On the suitability and development of layout templates for analog layout reuse and layout-aware synthesis

Accelerating the synthesis of increasingly complex analog integrated circuits is key to bridge the widening gap between what we can integrate and what we can design while meeting ever-tightening time-to-market constraints. It is a well-known fact in the semiconductor industry that such goal can only be attained by means of adequate CAD methodologies, techniques, and accompanying tools. This is particularly important in analog physical synthesis (a.k.a. layout generation), where large sensitivities of the circuit performances to the many subtle details of layout implementation (device matching, loading and coupling effects, reliability, and area features are of utmost importance to analog designers), render complete automation a truly challenging task. To approach the problem, two directions have been traditionally considered, knowledge-based and optimization-based, both with their own pros and cons. Besides, recently reported solutions oriented to speed up the overall design flow by means of reuse-based practices or by cutting off time-consuming, error-prone spins between electrical and layout synthesis (a technique known as layout-aware synthesis), rely on a outstandingly rapid yet efficient layout generation method. This paper analyses the suitability of procedural layout generation based on templates (a knowledge-based approach) by examining the requirements that both layout reuse and layout-aware solutions impose, and how layout templates face them. The ability to capture the know-how of experienced layout designers and the turnaround times for layout instancing are considered main comparative aspects in relation to other layout generation approaches. A discussion on the benefit-cost trade-off of using layout templates is also included. In addition to this analysis, the paper delves deeper into systematic techniques to develop fully reusable layout templates for analog circuits, either for a change of the circuit sizing (i.e., layout retargeting) or a change of the fabrication process (i.e., layout migration). Several examples implemented with the Cadence's Virtuoso tool suite are provided as demonstration of the paper's contributions.Ministerio de Educación y Ciencia TEC2004-0175

Advanced analog layout design automation in compliance with density uniformity

To fabricate a reliable integrated circuit chip, foundries follow specific design rules and layout processing techniques. One of the parameters, which affect circuit performance and final electronic product quality, is the variation of thickness for each semiconductor layer within the fabricated chips. The thickness is closely dependent on the density of geometric features on that layer. Therefore, to ensure consistent thickness, foundries normally have to seriously control distribution of the feature density on each layer by using post-processing operations. In this research, the methods of controlling feature density distribution on different layers of an analog layout during the process of layout migration from an old technology to a new one or updated design specifications in the same technology have been investigated. We aim to achieve density-uniformity-aware layout retargeting for facilitating manufacturing process in the advanced technologies. This can offer an advantage right to the design stage for the designers to evaluate the effects of applying density uniformity to their drafted layouts, which are otherwise usually done by the foundries at the final manufacturing stage without considering circuit performance. Layout modification for density uniformity includes component position change and size modification, which may induce crosstalk noise caused by extra parasitic capacitance. To effectively control this effect, we have also investigated and proposed a simple yet accurate analytic method to model the parasitic capacitance on multi-layer VLSI chips. Supported by this capacitance modeling research, a unique methodology to deal with density-uniformity-aware analog layout retargeting with the capability of parasitic capacitance control has been presented. The proposed operations include layout geometry position rearrangement, interconnect size modification, and extra dummy fill insertion for enhancing layout density uniformity. All of these operations are holistically coordinated by a linear programming optimization scheme. The experimental results demonstrate the efficacy of the proposed methodology compared to the popular digital solutions in terms of minimum density variation and acute parasitic capacitance control

A Tool for the Automatic Generation and Analysis of Regular Analog Layout Modules

This paper describes the characteristics of a new CAD tool that enables the creation of layout libraries of selected analog modules. This Analog Modules Generator (AMG) automatically creates multiple layout versions of two commonly used analog structures: the differential pair and arrays of series-connected or stacked devices, for the subsequent generation of layout libraries. Based on the number of devices and rows defined by the user for the layout implementation, the tool validates all possible implementations, which are later saved in a database with their corresponding characteristics, such as area and parasitics information. Additionally, an extraction process can be optionally executed over all the layout views saved in the database. The AMG generates several reports with all the characteristics of the implemented layouts, including area and parasitic components, facilitating further statistical processing. We describe the features and capabilities of the proposed AMG tool, and several test cases are presented. Results show that optimal layout implementations can be achieved by layout and circuit designers in a reduced amount of time

