Energy Aware Design and Analysis for Synchronous and Asynchronous Circuits

Power dissipation has become a major concern for IC designers. Various low power design techniques have been developed for synchronous circuits. Asynchronous circuits, however. have gained more interests recently due to their benefits in lower noise, easy timing control, etc. But few publications on energy reduction techniques for asynchronous logic are available. Power awareness indicates the ability of the system power to scale with changing conditions and quality requirements. Scalability is an important figure-of-merit since it allows the end user to implement operational policy. just like the user of mobile multimedia equipment needs to select between better quality and longer battery operation time. This dissertation discusses power/energy optimization and performs analysis on both synchronous and asynchronous logic. The major contributions of this dissertation include: 1 ) A 2-Dimensional Pipeline Gating technique for synchronous pipelined circuits to improve their power awareness has been proposed. This technique gates the corresponding clock lines connected to registers in both vertical direction (the data flow direction) and horizontal direction (registers within each pipeline stage) based on current input precision. 2) Two energy reduction techniques, Signal Bypassing & Insertion and Zero Insertion. have been developed for NCL circuits. Both techniques use Nulls to replace redundant Data 0\u27s based on current input precision in order to reduce the switching activity while Signal Bypassing & Insertion is for non-pipelined NCI, circuits and Zero Insertion is for pipelined counterparts. A dynamic active-bit detection scheme is also developed as an expansion. 3) Two energy estimation techniques, Equivalent Inverter Modeling based on Input Mapping in transistor-level and Switching Activity Modeling in gate-level, have been proposed. The former one is for CMOS gates with feedbacks and the latter one is for NCL circuits

Vector processing-aware advanced clock-gating techniques for low-power fused multiply-add

The need for power efficiency is driving a rethink of design decisions in processor architectures. While vector processors succeeded in the high-performance market in the past, they need a retailoring for the mobile market that they are entering now. Floating-point (FP) fused multiply-add (FMA), being a functional unit with high power consumption, deserves special attention. Although clock gating is a well-known method to reduce switching power in synchronous designs, there are unexplored opportunities for its application to vector processors, especially when considering active operating mode. In this research, we comprehensively identify, propose, and evaluate the most suitable clock-gating techniques for vector FMA units (VFUs). These techniques ensure power savings without jeopardizing the timing. We evaluate the proposed techniques using both synthetic and “real-world” application-based benchmarking. Using vector masking and vector multilane-aware clock gating, we report power reductions of up to 52%, assuming active VFU operating at the peak performance. Among other findings, we observe that vector instruction-based clock-gating techniques achieve power savings for all vector FP instructions. Finally, when evaluating all techniques together, using “real-world” benchmarking, the power reductions are up to 80%. Additionally, in accordance with processor design trends, we perform this research in a fully parameterizable and automated fashion.The research leading to these results has received funding from the RoMoL ERC Advanced Grant GA 321253 and is supported in part by the European Union (FEDER funds) under contract TTIN2015-65316-P. The work of I. Ratkovic was supported by a FPU research grant from the Spanish MECD.Peer ReviewedPostprint (author's final draft

