Secure Mutual Testing Strategy for Cryptographic SoCs

This article presents a secure mutual testing strategy for System-on-Chips (SoCs) that implement cryptographic functionalities. Such approach eliminates the need for an additional trusted component that is used to test security sensitive cores in a SoC, like symmetric and public-key cryptographic modules. We combine two test approaches: Logic Built In Self Test (BIST) and secure scan-chain based testing and develop a strategy that preserves the test quality of the standard test methods, enhancing security of the testing scheme. In order to minimize the area overhead of the presented solution, we re-use the existing modules in different manners: a public-key cryptographic core to build the BIST infrastructure and a symmetric one to authenticate a device under test to a test server, thus preventing an unauthorized user from accessing the test interface. By doing so, we achieve both testability and security at the minimal cost

Design-for-Security vs. Design-for-Testability: A Case Study on DFT Chain in Cryptographic Circuits

Abstract-Relying on a recently developed gate-level information assurance scheme, we formally analyze the security of design-for-test (DFT) scan chains, the industrial standard testing methods for fabricated chips and, for the first time, formally prove that a circuit with scan chain inserted can violate security properties. The same security assessment method is then applied to a built-in-self-test (BIST) structure where it is shown that even BIST structures can cause security vulnerabilities. To balance trustworthiness and testability, a new design-for-security (DFS) methodology is proposed which, through the modification of scan chain structure, can achieve high security without compromising the testability of the inserted scan structure. To support the task of secure scan chain insertion, a method of scan chain reshuffling is introduced. Using an AES encryption core as the testing platform, we elaborated the security assessment procedure as well as the DFS technique in balancing security and testability of cryptographic circuits

A Survey on Security Threats and Countermeasures in IEEE Test Standards

International audienceEditor's note: Test infrastructure has been shown to be a portal for hackers. This article reviews the threats and countermeasures for IEEE test infrastructure standards

SCAN CHAIN BASED HARDWARE SECURITY

Hardware has become a popular target for attackers to hack into any computing and communication system. Starting from the legendary power analysis attacks discovered 20 years ago to the recent Intel Spectre and Meltdown attacks, security vulnerabilities in hardware design have been exploited for malicious purposes. With the emerging Internet of Things (IoT) applications, where the IoT devices are extremely resource constrained, many proven secure but computational expensive cryptography protocols cannot be applied on such devices. Thus there is an urgent need to understand the hardware vulnerabilities and develop cost effective mitigation methods. One established field in the semiconductor and integrated circuit (IC) industry, known as IC test, has the goal of ensuring that fabricated ICs are free of manufacturing defects and perform the required functionalities. Testing is essential to isolate faulty chips from good ones. The concept of design for test (DFT) has been integrated in the commercial IC design and fabrication process for several decades. Scan chain, which provides test engineer access to all the flip flops in the chip through the scan in (SI) and scan out (SO) ports, is the backbone of industrial testing methods and can be found in almost all the modern designs. In addition to IC testing, scan chain has found applications in intellectual property (IP) protection and IC identification. However, attackers can also leverage the controllability and observability of scan chain as a side channel to break systems such as cryptographic chips. This dissertation addresses these two important security problems by proposing (1) a practical scan chain based security primitive for IP protection and (2) a partial scan chain framework that can mitigate all the existing scan based attacks. First, we observe the fact that each D-flip-flop has two output ports, Q and Q’, designed to simplify the logic and has been used to reduce the power consumption for IC test. The availability of both Q and Q’ ports provide the opportunity for IP protection. More specifically, we can generate a digital fingerprint by selecting different connection styles between adjacent scan cells during the design of scan chain. This method has two major advantages: fingerprints are created as a post-silicon procedure and therefore there will be little fabrication overhead; altering the connection style requires the modification of test vectors for each fingerprinted IP and thus enables a non-intrusive fingerprint verification method. This addresses the overhead and detectability problems, two of the most challenging problems of designing practical IP fingerprinting techniques in the past two decades. Combined with the recently developed reconfigurable scan networks (RSNs) that are popular for embedded and IoT devices, we design an IC identification (ID) scheme utilizing the different connection styles. We perform experiments on standard benchmarks to demonstrate that our approach has low design overhead. We also conduct security analysis to show that such fingerprints and IC IDs are robust against various attacks. In the second part of this dissertation, we consider the scan chain side channel attack, which has been reported as one of the most severe side channel attacks to modern secure systems. We argue that the current countermeasures are restricted to the requirement of providing direct SI and SO for testing and thus suffers the vulnerability of leaving this side channel open to the attackers as well. Therefore, we propose a novel public-private partial scan chain based approach with the basic idea of removing the flip flops that store sensitive information from the scan chain. This will eliminate the scan chain side channel, but it also limits IC test. The key contribution in our proposed public-private partial scan chain design is that it can keep the full test coverage while providing security to the scan chain. This is achieved by chaining the removed flip flops into one or more private partial scan chains and adding protections to the SI and SO ports of such chains. Unlike the traditional partial scan design which not only fails to provide full fault coverage, but also incur huge overhead in test time and test vector generation time, we propose a set of techniques to ensure that the desired test vectors can be entered into the system efficiently. These techniques include test vector reordering, test vector reusing, and test vector generation based on a novel finite state machine (FSM) structure we have invented. On the other hand, to enable the test engineers the ability to observe the test output to diagnose the chip while not leaking information to the attackers, we propose two lightweight mechanisms, one based on linear feedback shift register (LFSR) and the other one based on configurable physical unclonable function (PUF). Finally, we discuss a protocol on how in-field test can be realized using our public-private partial scan chain. We conduct experiments with industrial scan design tools to demonstrate that the required hardware in our approach has negligible area overhead and gives full test coverage with reduced test time and does not need to re-generate test vectors. In sum, this dissertation focuses on the role of scan chain, a conventional design for test facility, in hardware security. We show that scan chain features can be leveraged to create practical IP protection techniques including IP watermarking and fingerprinting as well as IC identification and authentication. We also propose a novel public-private partial scan design principle to close the scan chain side channel to the attackers. Through this dissertation work, we demonstrate that it is possible to develop highly practical scan chain based techniques that can benefit both the community of IC test and hardware security

