Adaptive memory hierarchies for next generation tiled microarchitectures

Les últimes dècades el rendiment dels processadors i de les memòries ha millorat a diferent ritme, limitant el rendiment dels processadors i creant el conegut memory gap. Sol·lucionar aquesta diferència de rendiment és un camp d'investigació d'actualitat i que requereix de noves sol·lucions. Una sol·lució a aquest problema són les memòries “cache”, que permeten reduïr l'impacte d'unes latències de memòria creixents i que conformen la jerarquia de memòria. La majoria de d'organitzacions de les “caches” estan dissenyades per a uniprocessadors o multiprcessadors tradicionals. Avui en dia, però, el creixent nombre de transistors disponible per xip ha permès l'aparició de xips multiprocessador (CMPs). Aquests xips tenen diferents propietats i limitacions i per tant requereixen de jerarquies de memòria específiques per tal de gestionar eficientment els recursos disponibles. En aquesta tesi ens hem centrat en millorar el rendiment i la eficiència energètica de la jerarquia de memòria per CMPs, des de les “caches” fins als controladors de memòria. A la primera part d'aquesta tesi, s'han estudiat organitzacions tradicionals per les “caches” com les privades o compartides i s'ha pogut constatar que, tot i que funcionen bé per a algunes aplicacions, un sistema que s'ajustés dinàmicament seria més eficient. Tècniques com el Cooperative Caching (CC) combinen els avantatges de les dues tècniques però requereixen un mecanisme centralitzat de coherència que té un consum energètic molt elevat. És per això que en aquesta tesi es proposa el Distributed Cooperative Caching (DCC), un mecanisme que proporciona coherència en CMPs i aplica el concepte del cooperative caching de forma distribuïda. Mitjançant l'ús de directoris distribuïts s'obté una sol·lució més escalable i que, a més, disposa d'un mecanisme de marcatge més flexible i eficient energèticament. A la segona part, es demostra que les aplicacions fan diferents usos de la “cache” i que si es realitza una distribució de recursos eficient es poden aprofitar els que estan infrautilitzats. Es proposa l'Elastic Cooperative Caching (ElasticCC), una organització capaç de redistribuïr la memòria “cache” dinàmicament segons els requeriments de cada aplicació. Una de les contribucions més importants d'aquesta tècnica és que la reconfiguració es decideix completament a través del maquinari i que tots els mecanismes utilitzats es basen en estructures distribuïdes, permetent una millor escalabilitat. ElasticCC no només és capaç de reparticionar les “caches” segons els requeriments de cada aplicació, sinó que, a més a més, és capaç d'adaptar-se a les diferents fases d'execució de cada una d'elles. La nostra avaluació també demostra que la reconfiguració dinàmica de l'ElasticCC és tant eficient que gairebé proporciona la mateixa taxa de fallades que una configuració amb el doble de memòria.Finalment, la tesi es centra en l'estudi del comportament de les memòries DRAM i els seus controladors en els CMPs. Es demostra que, tot i que els controladors tradicionals funcionen eficientment per uniprocessadors, en CMPs els diferents patrons d'accés obliguen a repensar com estan dissenyats aquests sistemes. S'han presentat múltiples sol·lucions per CMPs però totes elles es veuen limitades per un compromís entre el rendiment global i l'equitat en l'assignació de recursos. En aquesta tesi es proposen els Thread Row Buffers (TRBs), una zona d'emmagatenament extra a les memòries DRAM que permetria guardar files de dades específiques per a cada aplicació. Aquest mecanisme permet proporcionar un accés equitatiu a la memòria sense perjudicar el seu rendiment global. En resum, en aquesta tesi es presenten noves organitzacions per la jerarquia de memòria dels CMPs centrades en la escalabilitat i adaptativitat als requeriments de les aplicacions. Els resultats presentats demostren que les tècniques proposades proporcionen un millor rendiment i eficiència energètica que les millors tècniques existents fins a l'actualitat.Processor performance and memory performance have improved at different rates during the last decades, limiting processor performance and creating the well known "memory gap". Solving this performance difference is an important research field and new solutions must be proposed in order to have better processors in the future. Several solutions exist, such as caches, that reduce the impact of longer memory accesses and conform the system memory hierarchy. However, most of the existing memory hierarchy organizations were designed for single processors or traditional multiprocessors. Nowadays, the increasing number of available transistors has allowed the apparition of chip multiprocessors, which have different constraints and require new ad-hoc memory systems able to efficiently manage memory resources. Therefore, in this thesis we have focused on improving the performance and energy efficiency of the memory hierarchy of chip multiprocessors, ranging from caches to DRAM memories. In the first part of this thesis we have studied traditional cache organizations such as shared or private caches and we have seen that they behave well only for some applications and that an adaptive system would be desirable. State-of-the-art techniques such as Cooperative Caching (CC) take advantage of the benefits of both worlds. This technique, however, requires the usage of a centralized coherence structure and has a high energy consumption. Therefore we propose the Distributed Cooperative Caching (DCC), a mechanism to provide coherence to chip multiprocessors and apply the concept of cooperative caching in a distributed way. Through the usage of distributed directories we obtain a more scalable solution and, in addition, has a more flexible and energy-efficient tag allocation method. We also show that applications make different uses of cache and that an efficient allocation can take advantage of unused resources. We propose Elastic Cooperative Caching (ElasticCC), an adaptive cache organization able to redistribute cache resources dynamically depending on application requirements. One of the most important contributions of this technique is that adaptivity is fully managed by hardware and that all repartitioning mechanisms are based on distributed structures, allowing a better scalability. ElasticCC not only is able to repartition cache sizes to application requirements, but also is able to dynamically adapt to the different execution phases of each thread. Our experimental evaluation also has shown that the cache partitioning provided by ElasticCC is efficient and is almost able to match the off-chip miss rate of a configuration that doubles the cache space. Finally, we focus in the behavior of DRAM memories and memory controllers in chip multiprocessors. Although traditional memory schedulers work well for uniprocessors, we show that new access patterns advocate for a redesign of some parts of DRAM memories. Several organizations exist for multiprocessor DRAM schedulers, however, all of them must trade-off between memory throughput and fairness. We propose Thread Row Buffers, an extended storage area in DRAM memories able to store a data row for each thread. This mechanism enables a fair memory access scheduling without hurting memory throughput. Overall, in this thesis we present new organizations for the memory hierarchy of chip multiprocessors which focus on the scalability and of the proposed structures and adaptivity to application behavior. Results show that the presented techniques provide a better performance and energy-efficiency than existing state-of-the-art solutions

