Enabling Technologies for Optical Data Center Networks: Spatial Division Multiplexing

With the continuously growing popularity of cloud services, the traffic volume inside the\ua0data\ua0centers is dramatically increasing. As a result, a scalable and efficient infrastructure\ua0for\ua0data\ua0center\ua0networks\ua0(DCNs) is required. The current\ua0optical\ua0DCNs using either individual fibers or fiber ribbons are costly, bulky, hard to manage, and not scalable.\ua0Spatial\ua0division\ua0multiplexing\ua0(SDM) based on multicore or multimode (few-mode) fibers is recognized as a promising technology to increase the\ua0spatial\ua0efficiency\ua0for\ua0optical\ua0DCNs, which opens a new way towards high capacity and scalability. This tutorial provides an overview of the components, transmission options, and interconnect architectures\ua0for\ua0SDM-based DCNs, as well as potential technical challenges and future directions. It also covers the co-existence of SDM and other\ua0multiplexing\ua0techniques, such as wavelength-division\ua0multiplexing\ua0and flexible spectrum\ua0multiplexing, in\ua0optical\ua0DCNs

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Optical Switching for Scalable Data Centre Networks

This thesis explores the use of wavelength tuneable transmitters and control systems within the context of scalable, optically switched data centre networks. Modern data centres require innovative networking solutions to meet their growing power, bandwidth, and scalability requirements. Wavelength routed optical burst switching (WROBS) can meet these demands by applying agile wavelength tuneable transmitters at the edge of a passive network fabric. Through experimental investigation of an example WROBS network, the transmitter is shown to determine system performance, and must support ultra-fast switching as well as power efficient transmission. This thesis describes an intelligent optical transmitter capable of wideband sub-nanosecond wavelength switching and low-loss modulation. A regression optimiser is introduced that applies frequency-domain feedback to automatically enable fast tuneable laser reconfiguration. Through simulation and experiment, the optimised laser is shown to support 122×50 GHz channels, switching in less than 10 ns. The laser is deployed as a component within a new wavelength tuneable source (WTS) composed of two time-interleaved tuneable lasers and two semiconductor optical amplifiers. Switching over 6.05 THz is demonstrated, with stable switch times of 547 ps, a record result. The WTS scales well in terms of chip-space and bandwidth, constituting the first demonstration of scalable, sub-nanosecond optical switching. The power efficiency of the intelligent optical transmitter is further improved by introduction of a novel low-loss split-carrier modulator. The design is evaluated using 112 Gb/s/λ intensity modulated, direct-detection signals and a single-ended photodiode receiver. The split-carrier transmitter is shown to achieve hard decision forward error correction ready performance after 2 km of transmission using a laser output power of just 0 dBm; a 5.2 dB improvement over the conventional transmitter. The results achieved in the course of this research allow for ultra-fast, wideband, intelligent optical transmitters that can be applied in the design of all-optical data centres for power efficient, scalable networking