Analog layout design automation: ILP-based analog routers

The shrinking design window and high parasitic sensitivity in the advanced technology have imposed special challenges on the analog and radio frequency (RF) integrated circuit design. In this thesis, we propose a new methodology to address such a deficiency based on integer linear programming (ILP) but without compromising the capability of handling any special constraints for the analog routing problems. Distinct from the conventional methods, our algorithm utilizes adaptive resolutions for various routing regions. For a more congested region, a routing grid with higher resolution is employed, whereas a lower-resolution grid is adopted to a less crowded routing region. Moreover, we strengthen its speciality in handling interconnect width control so as to route the electrical nets based on analog constraints while considering proper interconnect width to address the acute interconnect parasitics, mismatch minimization, and electromigration effects simultaneously. In addition, to tackle the performance degradation due to layout dependent effects (LDEs) and take advantage of optical proximity correction (OPC) for resolution enhancement of subwavelength lithography, in this thesis we have also proposed an innovative LDE-aware analog layout migration scheme, which is equipped with our special routing methodology. The LDE constraints are first identified with aid of a special sensitivity analysis and then satisfied during the layout migration process. Afterwards the electrical nets are routed by an extended OPC-inclusive ILP-based analog router to improve the final layout image fidelity while the routability and analog constraints are respected in the meantime. The experimental results demonstrate the effectiveness and efficiency of our proposed methods in terms of both circuit performance and image quality compared to the previous works

Analog design for manufacturability: lithography-aware analog layout retargeting

As transistor sizes shrink over time in the advanced nanometer technologies, lithography effects have become a dominant contributor of integrated circuit (IC) yield degradation. Random manufacturing variations, such as photolithographic defect or spot defect, may cause fatal functional failures, while systematic process variations, such as dose fluctuation and defocus, can result in wafer pattern distortions and in turn ruin circuit performance. This dissertation is focused on yield optimization at the circuit design stage or so-called design for manufacturability (DFM) with respect to analog ICs, which has not yet been sufficiently addressed by traditional DFM solutions. On top of a graph-based analog layout retargeting framework, in this dissertation the photolithographic defects and lithography process variations are alleviated by geometrical layout manipulation operations including wire widening, wire shifting, process variation band (PV-band) shifting, and optical proximity correction (OPC). The ultimate objective of this research is to develop efficient algorithms and methodologies in order to achieve lithography-robust analog IC layout design without circuit performance degradation

Automated Placement Of A Transistor Pair For Analogue

The performances of analogue circuits are affected by surrounding parameters such as levels of noise, thermal gradients of a circuit, and parasitic effects from both resistive and capacitive part. As there are no effective approaches to handle these analogue constraints as mentioned above, the focuses to develop IC design tools are bended towards digital circuits. The purpose of this research is to introduce a complete methodology for transistor pair placement for analogue layout using a concept of cells and arrays based on migration and reuse. The entire process consists of Standard Cell Generation to produce standard cell for analogue circuits, Matching Generator with array alignment to generate transistor matching of common-centroid arrangement, and Auto Routing for global routing. The methodology is translated into automation by a graphical user interface to render a fully functional layout designs in a few steps and fraction of time. This research describes such a system in obtaining a layout that can be configured like a set of building blocks that meets all design specifications. In comparison to all the different approaches that have been discussed and analysed prior to this research, a new design flow for analogue layout combined with automation is constructed by considering transistor matching as a constraint

Integrated Circuits Parasitic Capacitance Extraction Using Machine Learning and its Application to Layout Optimization