Doctor of Philosophy

dissertationIn recent years, a number of trends have started to emerge, both in microprocessor and application characteristics. As per Moore's law, the number of cores on chip will keep doubling every 18-24 months. International Technology Roadmap for Semiconductors (ITRS) reports that wires will continue to scale poorly, exacerbating the cost of on-chip communication. Cores will have to navigate an on-chip network to access data that may be scattered across many cache banks. The number of pins on the package, and hence available off-chip bandwidth, will at best increase at sublinear rate and at worst, stagnate. A number of disruptive memory technologies, e.g., phase change memory (PCM) have begun to emerge and will be integrated into the memory hierarchy sooner than later, leading to non-uniform memory access (NUMA) hierarchies. This will make the cost of accessing main memory even higher. In previous years, most of the focus has been on deciding the memory hierarchy level where data must be placed (L1 or L2 caches, main memory, disk, etc.). However, in modern and future generations, each level is getting bigger and its design is being subjected to a number of constraints (wire delays, power budget, etc.). It is becoming very important to make an intelligent decision about where data must be placed within a level. For example, in a large non-uniform access cache (NUCA), we must figure out the optimal bank. Similarly, in a multi-dual inline memory module (DIMM) non uniform memory access (NUMA) main memory, we must figure out the DIMM that is the optimal home for every data page. Studies have indicated that heterogeneous main memory hierarchies that incorporate multiple memory technologies are on the horizon. We must develop solutions for data management that take heterogeneity into account. For these memory organizations, we must again identify the appropriate home for data. In this dissertation, we attempt to verify the following thesis statement: "Can low-complexity hardware and OS mechanisms manage data placement within each memory hierarchy level to optimize metrics such as performance and/or throughput?" In this dissertation we argue for a hardware-software codesign approach to tackle the above mentioned problems at different levels of the memory hierarchy. The proposed methods utilize techniques like page coloring and shadow addresses and are able to handle a large number of problems ranging from managing wire-delays in large, shared NUCA caches to distributing shared capacity among different cores. We then examine data-placement issues in NUMA main memory for a many-core processor with a moderate number of on-chip memory controllers. Using codesign approaches, we achieve efficient data placement by modifying the operating system's (OS) page allocation algorithm for a wide variety of main memory architectures