Energy Efficient and High Density Integrated Photonic Transceivers

Light, as a medium for communication, has the unique ability to transmit volumes of data with minimal energy loss. This capability not only sparked the revolution of internet-based communication over fiber optic networks, but also holds the potential to expand computing beyond our current capabilities. At present, data is stored densely in computer chips, but is sent out of the chip through centimeter-long electrical wires in a slow and energy-intensive process, before finally interfacing with optical transmitters. To bypass this bottleneck, electrical channels can be condensed and converted into light over a compact area using integrated photonic chips. In particular, the silicon photonics technology platform offers the potential for extremely dense data communications due to its high confinement waveguides and compact micro-resonators. However, three major obstacles stand in the way of realizing a low-energy and bandwidth-dense implementation of this technology: the integration of photonics with electronics, optical coupling from the photonic chip to fiber, and scaling up link architectures to multiplex data streams onto many wavelengths. The work in this thesis aims to confront these three challenges and advance integrated photonics technology to unprecedented bandwidth densities and energy efficiencies, with a focus on the first challenge of photonic-electronic integration. It begins with an overview of the escalating demand for inter-chip bandwidths and the potential solution offered by integrated photonics. Next, this thesis builds a theoretical framework for the performance parameters and sources of energy consumption that are addressed in the subsequent sections. After this introductory context, the thesis describes the achievement of the highest density and largest scale photonic-electronic integration to date, using a dense, 25 um pitch 3D bonding process. An 80-channel array fabricated in this integration records the lowest data link energies to date, at 120 fJ/bit, and transfers data at 10 Gbit/s/channel for a record 5.3 Tbit/s/mm2 bandwidth density. The discussion then shifts to the issue of chip-to-fiber coupling efficiency, traditionally the greatest source of loss in photonic links. A substrate-removed edge coupler design reduces this loss to a mere 1.1 dB, and an inverse-designed edge coupler taper shows a fourfold length reduction compared to linear tapers. Lastly, the thesis presents designs for wavelength scaling that increase the number of energy efficient channels on a single fiber. Specifically, it demonstrates a multi-channel, polarization diverse micro-comb receiver and a 3D-integrated transceiver with wavelength interleaving to waveguide buses of cascaded resonators. This thesis builds on photonic device developments to introduce photonic systems with the lowest energy and densest data communications to date. Together, these results unlock the tremendous potential of light as a fast and energy-efficient communication medium between chips, paving a sustainable path towards scaling artificial intelligence and disaggregating computation and memory resources

Silicon Photonic Subsystems for Inter-Chip Optical Networks

The continuous growth of electronic compute and memory nodes in terms of the number of I/O pins, bandwidth, and areal throughput poses major integration and packaging challenges associated with offloading multi-Tbit/s data rates within the few pJ/bit targets. While integrated photonics are already deployed in long and short distances such as inter and intra data centers communications, the promising characteristics of the silicon photonic platform set it as the future technology for optical interconnects in ultra short inter-chip distances. The high index contrast between the waveguide and the cladding together with strong thermo-optic and carrier effects in silicon allows developing a wide range of micro-scale and low power optical devices compatible with the CMOS fabrication processes. Furthermore, the availability of photonic foundries and new electrical and optical co-packaging techniques further pushes this platform for the next steps of commercial deployment. The work in this dissertation presents the current trends in high-performance memory and processor nodes and gives motivation for disaggregated and reconfigurable inter-chip network enabled with the silicon photonic layer. A dense WDM transceiver and broadband switch architectures are discussed to support a bi-directional network of ten hybrid-memory cubes (HMC) interconnected to ten processor nodes with an overall aggregated bandwidth of 9.6Tbit/s. Latency and energy consumption are key performance parameters in a processor to primary memory nodes connectivity. The transceiver design is based on energy-efficient micro-ring resonators, and the broadband switch is constructed with 2x2 Mach-Zehnder elements for nano-second reconfiguration. Each transceiver is based on hundreds of micro-rings to convert the native HMC electrical protocol to the optical domain and the switch is based on tens of hundreds of 2x2 elements to achieve non-blocking all-to-all connectivity. The next chapters focus on developing methods for controlling and monitoring such complex and highly integrated silicon photonic subsystems. The thermo-optic effect is characterized and we show experimentally that the phase of the optical carrier can be reliably controlled with pulse-width modulation (PWM) signal, ultimately relaxing the need for hundreds of digital to analog converters (DACs). We further show that doped waveguide heaters can be utilized as \textit{in-line} optical power monitors by measuring photo-conductance current, which is an alternative for the conventional tapping and integration of photo-diodes. The next part concerned with a common cascaded micro-ring resonator in a WDM transceiver design. We develop on an FPGA control algorithm that abstracts the physical layer and takes user-defined inputs to set the resonances to the desired wavelength in a unicast and multicast transmission modes. The associated sensitivities of these silicon ring resonators are presented and addressed with three closed-loop solutions. We first show a closed-loop operation based on tapping the error signal from the drop port of the micro-ring. The second solution presents a resonance wavelength locking with a single digital I/O for control and feedback signals. Lastly, we leverage the photo-conductance effect and demonstrate the locking procedure using only the doped heater for both control and feedback purposes. To achieve the inter-chip reconfigurability we discuss recent advances of high-port-count SiP broadband switches for reconfigurable inter-chip networks. To ensure optimal operation in terms of low insertion loss, low cross-talk and high signal integrity per routing path, hundreds of 2x2 Mach-Zehnder elements need to be biased precisely for the cross and bar states. We address this challenge with a tapless and a design agnostic calibration approach based on the photo-conductance effect. The automated algorithm returns a look-up table for all for each 2x2 element and the associated calibrated biases. Each routing scenario is then tested for insertion loss, crosstalk and bit-error rate of 25Gbit/s 4-level pulse amplitude modulation signals. The last part utilizes the Mach-Zehnder interferometers in WDM transceiver applications. We demonstrate a polarization insensitive four-channel WDM receiver with 40Gbit/s per channel and a transmitter design generating 8-level pulse amplitude modulation signals at 30Gbit/s