Energy-Aware Data Movement In Non-Volatile Memory Hierarchies

While technology scaling enables increased density for memory cells, the intrinsic high leakage power of conventional CMOS technology and the demand for reduced energy consumption inspires the use of emerging technology alternatives such as eDRAM and Non-Volatile Memory (NVM) including STT-MRAM, PCM, and RRAM. The utilization of emerging technology in Last Level Cache (LLC) designs which occupies a signifcant fraction of total die area in Chip Multi Processors (CMPs) introduces new dimensions of vulnerability, energy consumption, and performance delivery. To be specific, a part of this research focuses on eDRAM Bit Upset Vulnerability Factor (BUVF) to assess vulnerable portion of the eDRAM refresh cycle where the critical charge varies depending on the write voltage, storage and bit-line capacitance. This dissertation broaden the study on vulnerability assessment of LLC through investigating the impact of Process Variations (PV) on narrow resistive sensing margins in high-density NVM arrays, including on-chip cache and primary memory. Large-latency and power-hungry Sense Amplifers (SAs) have been adapted to combat PV in the past. Herein, a novel approach is proposed to leverage the PV in NVM arrays using Self-Organized Sub-bank (SOS) design. SOS engages the preferred SA alternative based on the intrinsic as-built behavior of the resistive sensing timing margin to reduce the latency and power consumption while maintaining acceptable access time. On the other hand, this dissertation investigates a novel technique to prioritize the service to 1) Extensive Read Reused Accessed blocks of the LLC that are silently dropped from higher levels of cache, and 2) the portion of the working set that may exhibit distant re-reference interval in L2. In particular, we develop a lightweight Multi-level Access History Profiler to effciently identify ERRA blocks through aggregating the LLC block addresses tagged with identical Most Signifcant Bits into a single entry. Experimental results indicate that the proposed technique can reduce the L2 read miss ratio by 51.7% on average across PARSEC and SPEC2006 workloads. In addition, this dissertation will broaden and apply advancements in theories of subspace recovery to pioneer computationally-aware in-situ operand reconstruction via the novel Logic In Interconnect (LI2) scheme. LI2 will be developed, validated, and re?ned both theoretically and experimentally to realize a radically different approach to post-Moore\u27s Law computing by leveraging low-rank matrices features offering data reconstruction instead of fetching data from main memory to reduce energy/latency cost per data movement. We propose LI2 enhancement to attain high performance delivery in the post-Moore\u27s Law era through equipping the contemporary micro-architecture design with a customized memory controller which orchestrates the memory request for fetching low-rank matrices to customized Fine Grain Reconfigurable Accelerator (FGRA) for reconstruction while the other memory requests are serviced as before. The goal of LI2 is to conquer the high latency/energy required to traverse main memory arrays in the case of LLC miss, by using in-situ construction of the requested data dealing with low-rank matrices. Thus, LI2 exchanges a high volume of data transfers with a novel lightweight reconstruction method under specific conditions using a cross-layer hardware/algorithm approach

Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits

Three dimensional integrated circuits (3D ICs) have been acknowledged as a promising technology to overcome the interconnect delay bottleneck brought by continuous CMOS scaling. Recent research shows that through-silicon-vias (TSVs), which act as vertical links between layers, pose yield and reliability challenges for 3D design. This thesis presents three original contributions.The first contribution presents a grouping-based technique to improve the yield of 3D ICs under manufacturing TSV defects, where regular and redundant TSVs are partitioned into groups. In each group, signals can select good TSVs using rerouting multiplexers avoiding defective TSVs. Grouping ratio (regular to redundant TSVs in one group) has an impact on yield and hardware overhead. Mathematical probabilistic models are presented for yield analysis under the influence of independent and clustering defect distributions. Simulation results using MATLAB show that for a given number of TSVs and TSV failure rate, careful selection of grouping ratio results in achieving 100% yield at minimal hardware cost (number of multiplexers and redundant TSVs) in comparison to a design that does not exploit TSV grouping ratios. The second contribution presents an efficient online fault tolerance technique based on redundant TSVs, to detect TSV manufacturing defects and address thermal-induced reliability issue. The proposed technique accounts for both fault detection and recovery in the presence of three TSV defects: voids, delamination between TSV and landing pad, and TSV short-to-substrate. Simulations using HSPICE and ModelSim are carried out to validate fault detection and recovery. Results show that regular and redundant TSVs can be divided into groups to minimise area overhead without affecting the fault tolerance capability of the technique. Synthesis results using 130-nm design library show that 100% repair capability can be achieved with low area overhead (4% for the best case). The last contribution proposes a technique with joint consideration of temperature mitigation and fault tolerance without introducing additional redundant TSVs. This is achieved by reusing spare TSVs that are frequently deployed for improving yield and reliability in 3D ICs. The proposed technique consists of two steps: TSV determination step, which is for achieving optimal partition between regular and spare TSVs into groups; The second step is TSV placement, where temperature mitigation is targeted while optimizing total wirelength and routing difference. Simulation results show that using the proposed technique, 100% repair capability is achieved across all (five) benchmarks with an average temperature reduction of 75.2? (34.1%) (best case is 99.8? (58.5%)), while increasing wirelength by a small amount

