High-speed equalization and transmission in electrical interconnections

The relentless growth of data traffic and increasing digital signal processing capabilities of integrated circuits (IC) are demanding ever faster chip-to-chip / chip-to-module serial electrical interconnects. As data rates increase, the signal quality after transmission over printed circuit board (PCB) interconnections is severely impaired. Frequency-dependent loss and crosstalk noise lead to a reduced eye opening, a reduced signal-to-noise ratio and an increased inter-symbol interference (ISI). This, in turn, requires the use of improved signal processing or PCB materials, in order to overcome the bandwidth (BW) limitations and to improve signal integrity. By applying an optimal combination of equalizer and receiver electronics together with BW-efficient modulation schemes, the transmission rate over serial electrical interconnections can be pushed further. At the start of this research, most industrial backplane connectors, meeting the IEEE and OIF specifications such as manufactured by e.g. FCI or TE connectivity, had operational capabilities of up to 25 Gb/s. This research was mainly performed under the IWT ShortTrack project. The goal of this research was to increase the transmission speed over electrical backplanes up to 100 Gb/s per channel for next-generation telecom systems and data centers. This requirement greatly surpassed the state-ofthe-art reported in previous publications, considering e.g. 25 Gb/s duobinary and 42.8 Gb/s PAM-4 transmission over a low-loss Megtron 6 electrical backplane using off-line processing. The successful implementation of the integrated transmitter (TX) and receiver (RX) (1) , clearly shows the feasibility of single lane interconnections beyond 80 Gb/s and opens the potential of realizing industrial 100 Gb/s links using a recent IC technology process. Besides the advancement of the state-of-the-art in the field of high-speed transceivers and backplane transmission systems, which led to several academic publications, the output of this work also attracts a lot of attention from the industry, showing the potential to commercialize the developed chipset and technologies used in this research for various applications: not only in high-speed electrical transmission links, but also in high-speed opto-electronic communications such as access, active optical cables and optical backplanes. In this dissertation, the background of this research, an overview of this work and the thesis organization are illustrated in Chapter 1. In Chapter 2, a system level analysis is presented, showing that the channel losses are limiting the transmission speed over backplanes. In order to enhance the serial data rate over backplanes and to eliminate the signal degradation, several technologies are discussed, such as signal equalization and modulation techniques. First, a prototype backplane channel, from project partner FCI, implemented with improved backplane connectors is characterized. Second, an integrated transversal filter as a feed-forward equalizer (FFE) is selected to perform the signal equalization, based on a comprehensive consideration of the backplane channel performance, equalization capabilities, implementation complexity and overall power consumption. NRZ, duobinary and PAM-4 are the three most common modulation schemes for ultra-high speed electrical backplane communication. After a system-level simulation and comparison, the duobinary format is selected due to its high BW efficiency and reasonable circuit complexity. Last, different IC technology processes are compared and the ST microelectronics BiCMOS9MW process (featuring a fT value of over 200 GHz) is selected, based on a trade-off between speed and chip cost. Meanwhile it also has a benefit for providing an integrated microstrip model, which is utilized for the delay elements of the FFE. Chapter 3 illustrates the chip design of the high-speed backplane TX, consisting of a multiplexer (MUX) and a 5-tap FFE. The 4:1 MUX combines four lower rate streams into a high-speed differential NRZ signal up to 100 Gb/s as the FFE input. The 5-tap FFE is implemented with a novel topology for improved testability, such that the FFE performance can be individually characterized, in both frequency- and time-domain, which also helps to perform the coefficient optimization of the FFE. Different configurations for the gain cell in the FFE are compared. The gilbert configuration shows most advantages, in both a good high-frequency performance and an easy way to implement positive / negative amplification. The total chip, including the MUX and the FFE, consumes 750mW from a 2.5V supply and occupies an area of 4.4mm × 1.4 mm. In Chapter 4, the TX chip is demonstrated up to 84 Gb/s. First, the FFE performance is characterized in the frequency domain, showing that the FFE is able to work up to 84 Gb/s using duobinary formats. Second, the combination of the MUX and the FFE is tested. The equalized TX outputs are captured after different channels, for both NRZ and duobinary signaling at speeds from 64 Gb/s to 84 Gb/s. Then, by applying the duobinary RX 2, a serial electrical transmission link is demonstrated across a pair of 10 cm coax cables and across a 5 cm FX-2 differential stripline. The 5-tap FFE compensates a total loss between the TX and the RX chips of about 13.5 dB at the Nyquist frequency, while the RX receives the equalized signal and decodes the duobinary signal to 4 quarter rate NRZ streams. This shows a chip-to-chip data link with a bit error rate (BER) lower than 10−11. Last, the electrical data transmission between the TX and the RX over two commercial backplanes is demonstrated. An error-free, serial duobinary transmission across a commercial Megtron 6, 11.5 inch backplane is demonstrated at 48 Gb/s, which indicates that duobinary outperforms NRZ for attaining higher speed or longer reach backplane applications. Later on, using an ExaMAX® backplane demonstrator, duobinary transmission performance is verified and the maximum allowed channel loss at 40 Gb/s transmission is explored. The eye diagram and BER measurements over a backplane channel up to 26.25 inch are performed. The results show that at 40 Gb/s, a total channel loss up to 37 dB at the Nyquist frequency allows for error-free duobinary transmission, while a total channel loss of 42 dB was overcome with a BER below 10−8. An overview of the conclusions is summarized in Chapter 5, along with some suggestions for further research in this field. (1) The duobinary receiver was developed by my colleague Timothy De Keulenaer, as described in his PhD dissertation. (2) Described in the PhD dissertation of Timothy De Keulenaer