Conception et test des circuits et systèmes numériques à haute fiabilité et sécurité

Research activities I carried on after my nomination as Chargé de Recherche deal with the definition of methodologies and tools for the design, the test and the reliability of secure digital circuits and trustworthy manufacturing. More recently, we have started a new research activity on the test of 3D stacked Integrated CIrcuits, based on the use of Through Silicon Vias. Moreover, thanks to the relationships I have maintained after my post-doc in Italy, I have kept on cooperating with Politecnico di Torino on the topics related to test and reliability of memories and microprocessors.Secure and Trusted DevicesSecurity is a critical part of information and communication technologies and it is the necessary basis for obtaining confidentiality, authentication, and integrity of data. The importance of security is confirmed by the extremely high growth of the smart-card market in the last 20 years. It is reported in "Le monde Informatique" in the article "Computer Crime and Security Survey" in 2007 that financial losses due to attacks on "secure objects" in the digital world are greater than $11 Billions. Since the race among developers of these secure devices and attackers accelerates, also due to the heterogeneity of new systems and their number, the improvement of the resistance of such components becomes today’s major challenge.Concerning all the possible security threats, the vulnerability of electronic devices that implement cryptography functions (including smart cards, electronic passports) has become the Achille’s heel in the last decade. Indeed, even though recent crypto-algorithms have been proven resistant to cryptanalysis, certain fraudulent manipulations on the hardware implementing such algorithms can allow extracting confidential information. So-called Side-Channel Attacks have been the first type of attacks that target the physical device. They are based on information gathered from the physical implementation of a cryptosystem. For instance, by correlating the power consumed and the data manipulated by the device, it is possible to discover the secret encryption key. Nevertheless, this point is widely addressed and integrated circuit (IC) manufacturers have already developed different kinds of countermeasures.More recently, new threats have menaced secure devices and the security of the manufacturing process. A first issue is the trustworthiness of the manufacturing process. From one side, secure devices must assure a very high production quality in order not to leak confidential information due to a malfunctioning of the device. Therefore, possible defects due to manufacturing imperfections must be detected. This requires high-quality test procedures that rely on the use of test features that increases the controllability and the observability of inner points of the circuit. Unfortunately, this is harmful from a security point of view, and therefore the access to these test features must be protected from unauthorized users. Another harm is related to the possibility for an untrusted manufacturer to do malicious alterations to the design (for instance to bypass or to disable the security fence of the system). Nowadays, many steps of the production cycle of a circuit are outsourced. For economic reasons, the manufacturing process is often carried out by foundries located in foreign countries. The threat brought by so-called Hardware Trojan Horses, which was long considered theoretical, begins to materialize.A second issue is the hazard of faults that can appear during the circuit’s lifetime and that may affect the circuit behavior by way of soft errors or deliberate manipulations, called Fault Attacks. They can be based on the intentional modification of the circuit’s environment (e.g., applying extreme temperature, exposing the IC to radiation, X-rays, ultra-violet or visible light, or tampering with clock frequency) in such a way that the function implemented by the device generates an erroneous result. The attacker can discover secret information by comparing the erroneous result with the correct one. In-the-field detection of any failing behavior is therefore of prime interest for taking further action, such as discontinuing operation or triggering an alarm. In addition, today’s smart cards use 90nm technology and according to the various suppliers of chip, 65nm technology will be effective on the horizon 2013-2014. Since the energy required to force a transistor to switch is reduced for these new technologies, next-generation secure systems will become even more sensitive to various classes of fault attacks.Based on these considerations, within the group I work with, we have proposed new methods, architectures and tools to solve the following problems:• Test of secure devices: unfortunately, classical techniques for digital circuit testing cannot be easily used in this context. Indeed, classical testing solutions are based on the use of Design-For-Testability techniques that add hardware components to the circuit, aiming to provide full controllability and observability of internal states. Because crypto‐ processors and others cores in a secure system must pass through high‐quality test procedures to ensure that data are correctly processed, testing of crypto chips faces a dilemma. In fact design‐for‐testability schemes want to provide high controllability and observability of the device while security wants minimal controllability and observability in order to hide the secret. We have therefore proposed, form one side, the use of enhanced scan-based test techniques that exploit compaction schemes to reduce the observability of internal information while preserving the high level of testability. From the other side, we have proposed the use of Built-In Self-Test for such devices in order to avoid scan chain based test.