Die-Stacked DRAM Caches for Servers: Hit Ratio, Latency, or Bandwidth? Have It All with Footprint Cache

Recent research advocates using large die-stacked DRAM caches to break the memory bandwidth wall. Existing DRAM cache designs fall into one of two categories — block-based and page-based. The former organize data in conventional blocks (e.g., 64B), ensuring low off-chip bandwidth utilization, but co-locate tags and data in the stacked DRAM, incurring high lookup latency. Furthermore, such designs suffer from low hit ratios due to poor temporal locality. In contrast, page-based caches, which manage data at larger granularity (e.g., 4KB pages), allow for reduced tag array overhead and fast lookup, and leverage high spatial locality at the cost of moving large amounts of data on and off the chip. This paper introduces Footprint Cache, an efficient die-stacked DRAM cache design for server processors. Footprint Cache allocates data at the granularity of pages, but identifies and fetches only those blocks within a page that will be touched during the page's residency in the cache — i.e., the page's footprint. In doing so, Footprint Cache eliminates the excessive off-chip traffic associated with page-based designs, while preserving their high hit ratio, small tag array overhead, and low lookup latency. Cycle-accurate simulation results of a 16-core server with up to 512MB Footprint Cache indicate a 57% performance improvement over a baseline chip without a die-stacked cache. Compared to a state-of-the-art block-based design, our design improves performance by 13% while reducing dynamic energy of stacked DRAM by 24%

The Blacklisting Memory Scheduler: Achieving high performance and fairness at low cost

Abstract—In a multicore system, applications running on different cores interfere at main memory. This inter-application interference degrades overall system performance and unfairly slows down applications. Prior works have developed application-aware memory request schedulers to tackle this problem. State-of-the-art application-aware memory request schedulers prioritize memory requests of applications that are vulnerable to interfer-ence, by ranking individual applications based on their memory access characteristics and enforcing a total rank order. In this paper, we observe that state-of-the-art application-aware memory schedulers have two major shortcomings. First, ranking applications individually with a total order based on memory access characteristics leads to high hardware cost and complexity. Second, ranking can unfairly slow down applications that are at the bottom of the ranking stack. To overcome thes

A Survey of Techniques for Architecting TLBs

“Translation lookaside buffer” (TLB) caches virtual to physical address translation information and is used in systems ranging from embedded devices to high-end servers. Since TLB is accessed very frequently and a TLB miss is extremely costly, prudent management of TLB is important for improving performance and energy efficiency of processors. In this paper, we present a survey of techniques for architecting and managing TLBs. We characterize the techniques across several dimensions to highlight their similarities and distinctions. We believe that this paper will be useful for chip designers, computer architects and system engineers

Revisiting Actor Programming in C++

The actor model of computation has gained significant popularity over the last decade. Its high level of abstraction makes it appealing for concurrent applications in parallel and distributed systems. However, designing a real-world actor framework that subsumes full scalability, strong reliability, and high resource efficiency requires many conceptual and algorithmic additives to the original model. In this paper, we report on designing and building CAF, the "C++ Actor Framework". CAF targets at providing a concurrent and distributed native environment for scaling up to very large, high-performance applications, and equally well down to small constrained systems. We present the key specifications and design concepts---in particular a message-transparent architecture, type-safe message interfaces, and pattern matching facilities---that make native actors a viable approach for many robust, elastic, and highly distributed developments. We demonstrate the feasibility of CAF in three scenarios: first for elastic, upscaling environments, second for including heterogeneous hardware like GPGPUs, and third for distributed runtime systems. Extensive performance evaluations indicate ideal runtime behaviour for up to 64 cores at very low memory footprint, or in the presence of GPUs. In these tests, CAF continuously outperforms the competing actor environments Erlang, Charm++, SalsaLite, Scala, ActorFoundry, and even the OpenMPI.Comment: 33 page