Design of Low-Power NRZ/PAM-4 Wireline Transmitters

Rapid growing demand for instant multimedia access in a myriad of digital devices has pushed the need for higher bandwidth in modern communication hardwares ranging from short-reach (SR) memory/storage interfaces to long-reach (LR) data center Ethernets. At the same time, comprehensive design optimization of link system that meets the energy-efficiency is required for mobile computing and low operational cost at datacenters. This doctoral study consists of design of two low-swing wireline transmitters featuring a low-power clock distribution and 2-tap equalization in energy-efficient manners up to 20-Gb/s operation. In spite of the reduced signaling power in the voltage-mode (VM) transmit driver, the presence of the segment selection logic still diminishes the power saving benefit. The first work presents a scalable VM transmitter which offers low static power dissipation and adopts an impedance-modulated 2-tap equalizer with analog tap control, thereby obviating driver segmentation and reducing pre-driver complexity and dynamic power. Per-channel quadrature clock generation with injection-locked oscillators (ILO) allows the generation of rail-to-rail quadrature clocks. Energy efficiency is further improved with capacitively driven low-swing global clock distribution and supply scaling at lower data rates, while output eye quality is maintained at low voltages with automatic phase calibration of the local ILO-generated quarter-rate clocks. A prototype fabricated in a general purpose 65 nm CMOS process includes a 2 mm global clock distribution network and two transmitters that support an output swing range of 100-300mV with up to 12-dB of equalization. The transmitters achieve 8-16 Gb/s operation at 0.65-1.05 pJ/b energy efficiency. The second work involves a dual-mode NRZ/PAM-4 differential low-swing voltage-mode (VM) transmitter. The pulse-selected output multiplexing allows reduction of power supply and deterministic jitter caused by large on-chip parasitic inherent in the transmission-gate-based multiplexers in the earlier work. Analog impedance control replica circuits running in the background produce gate-biasing voltages that control the peaking ratio for 2-tap feed-forward equalization and PAM-4 symbol levels for high-linearity. This analog control also allows for efficient generation of the middle levels in PAM-4 operation with good linearity quantified by level separation mismatch ratio of 95%. In NRZ mode, 2-tap feedforward equalization is configurable in high-performance controlled-impedance or energy-efficient impedance-modulated settings to provide performance scalability. Analytic design consideration on dynamic power, data-rate, mismatch, and output swing brings optimal performance metric on the given technology node. The proof-of-concept prototype is verified on silicon with 65 nm CMOS process with improved performance in speed and energy-efficiency owing to double-stack NMOS transistors in the output stage. The transmitter consumes as low as 29.6mW in 20-Gb/s NRZ and 25.5mW in the 28-Gb/s PAM-4 operations

