Power-efficient high-speed interface circuit techniques

Inter- and intra-chip connections have become the new challenge to enable the scaling of computing systems, ranging from mobile devices to high-end servers. Demand for aggregate I/O bandwidth has been driven by applications including high-speed ethernet, backplane micro-servers, memory, graphics, chip-to-chip and network onchip. I/O circuitry is becoming the major power consumer in SoC processors and memories as the increasing bandwidth demands larger per-pin data rate or larger I/O pin count per component. The aggregate I/O bandwidth has approximately doubled every three to four years across a diverse range of standards in different applications. However, in order to keep pace with these standards enabled in part by process-technology scaling, we will require more than just device scaling in the near future. New energy-efficient circuit techniques must be proposed to enable the next generations of handheld and high-performance computers, given the thermal and system-power limits they start facing. ^ In this work, we are proposing circuit architectures that improve energy efficiency without decreasing speed performance for the most power hungry circuits in high speed interfaces. By the introduction of a new kind of logic operators in CMOS, called implication operators, we implemented a new family of high-speed frequency dividers/prescalers with reduced footprint and power consumption. New techniques and circuits for clock distribution, for pre-emphasis and for driver at the transmitter side of the I/O circuitry have been proposed and implemented. At the receiver side, new DFE architecture and CDR have been proposed and have been proven experimentally

A 1.25 Gbit/s serializer for LHC data and trigger optical links

Several LHC detectors require high-speed digital optical links for data transmission in both data readout and trigger systems. Commercial components can be found that meet the bandwidth requirements of most of the LHC detectors subsystems. However, they fail to meet some of the requirements frequently encountered in the LHC-HEP environment, namely: resistance to high radiation doses and operation tolerant to single event upsets. To address these problems, a high-speed transmitter ASIC (1.2Gbit/s), containing a serializer and a clock multiplying PLL was developed. The prototype was implemented in a mainstream 0.25um CMOS technology and was designed using well-established radiation tolerant layout practices to achieve resistance to high radiation doses. This implementation serves as a base for the development of radiation tolerant IC’s that will make feasible the transmission of data using common local area networks protocols in typical LHC radiation hard environments. The ASIC was embedded in a test setup that uses a commercial optical receiver and de-serializer. Error free data transmission at 1.2Gbit/s was achieved proving the prototypes to be fully functional. 1

High-speed equalization and transmission in electrical interconnections

The relentless growth of data traffic and increasing digital signal processing capabilities of integrated circuits (IC) are demanding ever faster chip-to-chip / chip-to-module serial electrical interconnects. As data rates increase, the signal quality after transmission over printed circuit board (PCB) interconnections is severely impaired. Frequency-dependent loss and crosstalk noise lead to a reduced eye opening, a reduced signal-to-noise ratio and an increased inter-symbol interference (ISI). This, in turn, requires the use of improved signal processing or PCB materials, in order to overcome the bandwidth (BW) limitations and to improve signal integrity. By applying an optimal combination of equalizer and receiver electronics together with BW-efficient modulation schemes, the transmission rate over serial electrical interconnections can be pushed further. At the start of this research, most industrial backplane connectors, meeting the IEEE and OIF specifications such as manufactured by e.g. FCI or TE connectivity, had operational capabilities of up to 25 Gb/s. This research was mainly performed under the IWT ShortTrack project. The goal of this research was to increase the transmission speed over electrical backplanes up to 100 Gb/s per channel for next-generation telecom systems and data centers. This requirement greatly surpassed the state-ofthe-art reported in previous publications, considering e.g. 25 Gb/s duobinary and 42.8 Gb/s PAM-4 transmission over a low-loss Megtron 6 electrical backplane using off-line processing. The successful implementation of the integrated transmitter (TX) and receiver (RX) (1) , clearly shows the feasibility of single lane interconnections beyond 80 Gb/s and opens the potential of realizing industrial 100 Gb/s links using a recent IC technology process. Besides the advancement of the state-of-the-art in the field of high-speed transceivers and backplane transmission systems, which led to several academic publications, the output of this work also attracts a lot of attention from the industry, showing the potential to commercialize the developed chipset and technologies used in this research for various applications: not only in high-speed electrical transmission links, but also in high-speed opto-electronic communications such as access, active optical cables and optical backplanes. In this dissertation, the background of this research, an overview of this work and the thesis organization are illustrated in Chapter 1. In Chapter 2, a system level analysis is presented, showing that the channel losses are limiting the transmission speed over backplanes. In order to enhance the serial data rate over backplanes and to eliminate the signal degradation, several technologies are discussed, such as signal equalization and modulation techniques. First, a prototype backplane channel, from project partner FCI, implemented with improved backplane connectors is characterized. Second, an integrated transversal filter as a feed-forward equalizer (FFE) is selected to perform the signal equalization, based on a comprehensive consideration of the backplane channel performance, equalization capabilities, implementation complexity and overall power consumption. NRZ, duobinary and PAM-4 are the three most common modulation schemes for ultra-high speed electrical backplane communication. After a system-level simulation and comparison, the duobinary format is selected due to its high BW efficiency and reasonable circuit complexity. Last, different IC technology processes are compared and the ST microelectronics BiCMOS9MW process (featuring a fT value of over 200 GHz) is selected, based on a trade-off between speed and chip cost. Meanwhile it also has a benefit for providing an integrated microstrip model, which is utilized for the delay elements of the FFE. Chapter 3 illustrates the chip design of the high-speed backplane TX, consisting of a multiplexer (MUX) and a 5-tap FFE. The 4:1 MUX combines four lower rate streams into a high-speed differential NRZ signal up to 100 Gb/s as the FFE input. The 5-tap FFE is implemented with a novel topology for improved testability, such that the FFE performance can be individually characterized, in both frequency- and time-domain, which also helps to perform the coefficient optimization of the FFE. Different configurations for the gain cell in the FFE are compared. The gilbert configuration shows most advantages, in both a good high-frequency performance and an easy way to implement positive / negative amplification. The total chip, including the MUX and the FFE, consumes 750mW from a 2.5V supply and occupies an area of 4.4mm × 1.4 mm. In Chapter 4, the TX chip is demonstrated up to 84 Gb/s. First, the FFE performance is characterized in the frequency domain, showing that the FFE is able to work up to 84 Gb/s using duobinary formats. Second, the combination of the MUX and the FFE is tested. The equalized TX outputs are captured after different channels, for both NRZ and duobinary signaling at speeds from 64 Gb/s to 84 Gb/s. Then, by applying the duobinary RX 2, a serial electrical transmission link is demonstrated across a pair of 10 cm coax cables and across a 5 cm FX-2 differential stripline. The 5-tap FFE compensates a total loss between the TX and the RX chips of about 13.5 dB at the Nyquist frequency, while the RX receives the equalized signal and decodes the duobinary signal to 4 quarter rate NRZ streams. This shows a chip-to-chip data link with a bit error rate (BER) lower than 10−11. Last, the electrical data transmission between the TX and the RX over two commercial backplanes is demonstrated. An error-free, serial duobinary transmission across a commercial Megtron 6, 11.5 inch backplane is demonstrated at 48 Gb/s, which indicates that duobinary outperforms NRZ for attaining higher speed or longer reach backplane applications. Later on, using an ExaMAX® backplane demonstrator, duobinary transmission performance is verified and the maximum allowed channel loss at 40 Gb/s transmission is explored. The eye diagram and BER measurements over a backplane channel up to 26.25 inch are performed. The results show that at 40 Gb/s, a total channel loss up to 37 dB at the Nyquist frequency allows for error-free duobinary transmission, while a total channel loss of 42 dB was overcome with a BER below 10−8. An overview of the conclusions is summarized in Chapter 5, along with some suggestions for further research in this field. (1) The duobinary receiver was developed by my colleague Timothy De Keulenaer, as described in his PhD dissertation. (2) Described in the PhD dissertation of Timothy De Keulenaer

Optoelectronic fiber webs for imaging applications

Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.Includes bibliographical references (p. 73).We demonstrate the use of novel visible and infrared light-sensitive optoelectronic fiber in the development of large scale photodector arrays. Unlike conventional point photodetectors these one-dimensional linear photodectors are capable of sensing light along the entire length of the fiber and 360 radially. Multiple fibers can be arranged in an orthogonal grid to create a two-dimensional fiber web. The fiber web is capable of tracking a time-and space-varying beam, and output it onto a computer screen. Other imaging applications for the fiber web include image recovery for 2D images based on Computed Axial Tomography concepts. and lensless imaging. Lensless imaging is accomplished d using two fiber webs separated by a fixed distance, recovering the intensity distribution on each fiber web, and applying a phase retrieval algorithm to the two distributions. Furthermore, fiber webs consisting of six planar arrays forming a cube can be used to detect incident light in three dimensions.by Jerimy Reeves Arnold.M.Eng

On-board processing satellite network architecture and control study

The market for telecommunications services needs to be segmented into user classes having similar transmission requirements and hence similar network architectures. Use of the following transmission architecture was considered: satellite switched TDMA; TDMA up, TDM down; scanning (hopping) beam TDMA; FDMA up, TDM down; satellite switched MF/TDMA; and switching Hub earth stations with double hop transmission. A candidate network architecture will be selected that: comprises multiple access subnetworks optimized for each user; interconnects the subnetworks by means of a baseband processor; and optimizes the marriage of interconnection and access techniques. An overall network control architecture will be provided that will serve the needs of the baseband and satellite switched RF interconnected subnetworks. The results of the studies shall be used to identify elements of network architecture and control that require the greatest degree of technology development to realize an operational system. This will be specified in terms of: requirements of the enabling technology; difference from the current available technology; and estimate of the development requirements needed to achieve an operational system. The results obtained for each of these tasks are presented