Exploiting Natural On-chip Redundancy for Energy Efficient Memory and Computing

Power density is currently the primary design constraint across most computing segments and the main performance limiting factor. For years, industry has kept power density constant, while increasing frequency, lowering transistors supply (Vdd) and threshold (Vth) voltages. However, Vth scaling has stopped because leakage current is exponentially related to it. Transistor count and integration density keep doubling every process generation (Moore’s Law), but the power budget caps the amount of hardware that can be active at the same time, leading to dark silicon. With each new generation, there are more resources available, but we cannot fully exploit their performance potential. In the last years, different research trends have explored how to cope with dark silicon and unlock the energy efficiency of the chips, including Near-Threshold voltage Computing (NTC) and approximate computing. NTC aggressively lowers Vdd to values near Vth. This allows a substantial reduction in power, as dynamic power scales quadratically with supply voltage. The resultant power reduction could be used to activate more chip resources and potentially achieve performance improvements. Unfortunately, Vdd scaling is limited by the tight functionality margins of on-chip SRAM transistors. When scaling Vdd down to values near-threshold, manufacture-induced parameter variations affect the functionality of SRAM cells, which eventually become not reliable. A large amount of emerging applications, on the other hand, features an intrinsic error-resilience property, tolerating a certain amount of noise. In this context, approximate computing takes advantage of this observation and exploits the gap between the level of accuracy required by the application and the level of accuracy given by the computation, providing that reducing the accuracy translates into an energy gain. However, deciding which instructions and data and which techniques are best suited for approximation still poses a major challenge. This dissertation contributes in these two directions. First, it proposes a new approach to mitigate the impact of SRAM failures due to parameter variation for effective operation at ultra-low voltages. We identify two levels of natural on-chip redundancy: cache level and content level. The first arises because of the replication of blocks in multi-level cache hierarchies. We exploit this redundancy with a cache management policy that allocates blocks to entries taking into account the nature of the cache entry and the use pattern of the block. This policy obtains performance improvements between 2% and 34%, with respect to block disabling, a technique with similar complexity, incurring no additional storage overhead. The latter (content level redundancy) arises because of the redundancy of data in real world applications. We exploit this redundancy compressing cache blocks to fit them in partially functional cache entries. At the cost of a slight overhead increase, we can obtain performance within 2% of that obtained when the cache is built with fault-free cells, even if more than 90% of the cache entries have at least a faulty cell. Then, we analyze how the intrinsic noise tolerance of emerging applications can be exploited to design an approximate Instruction Set Architecture (ISA). Exploiting the ISA redundancy, we explore a set of techniques to approximate the execution of instructions across a set of emerging applications, pointing out the potential of reducing the complexity of the ISA, and the trade-offs of the approach. In a proof-of-concept implementation, the ISA is shrunk in two dimensions: Breadth (i.e., simplifying instructions) and Depth (i.e., dropping instructions). This proof-of-concept shows that energy can be reduced on average 20.6% at around 14.9% accuracy loss