The impact of parasitic elements on the overall circuit performance keeps increasing from one technology generation to the next. In advanced process nodes, the parasitic effects dominate the overall circuit performance. As a result, the accuracy requirements of parasitic extraction processes significantly increased, especially for parasitic capacitance extraction. Existing parasitic capacitance extraction tools face many challenges to cope with such new accuracy requirements that are set by semiconductor foundries (\u3c 5% error). Although field-solver methods can meet such requirements, they are very slow and have a limited capacity. The other alternative is the rule-based parasitic capacitance extraction methods, which are faster and have a high capacity; however, they cannot consistently provide good accuracy as they use a pre-characterized library of capacitance formulas that cover a limited number of layout patterns. On the other hand, the new parasitic extraction accuracy requirements also added more challenges on existing parasitic-aware routing optimization methods, where simplified parasitic models are used to optimize layouts. This dissertation provides new solutions for interconnect parasitic capacitance extraction and parasitic-aware routing optimization methodologies in order to cope with the new accuracy requirements of advanced process nodes as follows. First, machine learning compact models are developed in rule-based extractors to predict parasitic capacitances of cross-section layout patterns efficiently. The developed models mitigate the problems of the pre-characterized library approach, where each compact model is designed to extract parasitic capacitances of cross-sections of arbitrary distributed metal polygons that belong to a specific set of metal layers (i.e., layer combination) efficiently. Therefore, the number of covered layout patterns significantly increased. Second, machine learning compact models are developed to predict parasitic capacitances of middle-end-of-line (MEOL) layers around FINFETs and MOSFETs. Each compact model extracts parasitic capacitances of 3D MEOL patterns of a specific device type regardless of its metal polygons distribution. Therefore, the developed MEOL models can replace field-solvers in extracting MEOL patterns. Third, a novel accuracy-based hybrid parasitic capacitance extraction method is developed. The proposed hybrid flow divides a layout into windows and extracts the parasitic capacitances of each window using one of three parasitic capacitance extraction methods that include: 1) rule-based; 2) novel deep-neural-networks-based; and 3) field-solver methods. This hybrid methodology uses neural-networks classifiers to determine an appropriate extraction method for each window. Moreover, as an intermediate parasitic capacitance extraction method between rule-based and field-solver methods, a novel deep-neural-networks-based extraction method is developed. This intermediate level of accuracy and speed is needed since using only rule-based and field-solver methods (for hybrid extraction) results in using field-solver most of the time for any required high accuracy extraction. Eventually, a parasitic-aware layout routing optimization and analysis methodology is implemented based on an incremental parasitic extraction and a fast optimization methodology. Unlike existing flows that do not provide a mechanism to analyze the impact of modifying layout geometries on a circuit performance, the proposed methodology provides novel sensitivity circuit models to analyze the integrity of signals in layout routes. Such circuit models are based on an accurate matrix circuit representation, a cost function, and an accurate parasitic sensitivity extraction. The circuit models identify critical parasitic elements along with the corresponding layout geometries in a certain route, where they measure the sensitivity of a route’s performance to corresponding layout geometries very fast. Moreover, the proposed methodology uses a nonlinear programming technique to optimize problematic routes with pre-determined degrees of freedom using the proposed circuit models. Furthermore, it uses a novel incremental parasitic extraction method to extract parasitic elements of modified geometries efficiently, where the incremental extraction is used as a part of the routing optimization process to improve the optimization runtime and increase the optimization accuracy

Technology Independent Synthesis of CMOS Operational Amplifiers

Analog circuit design does not enjoy as much automation as its digital counterpart. Analog sizing is inherently knowledge intensive and requires accurate modeling of the different parametric effects of the devices. Besides, the set of constraints in a typical analog design problem is large, involving complex tradeoffs. For these reasons, the task of modeling an analog design problem in a form viable for automation is much more tedious than the digital design. Consequently, analog blocks are still handcrafted intuitively and often become a bottleneck in the integrated circuit design, thereby increasing the time to market. In this work, we address the problem of automatically solving an analog circuit design problem. Specifically, we propose methods to automate the transistor-level sizing of OpAmps. Given the specifications and the netlist of the OpAmp, our methodology produces a design that has the accuracy of the BSIM models used for simulation and the advantage of a quick design time. The approach is based on generating an initial first-order design and then refining it. In principle, the refining approach is a simulated-annealing scheme that uses (i) localized simulations and (ii) convex optimization scheme (COS). The optimal set of input variables for localized simulations has been selected by using techniques from Design of Experiments (DOE). To formulate the design problem as a COS problem, we have used monomial circuit models that are fitted from simulation data. These models accurately predict the performance of the circuit in the proximity of the initial guess. The models can also be used to gain valuable insight into the behavior of the circuit and understand the interrelations between the different performance constraints. A software framework that implements this methodology has been coded in SKILL language of Cadence. The methodology can be applied to design different OpAmp topologies across different technologies. In other words, the framework is both technology independent and topology independent. In addition, we develop a scheme to empirically model the small signal parameters like \u27gm\u27 and \u27gds\u27 of CMOS transistors. The monomial device models are reusable for a given technology and can be used to formulate the OpAmp design problem as a COS problem. The efficacy of the framework has been demonstrated by automatically designing different OpAmp topologies across different technologies. We designed a two-stage OpAmp and a telescopic OpAmp in TSMC025 and AMI016 technologies. Our results show significant (10–15%) improvement in the performance of both the OpAmps in both the technologies. While the methodology has shown encouraging results in the sub-micrometer regime, the effectiveness of the tool has to be investigated in the deep-sub-micron technologies