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Radix -4/-8 Dual Encoder Block for Multiplier Architecture using GDI

Abstract-A hybrid radix-4/-8 multiplier is proposed for portable multimedia applications that demand high speed and low energy operation. Depending on the input pattern, the multiplier operates in the radix-8 mode in 56% of the input cases for low power, but reverts to the radix-4 mode in 44% of the slower input cases for high speed. For this Radix 4/8 Dual encoder block is designed. Compared to a conventional CMOS radix-4/8 encoder, the proposed radix-4/8 encoder consumes 43.6% less power, and 46.51% less area and 3.3% less delay time. Index Terms -dual encoder, multiplier, gate-diffusion input (GDI), power consumption

Gate-level timing analysis and waveform evaluation

Static timing analysis (STA) is an integral part of modern VLSI chip design. Table lookup based methods are widely used in current industry due to its fast runtime and mature algorithms. Conventional STA algorithms based on table-lookup methods are developed under many assumptions in timing analysis; however, most of those assumptions, such as that input signals and output signals can be accurately modeled as ramp waveforms, are no longer satisfactory to meet the increasing demand of accuracy for new technologies. In this dissertation, we discuss several crucial issues that conventional STA has not taken into consideration, and propose new methods to handle these issues and show that new methods produce accurate results. In logic circuits, gates may have multiple inputs and signals can arrive at these inputs at different times and with different waveforms. Different arrival times and waveforms of signals can cause very different responses. However, multiple-input transition effects are totally overlooked by current STA tools. Using a conventional single-input transition model when multiple-input transition happens can cause significant estimation errors in timing analysis. Previous works on this issue focus on developing a complicated gate model to simulate the behavior of logic gates. These methods have high computational cost and have to make significant changes to the prevailing STA tools, and are thus not feasible in practice. This dissertation proposes a simplified gate model, uses transistor connection structures to capture the behavior of multiple-input transitions and requires no change to the current STA tools. Another issue with table lookup based methods is that the load of each gate in technology libraries is modeled as a single lumped capacitor. But in the real circuit, the Abstract 2 gate connects to its subsequent gates via metal wires. As the feature size of integrated circuit scales down, the interconnection cannot be seen as a simple capacitor since the resistive shielding effect will largely affect the equivalent capacitance seen from the gate. As the interconnection has numerous structures, tabulating the timing data for various interconnection structures is not feasible. In this dissertation, by using the concept of equivalent admittance, we reduce an arbitrary interconnection structure into an equivalent π-model RC circuit. Many previous works have mapped the π-model to an effective capacitor, which makes the table lookup based methods useful again. However, a capacitor cannot be equivalent to a π-model circuit, and will thus result in significant inaccuracy in waveform evaluation. In order to obtain an accurate waveform at gate output, a piecewise waveform evaluation method is proposed in this dissertation. Each part of the piecewise waveform is evaluated according to the gate characteristic and load structures. Another contribution of this dissertation research is a proposed equivalent waveform search method. The signal waveforms can be very complicated in the real circuits because of noises, race hazards, etc. The conventional STA only uses one attribute (i.e., transition time) to describe the waveform shape which can cause significant estimation errors. Our approach is to develop heuristic search functions to find equivalent ramps to approximate input waveforms. Here the transition time of a final ramp can be completely different from that of the original waveform, but we can get higher accuracy on output arrival time and transition time. All of the methods mentioned in this dissertation require no changes to the prevailing STA tools, and have been verified across different process technologies

Device-to-Device Communication in 5G: Towards Efficient Scheduling

5G wireless networks are expected to carry large traffic volumes due to the growth of mobile devices and the increasing demand for high data rates from applications. Device to device communication is one of the suggested technologies to support this increasing load and enhance the capacity of networks. However, the implementation of D2D communication reveals many barriers that include communication scheduling, for which the architecture remains complex and obscure. In this paper, an overview of the available literature on the implementation of networks supporting D2D communication is presented, emphasizing the complexity of the offered solutions. This paper also offers a study of the impact of different device distribution models on the throughput of the devices. The paper introduces the challenges and makes the case for the need to find a more efficient D2D scheduler providing less complexity