새로운 메모리 기술을 기반으로 한 메모리 시스템 설계 기술

학위논문 (박사)-- 서울대학교 대학원 : 전기·컴퓨터공학부, 2017. 2. 최기영.Performance and energy efficiency of modern computer systems are largely dominated by the memory system. This memory bottleneck has been exacerbated in the past few years with (1) architectural innovations for improving the efficiency of computation units (e.g., chip multiprocessors), which shift the major cause of inefficiency from processors to memory, and (2) the emergence of data-intensive applications, which demands a large capacity of main memory and an excessive amount of memory bandwidth to efficiently handle such workloads. In order to address this memory wall challenge, this dissertation aims at exploring the potential of emerging memory technologies and designing a high-performance, energy-efficient memory hierarchy that is aware of and leverages the characteristics of such new memory technologies. The first part of this dissertation focuses on energy-efficient on-chip cache design based on a new non-volatile memory technology called Spin-Transfer Torque RAM (STT-RAM). When STT-RAM is used to build on-chip caches, it provides several advantages over conventional charge-based memory (e.g., SRAM or eDRAM), such as non-volatility, lower static power, and higher density. However, simply replacing SRAM caches with STT-RAM rather increases the energy consumption because write operations of STT-RAM are slower and more energy-consuming than those of SRAM. To address this challenge, we propose four novel architectural techniques that can alleviate the impact of inefficient STT-RAM write operations on system performance and energy consumption. First, we apply STT-RAM to instruction caches (where write operations are relatively infrequent) and devise a power-gating mechanism called LASIC, which leverages the non-volatility of STT-RAM to turn off STT-RAM instruction caches inside small loops. Second, we propose lower-bits cache, which exploits the narrow bit-width characteristics of application data by caching frequent bit-flips at lower bits in a small SRAM cache. Third, we present prediction hybrid cache, an SRAM/STT-RAM hybrid cache whose block placement between SRAM and STT-RAM is determined by predicting the write intensity of each cache block with a new hardware structure called write intensity predictor. Fourth, we propose DASCA, which predicts write operations that can bypass the cache without incurring extra cache misses (called dead writes) and lets the last-level cache bypass such dead writes to reduce write energy consumption. The second part of this dissertation architects intelligent main memory and its host architecture support based on logic-enabled DRAM. Traditionally, main memory has served the sole purpose of storing data because the extra manufacturing cost of implementing rich functionality (e.g., computation) on a DRAM die was unacceptably high. However, the advent of 3D die stacking now provides a practical, cost-effective way to integrate complex logic circuits into main memory, thereby opening up the possibilities for intelligent main memory. For example, it can be utilized to implement advanced memory management features (e.g., scheduling, power management, etc.) inside memoryit can be also used to offload computation to main memory, which allows us to overcome the memory bandwidth bottleneck caused by narrow off-chip channels (commonly known as processing-in-memory or PIM). The remaining questions are what to implement inside main memory and how to integrate and expose such new features to existing systems. In order to answer these questions, we propose four system designs that utilize logic-enabled DRAM to improve system performance and energy efficiency. First, we utilize the existing logic layer of a Hybrid Memory Cube (a commercial logic-enabled DRAM product) to (1) dynamically turn off some of its