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Layoutautomatisierung im analogen IC-Entwurf mit formalisiertem und nicht-formalisiertem Expertenwissen

After more than three decades of electronic design automation, most layouts for analog integrated circuits are still handcrafted in a laborious manual fashion today. Obverse to the highly automated synthesis tools in the digital domain (coping with the quantitative difficulty of packing more and more components onto a single chip – a desire well known as More Moore), analog layout automation struggles with the many diverse and heavily correlated functional requirements that turn the analog design problem into a More than Moore challenge. Facing this qualitative complexity, seasoned layout engineers rely on their comprehensive expert knowledge to consider all design constraints that uncompromisingly need to be satisfied. This usually involves both formally specified and nonformally communicated pieces of expert knowledge, which entails an explicit and implicit consideration of design constraints, respectively. Existing automation approaches can be basically divided into optimization algorithms (where constraint consideration occurs explicitly) and procedural generators (where constraints can only be taken into account implicitly). As investigated in this thesis, these two automation strategies follow two fundamentally different paradigms denoted as top-down automation and bottom-up automation. The major trait of top-down automation is that it requires a thorough formalization of the problem to enable a self-intelligent solution finding, whereas a bottom-up automatism –controlled by parameters– merely reproduces solutions that have been preconceived by a layout expert in advance. Since the strengths of one paradigm may compensate the weaknesses of the other, it is assumed that a combination of both paradigms –called bottom-up meets top-down– has much more potential to tackle the analog design problem in its entirety than either optimization-based or generator-based approaches alone. Against this background, the thesis at hand presents Self-organized Wiring and Arrangement of Responsive Modules (SWARM), an interdisciplinary methodology addressing the design problem with a decentralized multi-agent system. Its basic principle, similar to the roundup of a sheep herd, is to let responsive mobile layout modules (implemented as context-aware procedural generators) interact with each other inside a user-defined layout zone. Each module is allowed to autonomously move, rotate and deform itself, while a supervising control organ successively tightens the layout zone to steer the interaction towards increasingly compact (and constraint compliant) layout arrangements. Considering various principles of self-organization and incorporating ideas from existing decentralized systems, SWARM is able to evoke the phenomenon of emergence: although each module only has a limited viewpoint and selfishly pursues its personal objectives, remarkable overall solutions can emerge on the global scale. Several examples exhibit this emergent behavior in SWARM, and it is particularly interesting that even optimal solutions can arise from the module interaction. Further examples demonstrate SWARM’s suitability for floorplanning purposes and its application to practical place-and-route problems. The latter illustrates how the interacting modules take care of their respective design requirements implicitly (i.e., bottom-up) while simultaneously paying respect to high level constraints (such as the layout outline imposed top-down by the supervising control organ). Experimental results show that SWARM can outperform optimization algorithms and procedural generators both in terms of layout quality and design productivity. From an academic point of view, SWARM’s grand achievement is to tap fertile virgin soil for future works on novel bottom-up meets top-down automatisms. These may one day be the key to close the automation gap in analog layout design.Nach mehr als drei Jahrzehnten Entwurfsautomatisierung werden die meisten Layouts für