• Reliability of secure devices: we proposed an on-line self-test architecture for hardware implementation of the Advanced Encryption Standard (AES). The solution exploits the inherent spatial replications of a parallel architecture for implementing functional redundancy at low cost.• Fault Attacks: one of the most powerful types of attack for secure devices is based on the intentional injection of faults (for instance by using a laser beam) into the system while an encryption occurs. By comparing the outputs of the circuits with and without the injection of the fault, it is possible to identify the secret key. To face this problem we have analyzed how to use error detection and correction codes as counter measure against this type of attack, and we have proposed a new code-based architecture. Moreover, we have proposed a bulk built-in current-sensor that allows detecting the presence of undesired current in the substrate of the CMOS device.• Fault simulation: to evaluate the effectiveness of countermeasures against fault attacks, we developed an open source fault simulator able to perform fault simulation for the most classical fault models as well as user-defined electrical level fault models, to accurately model the effect of laser injections on CMOS circuits.• Side-Channel attacks: they exploit physical data-related information leaking from the device (e.g. current consumption or electro-magnetic emission). One of the most intensively studied attacks is the Differential Power Analysis (DPA) that relies on the observation of the chip power fluctuations during data processing. I studied this type of attack in order to evaluate the influence of the countermeasures against fault attack on the power consumption of the device. Indeed, the introduction of countermeasures for one type of attack could lead to the insertion of some circuitry whose power consumption is related to the secret key, thus allowing another type of attack more easily. We have developed a flexible integrated simulation-based environment that allows validating a digital circuit when the device is attacked by means of this attack. All architectures we designed have been validated through this tool. Moreover, we developed a methodology that allows to drastically reduce the time required to validate countermeasures against this type of attack.TSV- based 3D Stacked Integrated Circuits TestThe stacking process of integrated circuits using TSVs (Through Silicon Via) is a promising technology that keeps the development of the integration more than Moore’s law, where TSVs enable to tightly integrate various dies in a 3D fashion. Nevertheless, 3D integrated circuits present many test challenges including the test at different levels of the 3D fabrication process: pre-, mid-, and post- bond tests. Pre-bond test targets the individual dies at wafer level, by testing not only classical logic (digital logic, IOs, RAM, etc) but also unbounded TSVs. Mid-bond test targets the test of partially assembled 3D stacks, whereas finally post-bond test targets the final circuit.The activities carried out within this topic cover 2 main issues:• Pre-bond test of TSVs: the electrical model of a TSV buried within the substrate of a CMOS circuit is a capacitance connected to ground (when the substrate is connected to ground). The main assumption is that a defect may affect the value of that capacitance. By measuring the variation of the capacitance’s value it is possible to check whether the TSV is correctly fabricated or not. We have proposed a method to measure the value of the capacitance based on the charge/ discharge delay of the RC network containing the TSV.• Test infrastructures for 3D stacked Integrated Circuits: testing a die before stacking to another die introduces the problem of a dynamic test infrastructure, where test data must be routed to a specific die based on the reached fabrication step. New solutions are proposed in literature that allow reconfiguring the test paths within the circuit, based on on-the-fly requirements. We have started working on an extension of the IEEE P1687 test standard that makes use of an automatic die-detection based on pull-up resistors.Memory and Microprocessor Test and ReliabilityThanks to device shrinking and miniaturization of fabrication technology, performances of microprocessors and of memories have grown of more than 5 magnitude order in the last 30 years. With this technology trend, it is necessary to face new problems and challenges, such as reliability, transient errors, variability and aging.In the last five years I’ve worked in cooperation with the Testgroup of Politecnico di Torino (Italy) to propose a new method to on-line validate the correctness of the program execution of a microprocessor. The main idea is to monitor a small set of control signals of the processors in order to identify incorrect activation sequences. This approach can detect both permanent and transient errors of the internal logic of the processor.Concerning the test of memories, we have proposed a new approach to automatically generate test programs starting from a functional description of the possible faults in the memory.Moreover, we proposed a new methodology, based on microprocessor error probability profiling, that aims at estimating fault injection results without the need of a typical fault injection setup. The proposed methodology is based on two main ideas: a one-time fault-injection analysis of the microprocessor architecture to characterize the probability of successful execution of each of its instructions in presence of a soft-error, and a static and very fast analysis of the control and data flow of the target software application to compute its probability of success