off-chip links by monitoring the actual bandwidth demand and (2) integrate prefetch buffer into main memory to perform aggressive prefetching without consuming off-chip link bandwidth. Second, we propose a scalable accelerator for large-scale graph processing called Tesseract, in which graph processing computation is offloaded to specialized processors inside main memory in order to achieve memory-capacity-proportional performance. Third, we design a low-overhead PIM architecture for near-term adoption called PIM-enabled instructions, where PIM operations are interfaced as cache-coherent, virtually-addressed host processor instructions that can be executed either by the host processor or in main memory depending on the data locality. Fourth, we propose an energy-efficient PIM system called aggregation-in-memory, which can adaptively execute PIM operations at any level of the memory hierarchy and provides a fully automated compiler toolchain that transforms existing applications to use PIM operations without programmer intervention.Chapter 1 Introduction 1 1.1 Inefficiencies in the Current Memory Systems 2 1.1.1 On-Chip Caches 2 1.1.2 Main Memory 2 1.2 New Memory Technologies: Opportunities and Challenges 3 1.2.1 Energy-Efficient On-Chip Caches based on STT-RAM 3 1.2.2 Intelligent Main Memory based on Logic-Enabled DRAM 6 1.3 Dissertation Overview 9 Chapter 2 Previous Work 11 2.1 Energy-Efficient On-Chip Caches based on STT-RAM 11 2.1.1 Hybrid Caches 11 2.1.2 Volatile STT-RAM 13 2.1.3 Redundant Write Elimination 14 2.2 Intelligent Main Memory based on Logic-Enabled DRAM 15 2.2.1 PIM Architectures in the 1990s 15 2.2.2 Modern PIM Architectures based on 3D Stacking 15 2.2.3 Modern PIM Architectures on Memory Dies 17 Chapter 3 Loop-Aware Sleepy Instruction Cache 19 3.1 Architecture 20 3.1.1 Loop Cache 21 3.1.2 Loop-Aware Sleep Controller 22 3.2 Evaluation and Discussion 24 3.2.1 Simulation Environment 24 3.2.2 Energy 25 3.2.3 Performance 27 3.2.4 Sensitivity Analysis 27 3.3 Summary 28 Chapter 4 Lower-Bits Cache 29 4.1 Architecture 29 4.2 Experiments 32 4.2.1 Simulator and Cache Model 32 4.2.2 Results 33 4.3 Summary 34 Chapter 5 Prediction Hybrid Cache 35 5.1 Problem and Motivation 37 5.1.1 Problem Definition 37 5.1.2 Motivation 37 5.2 Write Intensity Predictor 38 5.2.1 Keeping Track of Trigger Instructions 39 5.2.2 Identifying Hot Trigger Instructions 40 5.2.3 Dynamic Set Sampling 41 5.2.4 Summary 42 5.3 Prediction Hybrid Cache 43 5.3.1 Need for Write Intensity Prediction 43 5.3.2 Organization 43 5.3.3 Operations 44 5.3.4 Dynamic Threshold Adjustment 45 5.4 Evaluation Methodology 48 5.4.1 Simulator Configuration 48 5.4.2 Workloads 50 5.5 Single-Core Evaluations 51 5.5.1 Energy Consumption and Speedup 51 5.5.2 Energy Breakdown 53 5.5.3 Coverage and Accuracy 54 5.5.4 Sensitivity to Write Intensity Threshold 55 5.5.5 Impact of Dynamic Set Sampling 55 5.5.6 Results for Non-Write-Intensive Workloads 56 5.6 Multicore Evaluations 57 5.7 Summary 59 Chapter 6 Dead Write Prediction Assisted STT-RAM Cache 61 6.1 Motivation 62 6.1.1 Energy Impact of Inefficient Write Operations 62 6.1.2 Limitations of Existing Approaches 63 6.1.3 Potential of Dead Writes 64 6.2 Dead Write Classification 65 6.2.1 Dead-on-Arrival Fills 65 6.2.2 Dead-Value Fills 66 6.2.3 Closing Writes 66 6.2.4 Decomposition 67 6.3 Dead Write Prediction Assisted STT-RAM Cache Architecture 68 6.3.1 Dead Write Prediction 68 6.3.2 Bidirectional Bypass 71 6.4 Evaluation Methodology 72 6.4.1 Simulation Configuration 72 6.4.2 Workloads 74 6.5 Evaluation for Single-Core Systems 75 6.5.1 Energy Consumption and Speedup 75 6.5.2 Coverage and Accuracy 78 6.5.3 Sensitivity to Signature 78 6.5.4 Sensitivity to Update Policy 80 6.5.5 Implications of Device-/Circuit-Level Techniques for Write Energy Reduction 80 6.5.6 Impact of Prefetching 80 6.6 Evaluation for Multi-Core Systems 81 6.6.1 Energy Consumption and Speedup 81 6.6.2 Application to Inclusive Caches 83 6.6.3 Application to Three-Level Cache Hierarchy 84 6.7 Summary 85 Chapter 7 Link Power Management for Hybrid Memory Cubes 87 7.1 Background and Motivation 88 7.1.1 Hybrid Memory Cube 88 7.1.2 Motivation 89 7.2 HMC Link Power Management 91 7.2.1 Link Delay Monitor 91 7.2.2 Power State Transition 94 7.2.3 Overhead 95 7.3 Two-Level Prefetching 95 7.4 Application to Multi-HMC Systems 97 7.5 Experiments 98 7.5.1 Methodology 98 7.5.2 Link Energy Consumption and Speedup 100 7.5.3 HMC Energy Consumption 102 7.5.4 Runtime Behavior of LPM 102 7.5.5 Sensitivity to Slowdown Threshold 104 7.5.6 LPM without Prefetching 104 7.5.7 Impact of Prefetching on Link Traffic 105 7.5.8 On-Chip Prefetcher Aggressiveness in 2LP 107 7.5.9 Tighter Off-Chip Bandwidth Margin 107 7.5.10 Multithreaded Workloads 108 7.5.11 Multi-HMC Systems 109 7.6 Summary 111 Chapter 8 Tesseract PIM System for Parallel Graph Processing 113 8.1 Background and Motivation 115 8.1.1 Large-Scale Graph Processing 115 8.1.2 Graph Processing on Conventional Systems 117 8.1.3 Processing-in-Memory 118 8.2 Tesseract Architecture 119 8.2.1 Overview 119 8.2.2 Remote Function Call via Message Passing 122 8.2.3 Prefetching 124 8.2.4 Programming Interface 126 8.2.5 Application Mapping 127 8.3 Evaluation Methodology 128 8.3.1 Simulation Configuration 128 8.3.2 Workloads 129 8.4 Evaluation Results 130 8.4.1 Performance 130 8.4.2 Iso-Bandwidth Comparison 133 8.4.3 Execution Time Breakdown 134 8.4.4 Prefetch Efficiency 134 8.4.5 Scalability 135 8.4.6 Effect of Higher Off-Chip Network Bandwidth 136 8.4.7 Effect of Better Graph Distribution 137 8.4.8 Energy/Power Consumption and Thermal Analysis 138 8.5 Summary 139 Chapter 9 PIM-Enabled Instructions 141 9.1 Potential of ISA Extensions as the PIM Interface 143 9.2 PIM Abstraction 145 9.2.1 Operations 145 9.2.2 Memory Model 147 9.2.3 Software Modification 148 9.3 Architecture 148 9.3.1 Overview 148 9.3.2 PEI Computation Unit (PCU) 149 9.3.3 PEI Management Unit (PMU) 150 9.3.4 Virtual Memory Support 153 9.3.5 PEI Execution 153 9.3.6 Comparison with Active Memory Operations 154 9.4 Target Applications for Case Study 155 9.4.1 Large-Scale Graph Processing 155 9.4.2 In-Memory Data Analytics 156 9.4.3 Machine Learning and Data Mining 157 9.4.4 Operation Summary 157 9.5 Evaluation Methodology 158 9.5.1 Simulation Configuration 158 9.5.2 Workloads 159 9.6 Evaluation Results 159 9.6.1 Performance 160 9.6.2 Sensitivity to Input Size 163 9.6.3 Multiprogrammed Workloads 164 9.6.4 Balanced Dispatch: Idea and Evaluation 165 9.6.5 Design Space Exploration for PCUs 165 9.6.6 Performance Overhead of the PMU 167 9.6.7 Energy, Area, and Thermal Issues 167 9.7 Summary 168 Chapter 10 Aggregation-in-Memory 171 10.1 Motivation 173 10.1.1 Rethinking PIM for Energy Efficiency 173 10.1.2 Aggregation as PIM Operations 174 10.2 Architecture 176 10.2.1 Overview 176 10.2.2 Programming Model 177 10.2.3 On-Chip Caches 177 10.2.4 Coherence and Consistency 181 10.2.5 Main Memory 181 10.2.6 Potential Generalization Opportunities 183 10.3 Compiler Support 184 10.4 Contributions over Prior Art 185 10.4.1 PIM-Enabled Instructions 185 10.4.2 Parallel Reduction in Caches 187 10.4.3 Row Buffer Locality of DRAM Writes 188 10.5 Target Applications 188 10.6 Evaluation Methodology 190 10.6.1 Simulation Configuration 190 10.6.2 Hardware Overhead 191 10.6.3 Workloads 192 10.7 Evaluation Results 192 10.7.1 Energy Consumption and Performance 192 10.7.2 Dynamic Energy Breakdown 196 10.7.3 Comparison with Aggressive Writeback 197 10.7.4 Multiprogrammed Workloads 198 10.7.5 Comparison with Intrinsic-based Code 198 10.8 Summary 199 Chapter 11 Conclusion 201 11.1 Energy-Efficient On-Chip Caches based on STT-RAM 202 11.2 Intelligent Main Memory based on Logic-Enabled DRAM 203 Bibliography 205 요약 227Docto