Design Techniques for High Performance Serial Link Transceivers

Increasing data rates over electrical channels with significant frequency-dependent loss is difficult due to excessive inter-symbol interference (ISI). In order to achieve sufficient link margins at high rates, I/O system designers implement equalization in the transmitters and are motivated to consider more spectrally-efficient modulation formats relative to the common PAM-2 scheme, such as PAM-4 and duobinary. The first work, reviews when to consider PAM-4 and duobinary formats, as the modulation scheme which yields the highest system margins at a given data rate is a function of the channel loss profile, and presents a 20Gb/s triple-mode transmitter capable of efficiently implementing these three modulation schemes and three-tap feedforward equalization. A statistical link modeling tool, which models ISI, crosstalk, random noise, and timing jitter, is developed to compare the three common modulation formats operating on electrical backplane channel models. In order to improve duobinary modulation efficiency, a low-power quarter-rate duobinary precoder circuit is proposed which provides significant timing margin improvement relative to full-rate precoders. Also as serial I/O data rates scale above 10 Gb/s, crosstalk between neighboring channels degrades system bit-error rate (BER) performance. The next work presents receive-side circuitry which merges the cancellation of both near-end and far-end crosstalk (NEXT/FEXT) and can automatically adapt to different channel environments and variations in process, voltage, and temperature. NEXT cancellation is realized with a novel 3-tap FIR filter which combines two traditional FIR filter taps and a continuous-time band-pass filter IIR tap for efficient crosstalk cancellation, with all filter tap coefficients automatically determined via an ondie sign-sign least-mean-square (SS-LMS) adaptation engine. FEXT cancellation is realized by coupling the aggressor signal through a differentiator circuit whose gain is automatically adjusted with a power-detection-based adaptation loop. In conclusion, the proposed architectures in the transmitter side and receiver side together are to be good solution in the high speed I/O serial links to improve the performance by overcome the physical channel loss and adjacent channel noise as the system becomes complicated

Design of Energy-Efficient A/D Converters with Partial Embedded Equalization for High-Speed Wireline Receiver Applications

As the data rates of wireline communication links increases, channel impairments such as skin effect, dielectric loss, fiber dispersion, reflections and cross-talk become more pronounced. This warrants more interest in analog-to-digital converter (ADC)-based serial link receivers, as they allow for more complex and flexible back-end digital signal processing (DSP) relative to binary or mixed-signal receivers. Utilizing this back-end DSP allows for complex digital equalization and more bandwidth-efficient modulation schemes, while also displaying reduced process/voltage/temperature (PVT) sensitivity. Furthermore, these architectures offer straightforward design translation and can directly leverage the area and power scaling offered by new CMOS technology nodes. However, the power consumption of the ADC front-end and subsequent digital signal processing is a major issue. Embedding partial equalization inside the front-end ADC can potentially result in lowering the complexity of back-end DSP and/or decreasing the ADC resolution requirement, which results in a more energy-effcient receiver. This dissertation presents efficient implementations for multi-GS/s time-interleaved ADCs with partial embedded equalization. First prototype details a 6b 1.6GS/s ADC with a novel embedded redundant-cycle 1-tap DFE structure in 90nm CMOS. The other two prototypes explain more complex 6b 10GS/s ADCs with efficiently embedded feed-forward equalization (FFE) and decision feedback equalization (DFE) in 65nm CMOS. Leveraging a time-interleaved successive approximation ADC architecture, new structures for embedded DFE and FFE are proposed with low power/area overhead. Measurement results over FR4 channels verify the effectiveness of proposed embedded equalization schemes. The comparison of fabricated prototypes against state-of-the-art general-purpose ADCs at similar speed/resolution range shows comparable performances, while the proposed architectures include embedded equalization as well

