Efficient Test Compaction for Pseudo-Random Testing

Compact set of 3-valued test vectors for random pattern resistant faults are covered in multiple test passes. During a pass, its associated test cube specifies certain bits in the scan chain to be held fixed and others to change pseudo-randomly. We propose an algorithm to find a small number of cubes to cover all the test vectors, thus minimizing total test length. The test-cube finding algorithm repeatedly evaluates small perturbations of the current solution so as to maximize the expected test coverage of the cube. Experimental results show that our algorithm covers the test vectors by test cubes that are one to two orders of magnitude smaller in number with a much smaller increase in the percentage of specified bits. It outperforms comparable schemes reported in the literature

Transition Faults and Transition Path Delay Faults: Test Generation, Path Selection, and Built-In Generation of Functional Broadside Tests

As the clock frequency and complexity of digital integrated circuits increase rapidly, delay testing is indispensable to guarantee the correct timing behavior of the circuits. In this dissertation, we describe methods developed for three aspects of delay testing in scan-based circuits: test generation, path selection and built-in test generation. We first describe a deterministic broadside test generation procedure for a path delay fault model named the transition path delay fault model, which captures both large and small delay defects. Under this fault model, a path delay fault is detected only if all the individual transition faults along the path are detected by the same test. To reduce the complexity of test generation, sub-procedures with low complexity are applied before a complete branch-and-bound procedure. Next, we describe a method based on static timing analysis to select critical paths for test generation. Logic conditions that are necessary for detecting a path delay fault are considered to refine the accuracy of static timing analysis, using input necessary assignments. Input necessary assignments are input values that must be assigned to detect a fault. The method calculates more accurate path delays, selects paths that are critical during test application, and identifies undetectable path delay faults. These two methods are applicable to off-line test generation. For large circuits with high complexity and frequency, built-in test generation is a cost-effective method for delay testing. For a circuit that is embedded in a larger design, we developed a method for built-in generation of functional broadside tests to avoid excessive power dissipation during test application and the overtesting of delay faults, taking the functional constraints on the primary input sequences of the circuit into consideration. Functional broadside tests are scan-based two-pattern tests for delay faults that create functional operation conditions during test application. To avoid the potential fault coverage loss due to the exclusive use of functional broadside tests, we also developed an optional DFT method based on state holding to improve fault coverage. High delay fault coverage can be achieved by the developed method for benchmark circuits using simple hardware

Built-In Self Test (BIST) for Realistic Delay Defects

Testing of delay defects is necessary in deep submicron (DSM) technologies. High coverage delay tests produced by automatic test pattern generation (ATPG) can be applied during wafer and package tests, but are difficult to apply during the board test, due to limited chip access. Delay testing at the board level is increasingly important to diagnose failures caused by supply noise or temperature in the board environment. An alternative to ATPG is the built-in self test (BIST). In combination with the insertion of test points, BIST is able to achieve high coverage of stuck-at and transition faults. The quality of BIST patterns on small delay defects is an open question. In this work we analyze the application of BIST to small delay defects using resistive short and open models in order to estimate the coverage and correlate the coverage to traditional delay fault models

Fault and Defect Tolerant Computer Architectures: Reliable Computing With Unreliable Devices

This research addresses design of a reliable computer from unreliable device technologies. A system architecture is developed for a fault and defect tolerant (FDT) computer. Trade-offs between different techniques are studied and yield and hardware cost models are developed. Fault and defect tolerant designs are created for the processor and the cache memory. Simulation results for the content-addressable memory (CAM)-based cache show 90% yield with device failure probabilities of 3 x 10(-6), three orders of magnitude better than non fault tolerant caches of the same size. The entire processor achieves 70% yield with device failure probabilities exceeding 10(-6). The required hardware redundancy is approximately 15 times that of a non-fault tolerant design. While larger than current FT designs, this architecture allows the use of devices much more likely to fail than silicon CMOS. As part of model development, an improved model is derived for NAND Multiplexing. The model is the first accurate model for small and medium amounts of redundancy. Previous models are extended to account for dependence between the inputs and produce more accurate results

An Adaptive Modular Redundancy Technique to Self-regulate Availability, Area, and Energy Consumption in Mission-critical Applications

As reconfigurable devices\u27 capacities and the complexity of applications that use them increase, the need for self-reliance of deployed systems becomes increasingly prominent. A Sustainable Modular Adaptive Redundancy Technique (SMART) composed of a dual-layered organic system is proposed, analyzed, implemented, and experimentally evaluated. SMART relies upon a variety of self-regulating properties to control availability, energy consumption, and area used, in dynamically-changing environments that require high degree of adaptation. The hardware layer is implemented on a Xilinx Virtex-4 Field Programmable Gate Array (FPGA) to provide self-repair using a novel approach called a Reconfigurable Adaptive Redundancy System (RARS). The software layer supervises the organic activities within the FPGA and extends the self-healing capabilities through application-independent, intrinsic, evolutionary repair techniques to leverage the benefits of dynamic Partial Reconfiguration (PR). A SMART prototype is evaluated using a Sobel edge detection application. This prototype is shown to provide sustainability for stressful occurrences of transient and permanent fault injection procedures while still reducing energy consumption and area requirements. An Organic Genetic Algorithm (OGA) technique is shown capable of consistently repairing hard faults while maintaining correct edge detector outputs, by exploiting spatial redundancy in the reconfigurable hardware. A Monte Carlo driven Continuous Markov Time Chains (CTMC) simulation is conducted to compare SMART\u27s availability to industry-standard Triple Modular Technique (TMR) techniques. Based on nine use cases, parameterized with realistic fault and repair rates acquired from publically available sources, the results indicate that availability is significantly enhanced by the adoption of fast repair techniques targeting aging-related hard-faults. Under harsh environments, SMART is shown to improve system availability from 36.02% with lengthy repair techniques to 98.84% with fast ones. This value increases to five nines (99.9998%) under relatively more favorable conditions. Lastly, SMART is compared to twenty eight standard TMR benchmarks that are generated by the widely-accepted BL-TMR tools. Results show that in seven out of nine use cases, SMART is the recommended technique, with power savings ranging from 22% to 29%, and area savings ranging from 17% to 24%, while still maintaining the same level of availability