Multiple bit error correcting architectures over finite fields

This thesis proposes techniques to mitigate multiple bit errors in GF arithmetic circuits. As GF arithmetic circuits such as multipliers constitute the complex and important functional unit of a crypto-processor, making them fault tolerant will improve the reliability of circuits that are employed in safety applications and the errors may cause catastrophe if not mitigated. Firstly, a thorough literature review has been carried out. The merits of efficient schemes are carefully analyzed to study the space for improvement in error correction, area and power consumption. Proposed error correction schemes include bit parallel ones using optimized BCH codes that are useful in applications where power and area are not prime concerns. The scheme is also extended to dynamically correcting scheme to reduce decoder delay. Other method that suits low power and area applications such as RFIDs and smart cards using cross parity codes is also proposed. The experimental evaluation shows that the proposed techniques can mitigate single and multiple bit errors with wider error coverage compared to existing methods with lesser area and power consumption. The proposed scheme is used to mask the errors appearing at the output of the circuit irrespective of their cause. This thesis also investigates the error mitigation schemes in emerging technologies (QCA, CNTFET) to compare area, power and delay with existing CMOS equivalent. Though the proposed novel multiple error correcting techniques can not ensure 100% error mitigation, inclusion of these techniques to actual design can improve the reliability of the circuits or increase the difficulty in hacking crypto-devices. Proposed schemes can also be extended to non GF digital circuits

Европейский и национальный контексты в научных исследованиях

В настоящем электронном сборнике «Европейский и национальный контексты в научных исследованиях. Технология» представлены работы молодых ученых по геодезии и картографии, химической технологии и машиностроению, информационным технологиям, строительству и радиотехнике. Предназначены для работников образования, науки и производства. Будут полезны студентам, магистрантам и аспирантам университетов.=In this Electronic collected materials “National and European dimension in research. Technology” works in the fields of geodesy, chemical technology, mechanical engineering, information technology, civil engineering, and radio-engineering are presented. It is intended for trainers, researchers and professionals. It can be useful for university graduate and post-graduate students

The NASA computer science research program plan

A taxonomy of computer science is included, one state of the art of each of the major computer science categories is summarized. A functional breakdown of NASA programs under Aeronautics R and D, space R and T, and institutional support is also included. These areas were assessed against the computer science categories. Concurrent processing, highly reliable computing, and information management are identified