Architectural & circuit level techniques to improve energy efficiency of high speed serial links

High performance computing and communication are two key aspects of all information processing systems. With aggressive scaling of silicon technology enabling integration of a large number of transistors in a small area, managing power and thermal reliability has become very challenging. While lowering the power needed for performing computation has been the prime focus for decades, energy consumed for data transfer has recently become a major bottleneck especially in high performance applications. The focus of this thesis is on improving energy efficiency of communication links by exploring design techniques at both the architectural and circuit levels. In the first part of this work, we propose a time-based equalization scheme to implement transmit de-emphasis in voltage-mode output drivers. Using two-level pulse-width modulation, it overcomes the tradeoff between impedance matching, output swing, and de-emphasis resolution in conventional voltage-mode drivers. A prototype PWM-based 5$\,$Gb/s voltage-mode transmitter was implemented in a 90$\,$nm CMOS process and characterized across different channels and output swings to demonstrate the effectiveness of proposed techniques. The horizontal/vertical eye openings (BER=$\rm 10^{-12}$) at the ends of 60$\,$inch and 96$\,$inch stripline channels are 78$\,$mV/0.6$\,$UI and 8$\,$mV/0.3$\,$UI, respectively. This transmitter achieves an energy efficiency of 3.1$\,$mW/Gb/s while compensating for 16-28$\,$dB channel loss, which compares favorably with the state-of-the-art. In the second part, techniques to improve energy efficiency of a complete transceiver are presented. The transmitter employs a novel partially segmented voltage-mode output driver to lower power consumption in pre-drivers during 2-tap FIR equalization. The receiver implements a low power half-rate clock and data recovery with the proposed ring PLL based multi-phase sampling clock generation in CDR loop and charge-based sampling and deserialization. These techniques are verified using the measured results obtained from a 14Gb/s transceiver prototype. Transmitter achieves an energy efficiency of 0.89$\,$mW/Gb/s while securing a 0.36$\,$UI sampling time margin with $\rm{BER=10^{-12}}$ at the end of the channel with 11$\,$dB loss at Nyquist frequency. The receiver recovers sampling clock with 1.8$\,$$\rm{ps_{rms}}$ long term absolute jitter while recovering 14$\,$Gb/s data at $\rm{BER=10^{-12}}$. The receiver achieves an energy efficiency of 1.69$\,$mW/Gb/s. Transmitter and receiver share an LC PLL, which achieves 0.605$\,$$\rm{ps_{rms}}$ integrated jitter at 7$\,$GHz output with an energy efficiency of 0.5$\,$mW/GHz. The transceiver as a whole achieves an energy efficiency of 2.8$\,$mW/Gb/s