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

SCAN CHAIN BASED HARDWARE SECURITY

Hardware has become a popular target for attackers to hack into any computing and communication system. Starting from the legendary power analysis attacks discovered 20 years ago to the recent Intel Spectre and Meltdown attacks, security vulnerabilities in hardware design have been exploited for malicious purposes. With the emerging Internet of Things (IoT) applications, where the IoT devices are extremely resource constrained, many proven secure but computational expensive cryptography protocols cannot be applied on such devices. Thus there is an urgent need to understand the hardware vulnerabilities and develop cost effective mitigation methods. One established field in the semiconductor and integrated circuit (IC) industry, known as IC test, has the goal of ensuring that fabricated ICs are free of manufacturing defects and perform the required functionalities. Testing is essential to isolate faulty chips from good ones. The concept of design for test (DFT) has been integrated in the commercial IC design and fabrication process for several decades. Scan chain, which provides test engineer access to all the flip flops in the chip through the scan in (SI) and scan out (SO) ports, is the backbone of industrial testing methods and can be found in almost all the modern designs. In addition to IC testing, scan chain has found applications in intellectual property (IP) protection and IC identification. However, attackers can also leverage the controllability and observability of scan chain as a side channel to break systems such as cryptographic chips. This dissertation addresses these two important security problems by proposing (1) a practical scan chain based security primitive for IP protection and (2) a partial scan chain framework that can mitigate all the existing scan based attacks. First, we observe the fact that each D-flip-flop has two output ports, Q and Q’, designed to simplify the logic and has been used to reduce the power consumption for IC test. The availability of both Q and Q’ ports provide the opportunity for IP protection. More specifically, we can generate a digital fingerprint by selecting different connection styles between adjacent scan cells during the design of scan chain. This method has two major advantages: fingerprints are created as a post-silicon procedure and therefore there will be little fabrication overhead; altering the connection style requires the modification of test vectors for each fingerprinted IP and thus enables a non-intrusive fingerprint verification method. This addresses the overhead and detectability problems, two of the most challenging problems of designing practical IP fingerprinting techniques in the past two decades. Combined with the recently developed reconfigurable scan networks (RSNs) that are popular for embedded and IoT devices, we design an IC identification (ID) scheme utilizing the different connection styles. We perform experiments on standard benchmarks to demonstrate that our approach has low design overhead. We also conduct security analysis to show that such fingerprints and IC IDs are robust against various attacks. In the second part of this dissertation, we consider the scan chain side channel attack, which has been reported as one of the most severe side channel attacks to modern secure systems. We argue that the current countermeasures are restricted to the requirement of providing direct SI and SO for testing and thus suffers the vulnerability of leaving this side channel open to the attackers as well. Therefore, we propose a novel public-private partial scan chain based approach with the basic idea of removing the flip flops that store sensitive information from the scan chain. This will eliminate the scan chain side channel, but it also limits IC test. The key contribution in our proposed public-private partial scan chain design is that it can keep the full test coverage while providing security to the scan chain. This is achieved by chaining the removed flip flops into one or more private partial scan chains and adding protections to the SI and SO ports of such chains. Unlike the traditional partial scan design which not only fails to provide full fault coverage, but also incur huge overhead in test time and test vector generation time, we propose a set of techniques to ensure that the desired test vectors can be entered into the system efficiently. These techniques include test vector reordering, test vector reusing, and test vector generation based on a novel finite state machine (FSM) structure we have invented. On the other hand, to enable the test engineers the ability to observe the test output to diagnose the chip while not leaking information to the attackers, we propose two lightweight mechanisms, one based on linear feedback shift register (LFSR) and the other one based on configurable physical unclonable function (PUF). Finally, we discuss a protocol on how in-field test can be realized using our public-private partial scan chain. We conduct experiments with industrial scan design tools to demonstrate that the required hardware in our approach has negligible area overhead and gives full test coverage with reduced test time and does not need to re-generate test vectors. In sum, this dissertation focuses on the role of scan chain, a conventional design for test facility, in hardware security. We show that scan chain features can be leveraged to create practical IP protection techniques including IP watermarking and fingerprinting as well as IC identification and authentication. We also propose a novel public-private partial scan design principle to close the scan chain side channel to the attackers. Through this dissertation work, we demonstrate that it is possible to develop highly practical scan chain based techniques that can benefit both the community of IC test and hardware security

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc