raw material and supply to the workstation, which led to the elimination of stock shortages. In addition, worker autonomy increased and production downtime was reduced.info:eu-repo/semantics/publishedVersio

A Specification For A Next Generation Cad Toolkit For Electronics Product Design

Electronic engineering product design is a complex process which has enjoyed an increasing provision of computer based tools since the early 1980's. Over this period computer aided design tool development has progressed at such a pace that new features and functions have tended to be market driven. As such CAD tools have not been developed through the recommended practise of defining a functional specification prior to any software code generation. This thesis defines a new functional specification for next generation CAD tools to support the electronics product design process. It is synthesized from a review of the use of computers in the electronics product design process, from a case study of Best Practices prevalent in a wide range of electronics companies and from a new model of the design process. The model and the best practices have given rise to a new concept for company engineering documentation, the Product Book which provides a logical framework for constraining CAD tools and their users (designers) as means of controlling costs in the design process. This specification differs from current perceptions of computer functionality in the CAD tool industry by addressing human needs together with company needs of computer supported design, rather than just providing more technological support for the designer in isolation.Racal Reda

Beta: Bioprinting engineering technology for academia

Higher STEM education is a field of growing potential, but too many middle school and high school students are not testing proficiently in STEM subjects. The BETA team worked to improve biology classroom engagement through the development of technologies for high school biology experiments. The BETA project team expanded functionality of an existing product line to allow for better student and teacher user experience and the execution of more interesting experiments. The BETA project’s first goal was to create a modular incubating Box for the high school classroom. This Box, called the BETA Box was designed with a variety of sensors to allow for custom temperature and lighting environments for each experiment. It was completed with a clear interface to control the settings and an automatic image capture system. The team also conducted a feasibility study on auto calibration and dual-extrusion for SE3D’s existing 3D bioprinter. The findings of this study led to the incorporation of a force sensor for auto calibration and the evidence to support the feasibility of dual extrusion, although further work is needed. These additions to the current SE3D educational product line will increase effectiveness in the classroom and allow the target audience, high school students, to better engage in STEM education activities

Complex low volume electronics simulation tool to improve yield and reliability

Assembly of Printed Circuit Boards (PCB) in low volumes and a high-mix requires a level of manual intervention during product manufacture, which leads to poor first time yield and increased production costs. Failures at the component-level and failures that stem from non-component causes (i.e. system-level), such as defects in design and manufacturing, can account for this poor yield. These factors have not been incorporated in prediction models due to the fact that systemfailure causes are not driven by well-characterised deterministic processes. A simulation and analysis support tool being developed that is based on a suite of interacting modular components with well defined functionalities and interfaces is presented in this paper. The CLOVES (Complex Low Volume Electronics Simulation) tool enables the characterisation and dynamic simulation of complete design; manufacturing and business processes (throughout the entire product life cycle) in terms of their propensity to create defects that could cause product failure. Details of this system and how it is being developed to fulfill changing business needs is presented in this paper. Using historical data and knowledge of previous printed circuit assemblies (PCA) design specifications and manufacturing experiences, defect and yield results can be effectively stored and re-applied for future problem solving. For example, past PCA design specifications can be used at design stage to amend designs or define process options to optimise the product yield and service reliability

Space shuttle main engine controller assembly, phase C-D

System design and system analysis and simulation are slightly behind schedule, while design verification testing has improved. Input/output circuit design has improved, but digital computer unit (DCU) and mechanical design continue to lag. Part procurement was impacted by delays in printed circuit board, assembly drawing releases. These are the result of problems in generating suitable printed circuit artwork for the very complex and high density multilayer boards

Continuous maintenance and the future – Foundations and technological challenges

High value and long life products require continuous maintenance throughout their life cycle to achieve required performance with optimum through-life cost. This paper presents foundations and technologies required to offer the maintenance service. Component and system level degradation science, assessment and modelling along with life cycle ‘big data’ analytics are the two most important knowledge and skill base required for the continuous maintenance. Advanced computing and visualisation technologies will improve efficiency of the maintenance and reduce through-life cost of the product. Future of continuous maintenance within the Industry 4.0 context also identifies the role of IoT, standards and cyber security

JTEC Panel report on electronic manufacturing and packaging in Japan

This report summarizes the status of electronic manufacturing and packaging technology in Japan in comparison to that in the United States, and its impact on competition in electronic manufacturing in general. In addition to electronic manufacturing technologies, the report covers technology and manufacturing infrastructure, electronics manufacturing and assembly, quality assurance and reliability in the Japanese electronics industry, and successful product realization strategies. The panel found that Japan leads the United States in almost every electronics packaging technology. Japan clearly has achieved a strategic advantage in electronics production and process technologies. Panel members believe that Japanese competitors could be leading U.S. firms by as much as a decade in some electronics process technologies