PHY Link Design and Optimization For High-Speed Low-Power Communication Systems

The ever-growing demands for high-bandwidth data transfer have been pushing towards advancing research efforts in the field of high-performing communication systems. Studies on the performance of single chip, e.g. faster multi-core processors and higher system memory capacity, have been explored. To further enhance the system performance, researches have been focused on the improvement of data-transfer bandwidth for chip-to-chip communication in the high-speed serial link. Many solutions have been addressed to overcome the bottleneck caused by the non-idealties such as bandwidth-limited electrical channel that connects two link devices and varieties of undesired noise in the communication systems. Nevertheless, with these solutions data have run into limitations of the timing margins for high-speed interfaces running at multiple gigabits per second data rates on low-cost Printed Circuit Board (PCB) material with constrained power budget. Therefore, the challenge in designing a physical layer (PHY) link for high-speed communication systems turns out to be power-efficient, reliable and cost-effective. In this context, this dissertation is intended to focus on architectural design, system-level and circuit-level verification of a PHY link as well as system performance optimization in respective of power, reliability and adaptability in high-speed communication systems. The PHY is mainly composed of clock data recovery (CDR), equalizers (EQs) and high- speed I/O drivers. Symmetrical structure of the PHY link is usually duplicated in both link devices for bidirectional data transmission. By introducing training mechanisms into high-speed communication systems, the timing in one link device is adaptively aligned to the timing condition specified in the other link device despite of different skews or induced jitter resulting from process, voltage and temperature (PVT) variations in the individual link. With reliable timing relationships among the interface signals provided, the total system bandwidth is dramatically improved. On the other hand, interface training offers high flexibility for reuse without further investigation on high demanding components involved in high costs. In the training mode, a CDR module is essential for reconstructing the transmitted bitstream to achieve the best data eye and to detect the edges of data stream in asynchronous systems or source-synchronous systems. Generally, the CDR works as a feedback control system that aligns its output clock to the center of the received data. In systems that contain multiple data links, the overall CDR power consumption increases linearly with the increase in number of links as one CDR is required for each link. Therefore, a power-efficient CDR plays a significant role in such systems with parallel links. Furthermore, a high performance CDR requires low jitter generation in spite of high input jitter. To minimize the trade-off between power consumption and CDR jitter, a novel CDR architecture is proposed by utilizing the proportional-integral (PI) controller and three times sampling scheme. Meanwhile, signal integrity (SI) becomes critical as the data rate exceeds several gigabits per second. Distorted data due to the non-idealties in systems are likely to reduce the signal quality aggressively and result in intolerable transmission errors in worst case scenarios, thus affect the system effective bandwidth. Hence, additional trainings such as transmitter (Tx) and receiver (Rx) EQ trainings for SI purpose are inserted into the interface training. Besides, a simplified system architecture with unsymmetrical placement of adaptive Rx and Tx EQs in a single link device is proposed and analyzed by using different coefficient adaptation algorithms. This architecture enables to reduce a large number of EQs through the training, especially in case of parallel links. Meanwhile, considerable power and chip area are saved. Finally, high-speed I/O driver against PVT variations is discussed. Critical issues such as overshoot and undershoot interfering with the data are primarily accompanied by impedance mismatch between the I/O driver and its transmitting channel. By applying PVT compensation technique I/O driver impedances can be effectively calibrated close to the target value. Different digital impedance calibration algorithms against PVT variations are implemented and compared for achieving fast calibration and low power requirements

차세대 자동차용 카메라 데이터 통신을 위한 비대칭 동시 양방향 송수신기의 설계

학위논문(박사) -- 서울대학교대학원 : 공과대학 전기·정보공학부, 2022.2. 정덕균.본 학위 논문에서는 차세대 자동차용 카메라 링크를 위해 높은 속도의 4레벨 펄스 진폭 변조 신호와 낮은 속도의 2레벨 펄스 진폭 변조 신호를 통신하는 비대칭 동시 양방향 송수신기의 설계 기술에 대해 제안하고 검증되었다. 첫번째 프로토타입 설계에서는, 10B6Q 직류 밸런스 코드를 탑재한 4레벨 펄스 진폭 변조 송신기와 고정된 데이터와 참조 레벨을 가지는 4레벨 펄스 진폭 변조 적응형 수신기에 대한 내용이 기술되었다. 4레벨 펄스 진폭 변조 송신기에서는 교류 연결 링크 시스템에 대응하기 위한 면적 및 전력 효율성이 좋은 10B6Q 코드가 제안되었다. 이 코드는 직류 밸런스를 맞추고 연속적으로 같은 심볼을 가지는 길이를 6개로 제한 시킨다. 비록 여기서는 입력 데이터 길이 10비트를 사용하였지만, 제안된 기술은 카메라의 다양한 데이터 타입에 대응할 수 있도록 입력 데이터 길이에 대한 확장성을 가진다. 반면, 4레벨 펄스 진폭 변조 적응형 수신기에서는, 샘플러의 옵셋을 최적으로 제거하여 더 낮은 비트에러율을 얻기 위해서, 기존의 데이터 및 참조 레벨을 조절하는 대신, 이 레벨들은 고정시키고 가변 게인 증폭기를 적응형으로 조절하도록 하였다. 상기 10B6Q 코드 및 고정 데이터 및 참조레벨 기술을 가진 프로토타입 칩들은 40 나노미터 상호보완형 메탈 산화 반도체 공정으로 제작되었고 칩 온 보드 형태로 평가되었다. 10B6Q 코드는 합성 게이트 숫자는 645개와 함께 단 0.0009 mm2 의 면적 만을 차지한다. 또한, 667 MHz 동작 주파수에서 단 0.23 mW 의 전력을 소모한다. 10B6Q 코드를 탑재한 송신기에서 8-Gb/s 4레벨 펄스 진폭 변조 신호를 고정 데이터 및 참조 레벨을 가지는 적응형 수신기로 12-m 케이블 (22-dB 채널 로스) 을 통해서 보낸 결과 최소 비트 에러율 108 을 달성하였고, 비트 에러율 105 에서는 아이 마진이 0.15 UI x 50 mV 보다 크게 측정되었다. 송수신기를 합친 전력 소모는 65.2 mW (PLL 제외) 이고, 성과의 대표수치는 0.37 pJ/b/dB 를 보여주었다. 첫번째 프로토타입 설계을 포함하여 개선된 두번째 프로토타입 설계에서는, 12-Gb/s 4레벨 펄스 진폭 변조 정방향 채널 신호와 125-Mb/s 2레벨 펄스 진폭 변조 역방향 채널 신호를 탑재한 비대칭 동시 양방향 송수신기에 대해 기술되고 검증되었다. 제안된 넓은 선형 범위를 가지는 하이브리드는 gmC 저대역 통과 필터와 에코 제거기와 함께 아웃바운드 신호를 24 dB 이상 효율적으로 감소시켰다. 또한, 넓은 선형 범위를 가지는 하이브리드와 함께 게인 감소기를 형성하게 되는 선형 범위 증폭기를 통해 4레벨 펄스 진폭 변조 신호의 선형성과 진폭의 트레이드 오프 관계를 깨는 것이 가능하였다. 동시 양방향 송수신기 칩은 40 나노미터 상호보완형 메탈 산화 반도체 공정으로 제작되었다. 상기 설계 기술들을 이용하여, 4레벨 펄스 진폭 변조 및 2레벨 펄스 진폭 변조 송수신기 모두 5m 채널 (채널 로스 15.9 dB) 에서 1E-12 보다 낮은 비트 에러율을 달성하였고, 총 78.4 mW 의 전력 소모를 기록하였다. 종합적인 송수신기는 성과 대표지표로 0.41 pJ/b/dB 와 함께 동시 양방향 통신 아래에서 4레벨 펄스 진폭 변조 신호 및 2레벨 펄스 진폭 변조 신호 각각에서 아이 마진 0.15 UI 와 0.57 UI 를 달성하였다. 이 수치는 성과 대표지표 0.5 이하를 가지는 기존 동시 양방향 송수신기와의 비교에서 최고의 아이 마진을 기록하였다.In this dissertation, design techniques of a highly asymmetric simultaneous bidirectional (SB) transceivers with high-speed PAM-4 and low-speed PAM-2 signals are proposed and demonstrated for the next-generation automotive camera link. In a first prototype design, a PAM-4 transmitter with 10B6Q DC balance code and a PAM-4 adaptive receiver with fixed data and threshold levels (dtLevs) are presented. In PAM-4 transmitter, an area- and power-efficient 10B6Q code for an AC coupled link system that guarantees DC balance and limited run length of six is proposed. Although the input data width of 10 bits is used here, the proposed scheme has an extensibility for the input data width to cover various data types of the camera. On the other hand, in the PAM-4 adaptive receiver, to optimally cancel the sampler offset for a lower BER, instead of adjusting dtLevs, the gain of a programmable gain amplifier is adjusted adaptively under fixed dtLevs. The prototype chips including above proposed 10B6Q code and fixed dtLevs are fabricated in 40-nm CMOS technology and tested in chip-on-board assembly. The 10B6Q code only occupies an active area of 0.0009 mm2 with a synthesized gate count of 645. It also consumes 0.23 mW at the operating clock frequency of 667 MHz. The transmitter with 10B6Q code delivers 8-Gb/s PAM-4 signal to the adaptive receiver using fixed dtLevs through a lossy 12-m cable (22-dB channel loss) with a BER of 1E-8, and the eye margin larger than 0.15 UI x 50 mV is measured for a BER of 1E-5. The proto-type chips consume 65.2 mW (excluding PLL), exhibiting an FoM of 0.37 pJ/b/dB. In a second prototype design advanced from the first prototypes, An asymmetric SB transceivers incorporating a 12-Gb/s PAM-4 forward channel and a 125-Mb/s PAM-2 back channel are presented and demonstrated. The proposed wide linear range (WLR) hybrid combined with a gmC low-pass filter and an echo canceller effectively suppresses the outbound signals by more than 24dB. In addition, linear range enhancer which forms a gain attenuator with WLR hybrid breaks the trade-off between the linearity and the amplitude of the PAM-4 signal. The SB transceiver chips are separately fabricated in 40-nm CMOS technology. Using above design techniques, both PAM-4 and PAM-2 SB transceivers achieve BER less than 1E-12 over a 5-m channel (15.9 dB channel loss), consuming 78.4 mW. The overall transceivers achieve an FoM of 0.41 pJ/b/dB and eye margin (at BER of 1E-12) of 0.15 UI and 0.57 UI for the forward PAM-4 and back PAM-2 signals, respectively, under SB communication. This is the best eye margin compared to the prior art SB transceivers with an FoM less than 0.5.CHAPTER 1 INTRODUCTION 1 1.1 MOTIVATION 1 1.2 DISSERTATION ORGANIZATION 4 CHAPTER 2 BACKGROUND ON AUTOMOTIVE CAMERA LINK 6 2.1 OVERVIEW 6 2.2 SYSTEM REQUIREMENTS 10 2.2.1 CHANNEL 10 2.2.2 POWER OVER DIFFERENTIAL LINE (PODL) 12 2.2.3 AC COUPLING AND DC BALANCE CODE 15 2.2.4 SIMULTANEOUS BIDIRECTIONAL COMMUNICATION 18 2.2.4.1 HYBRID 18 2.2.4.2 ECHO CANCELLER 20 2.2.5 ADAPTIVE RECEIVE EQUALIZATION 22 CHAPTER 3 AREA AND POWER EFFICIENT 10B6Q ENCODER FOR DC BALANCE 25 3.1 INTRODUCTION 25 3.2 PRIOR WORKS 28 3.3 PROPOSED AREA- AND POWER-EFFICIENT 10B6Q PAM-4 CODER 30 3.4 DESIGN OF THE 10B6Q CODE 33 3.4.1 PAM-4 DC BALANCE 35 3.4.2 PAM-4 TRANSITION DENSITY 35 3.4.3 10B6Q DECODER 37 3.5 IMPLEMENTATION AND MEASUREMENT RESULTS 40 CHAPTER 4 PAM-4 TRANSMITTER AND ADAPTIVE RECEIVER WITH FIXED DATA AND THRESHOLD LEVELS 45 4.1 INTRODUCTION 45 4.2 PRIOR WORKS 47 4.3 ARCHITECTURE AND IMPLEMENTATION 49 4.2.1 PAM-4 TRANSMITTER 49 4.2.2 PAM-4 ADAPTIVE RECEIVER 52 4.3 MEASUREMENT RESULTS 62 CHAPTER 5 ASYMMETRIC SIMULTANEOUS BIDIRECTIONAL TRANSCEIVERS USING WIDE LINEAR RANGE HYBRID 68 5.1 INTRODUCTION 68 5.2 PRIOR WORKS 70 5.3 WIDE LINEAR RANGE (WLR) HYBRID 75 5.3 IMPLEMENTATION 78 5.3.1 SERIALIZER (SER) DESIGN 78 5.3.2 DESERIALIZER (DES) DESIGN 79 5.4 HALF CIRCUIT ANALYSIS OF WLR HYBRID AND LRE 82 5.5 MEASUREMENT RESULTS 88 CHAPTER 6 CONCLUSION 97 BIBLIOGRAPHY 99 초 록 106박

Power-efficient high-speed interface circuit techniques

Inter- and intra-chip connections have become the new challenge to enable the scaling of computing systems, ranging from mobile devices to high-end servers. Demand for aggregate I/O bandwidth has been driven by applications including high-speed ethernet, backplane micro-servers, memory, graphics, chip-to-chip and network onchip. I/O circuitry is becoming the major power consumer in SoC processors and memories as the increasing bandwidth demands larger per-pin data rate or larger I/O pin count per component. The aggregate I/O bandwidth has approximately doubled every three to four years across a diverse range of standards in different applications. However, in order to keep pace with these standards enabled in part by process-technology scaling, we will require more than just device scaling in the near future. New energy-efficient circuit techniques must be proposed to enable the next generations of handheld and high-performance computers, given the thermal and system-power limits they start facing. ^ In this work, we are proposing circuit architectures that improve energy efficiency without decreasing speed performance for the most power hungry circuits in high speed interfaces. By the introduction of a new kind of logic operators in CMOS, called implication operators, we implemented a new family of high-speed frequency dividers/prescalers with reduced footprint and power consumption. New techniques and circuits for clock distribution, for pre-emphasis and for driver at the transmitter side of the I/O circuitry have been proposed and implemented. At the receiver side, new DFE architecture and CDR have been proposed and have been proven experimentally

Design of reliable and energy-efficient high-speed interface circuits

The data-rate demand in high-speed interface circuits increases exponentially every year. High-speed I/Os are better implemented in advanced process technologies for lower-power systems, with the advantages of improved driving capability of the transistors and reduced parasitic capacitance. However, advanced technologies are not necessarily advantageous in terms of device reliability; in particular device failure from electrostatic discharge (ESD) becomes more likely in nano-scale process nodes. In order to secure ESD resiliency, the size of ESD devices on I/O pads should be sufficiently large, which may potentially reduce I/O speed. These two conflicting requirements in high-speed I/O design sometimes require sacrifice to one of the two properties. In this dissertation, three different approaches are proposed to achieve reliable and energy-efficient interface circuits. As the first approach, a novel ESD self-protection scheme to utilize “adaptive active bias conditioning” is proposed to reduce voltage stress on the vulnerable transistors, thereby reducing the burden on ESD protection devices. The second approach is to cancel out effective parasitic capacitance from ESD devices by the T-coil network. Voltage overshoot generated by magnetic coupling of the T-coil network can be suppressed by the proposed “inductance halving” technique, which reduces mutual inductance during ESD. The last approach employs system-level knowledge in the design of an ADC-based receiver for high intersymbol interference (ISI) channels. As a system-level performance metric, bit-error rate (BER) is adopted to mitigate a bit-resolution requirement in “BER-optimal ADC”, which can lead to 2× power-efficiency in the flash ADC and achieve a better BER performance