A review of gallium nitride LEDs for multi-gigabit-per-second visible light data communications

The field of visible light communications (VLC) has gained significant interest over the last decade, in both fibre and free-space embodiments. In fibre systems, the availability of low cost plastic optical fibre (POF) that is compatible with visible data communications has been a key enabler. In free-space applications, the availability of hundreds of THz of the unregulated spectrum makes VLC attractive for wireless communications. This paper provides an overview of the recent developments in VLC systems based on gallium nitride (GaN) light-emitting diodes (LEDs), covering aspects from sources to systems. The state-of-the-art technology enabling bandwidth of GaN LEDs in the range of >400 MHz is explored. Furthermore, advances in key technologies, including advanced modulation, equalisation, and multiplexing that have enabled free-space VLC data rates beyond 10 Gb/s are also outlined

Graphene Modulators for Silicon Photonic Optical Links

The backbone of today’s society is the transfer of information. Next-generation data network infrastructures need to support Tb/s data rates. Existing optical fibre communication networks cannot support Tb/s data transmission without consuming an unsustainable amount of power. Optical transceivers send and receive information encoded in light, relying on electro-optic modulators to convert the electrical data signal into the optical domain, and photodetectors to convert the optical signal back into the electrical domain. Power consumption can be reduced by using efficient and compact modulators and photodetectors to integrate the optics closer to the electronics and thus minimise the losses of electrical interconnect at high frequencies. Si photonics technology offers a cost-effective solution for fabricating integrated photonic circuits by combining electronic and photonic components in the same circuit by using existing CMOS technology. This thesis focuses on the development of a scalable graphene-based platform for integrated photonics, and specifically on the electrooptic modulator. I have focused on a double single-layer graphene modulator design in three different configurations that can be used for different types of optical links. This includes a graphene-based electro-absorption modulator, ring resonator modulator, and Mach-Zehnder modulator. The double-layer structure enables the absorption and phase of an optical carrier signal to be electrostatically controlled without the need for doped waveguides. This is the most efficient graphene-based phase modulator to-date with an extracted VπL ∼ 0.12 V·cm, which is ∼ 2 times better than the lowest reported graphene phase modulator. As well as showing very efficient phase modulation, the graphene phase modulator is capable of being operated in the transparency regime where graphene becomes transparent to absorption via interband transitions. Operating in the transparency regime means that the graphene phase modulator is capable of pure phase modulation which is a desirable property for complex modulation formats. Benefiting from efficient phase modulation, the graphene ring resonator modulator has demonstrated an FOM(EA) ∼ 4.48, ∼ 2 times better than the highest currently reported for graphene-based modulators. These results represent a step towards the development of a future graphene-based platform for efficient and compact modulators and photodetectors needed for next-generation optical links

Novel Multicarrier Memory Channel Architecture Using Microwave Interconnects: Alleviating the Memory Wall

abstract: The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon. A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel. Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201