analoge integrierte Schaltkreise heute immer noch in aufwändiger Handarbeit entworfen. Gegenüber den hochautomatisierten Synthesewerkzeugen im Digitalbereich (die sich mit dem quantitativen Problem auseinandersetzen, mehr und mehr Komponenten auf einem einzelnen Chip unterzubringen – bestens bekannt als More Moore) kämpft die analoge Layoutautomatisierung mit den vielen verschiedenen und stark korrelierten funktionalen Anforderungen, die das analoge Entwurfsproblem zu einer More than Moore Herausforderung machen. Angesichts dieser qualitativen Komplexität bedarf es des umfassenden Expertenwissens erfahrener Layouter um sämtliche Entwurfsconstraints, die zwingend eingehalten werden müssen, zu berücksichtigen. Meist beinhaltet dies formal spezifiziertes als auch nicht-formal übermitteltes Expertenwissen, was eine explizite bzw. implizite Constraint Berücksichtigung nach sich zieht. Existierende Automatisierungsansätze können grundsätzlich unterteilt werden in Optimierungsalgorithmen (wo die Constraint Berücksichtigung explizit erfolgt) und prozedurale Generatoren (die Constraints nur implizit berücksichtigen können). Wie in dieser Arbeit eruiert wird, folgen diese beiden Automatisierungsstrategien zwei grundlegend unterschiedlichen Paradigmen, bezeichnet als top-down Automatisierung und bottom-up Automatisierung. Wesentliches Merkmal der top-down Automatisierung ist die Notwendigkeit einer umfassenden Problemformalisierung um eine eigenintelligente Lösungsfindung zu ermöglichen, während ein bottom-up Automatismus –parametergesteuert– lediglich Lösungen reproduziert, die vorab von einem Layoutexperten vorgedacht wurden. Da die Stärken des einen Paradigmas die Schwächen des anderen ausgleichen können, ist anzunehmen, dass eine Kombination beider Paradigmen –genannt bottom-up meets top down– weitaus mehr Potenzial hat, das analoge Entwurfsproblem in seiner Gesamtheit zu lösen als optimierungsbasierte oder generatorbasierte Ansätze für sich allein. Vor diesem Hintergrund stellt die vorliegende Arbeit Self-organized Wiring and Arrangement of Responsive Modules (SWARM) vor, eine interdisziplinäre Methodik, die das Entwurfsproblem mit einem dezentralisierten Multi-Agenten-System angeht. Das Grundprinzip besteht darin, ähnlich dem Zusammentreiben einer Schafherde, reaktionsfähige mobile Layoutmodule (realisiert als kontextbewusste prozedurale Generatoren) in einer benutzerdefinierten Layoutzone interagieren zu lassen. Jedes Modul darf sich selbständig bewegen, drehen und verformen, wobei ein übergeordnetes Kontrollorgan die Zone schrittweise verkleinert, um die Interaktion auf zunehmend kompakte (und constraintkonforme) Layoutanordnungen hinzulenken. Durch die Berücksichtigung diverser Selbstorganisationsgrundsätze und die Einarbeitung von Ideen bestehender dezentralisierter Systeme ist SWARM in der Lage, das Phänomen der Emergenz hervorzurufen: obwohl jedes Modul nur eine begrenzte Sichtweise hat und egoistisch seine eigenen Ziele verfolgt, können sich auf globaler Ebene bemerkenswerte Gesamtlösungen herausbilden. Mehrere Beispiele veranschaulichen dieses emergente Verhalten in SWARM, wobei besonders interessant ist, dass sogar optimale Lösungen aus der Modulinteraktion entstehen können. Weitere Beispiele demonstrieren SWARMs Eignung zwecks Floorplanning sowie die Anwendung auf praktische Place-and-Route Probleme. Letzteres verdeutlicht, wie die interagierenden Module ihre jeweiligen Entwurfsanforderungen implizit (also: bottom-up) beachten, während sie gleichzeitig High-Level-Constraints berücksichtigen (z.B. die Layoutkontur, die top-down vom übergeordneten Kontrollorgan auferlegt wird). Experimentelle Ergebnisse zeigen, dass Optimierungsalgorithmen und prozedurale Generatoren von SWARM sowohl bezüglich Layoutqualität als auch Entwurfsproduktivität übertroffen werden können. Aus akademischer Sicht besteht SWARMs große Errungenschaft in der Erschließung fruchtbaren Neulands für zukünftige Arbeiten an neuartigen bottom-up meets top-down Automatismen. Diese könnten eines Tages der Schlüssel sein, um die Automatisierungslücke im analogen Layoutentwurf zu schließen