A high speed serializer/deserializer design

A Serializer/Deserializer (SerDes) is a circuit that converts parallel data into a serial stream and vice versa. It helps solve clock/data skew problems, simplifies data transmission, lowers the power consumption and reduces the chip cost. The goal of this project was to solve the challenges in high speed SerDes design, which included the low jitter design, wide bandwidth design and low power design. A quarter-rate multiplexer/demultiplexer (MUX/DEMUX) was implemented. This quarter-rate structure decreases the required clock frequency from one half to one quarter of the data rate. It is shown that this significantly relaxes the design of the VCO at high speed and achieves lower power consumption. A novel multi-phase LC-ring oscillator was developed to supply a low noise clock to the SerDes. This proposed VCO combined an LC-tank with a ring structure to achieve both wide tuning range (11%) and low phase noise (-110dBc/Hz at 1MHz offset). With this structure, a data rate of 36 Gb/s was realized with a measured peak-to-peak jitter of 10ps using 0.18microm SiGe BiCMOS technology. The power consumption is 3.6W with 3.4V power supply voltage. At a 60 Gb/s data rate the simulated peak-to-peak jitter was 4.8ps using 65nm CMOS technology. The power consumption is 92mW with 2V power supply voltage. A time-to-digital (TDC) calibration circuit was designed to compensate for the phase mismatches among the multiple phases of the PLL clock using a three dimensional fully depleted silicon on insulator (3D FDSOI) CMOS process. The 3D process separated the analog PLL portion from the digital calibration portion into different tiers. This eliminated the noise coupling through the common substrate in the 2D process. Mismatches caused by the vertical tier-to-tier interconnections and the temperature influence in the 3D process were attenuated by the proposed calibration circuit. The design strategy and circuits developed from this dissertation provide significant benefit to both wired and wireless applications

Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission

The emerging three-dimensional (3D) integration technology is expected to lead to an industry paradigm shift due to its tremendous benefits. Intense research activities are going on about technology, simulation, design, and product prototypes. This thesis work aims at fabricating through-silicon vias (TSVs) on diced processor chips, and later bonding them into a 3D-stacked chip. How to handle and process delicate processor chips with high alignment precision is a key issue. The TSV process to be developed also needs to adapt to this constraint. Four TSV processes have been studied. Among them, the ring-trench TSV process demonstrates the feasibility of fabricating TSVs with the prevailing dimensions, and the whole-through TSV process achieves the first dummy chip post-processed with TSVs in EPFL although the dimension is rather large to keep a reasonable aspect ratio (AR). Four self-alignment (SA) techniques have been investigated, among which the gravitational SA and the hydrophobic SA are found to be quite promising. Using gravitational SA, we come to the conclusion that cavities in silicon carrier wafer with a profile angle of 60° can align the chips with less than 20 µm inaccuracies. The alignment precision can be improved after adopting more advanced dicing tools instead of using the traditional dicing saws and larger cavity profile angle. Such inaccuracy will be sufficient to align the relatively large TSVs for general products such as 3D image sensors. By fabricating bottom TSVs in the carrier wafer, a 3D silicon interposer idea has been proposed to stack another chip, e.g. a processor chip, on the other side of the carrier wafer. But stacking microprocessor chips fabricated with TSVs will require higher alignment precision. A hydrophobic SA technique using the surface tension force generated by the water-to-air interfaces around the pads can greatly reduce the alignment inaccuracy to less than 1 µm. This low-cost and high throughput SA procedure is processed in air, fully-compatible with current fabrication technologies, and highly stable and repeatable. We present a theoretical meniscus model to predict SA results and to provide the design rules. This technique is quite promising for advanced 3D applications involving logic and heterogeneous stacking. As TSVs' dimensions in the chip-level 3D integration are constrained by the chip-level processes, such as bonding, the smallest TSVs might still be about 5 µm. Thus, the area occupied by the TSVs cannot be neglected. Fortunately, TSVs can withstand very high bandwidths, meaning that data can be serialized and transmitted using less numbers of TSVs. With 20 µm TSVs, the 2-Gb/s 8:1 serial link implemented saves 75% of the area of its 8-bit parallel counterpart. The quasi-serial link proposed can effectively balance the inter-layer bandwidth and the serial links' area consumption. The area model of the serial or quasi-serial links working under higher frequencies provides some guidelines to choose the proper serial link design, and it also predicts that when TSV diameter shrinks to 5 µm, it will be difficult to keep this area benefit if without some novel circuit design techniques. As the serial links can be implemented with less area, the bandwidth per unit area is increased. Two scenarios are studied, single-port memory access and multi-port memory access. The expanded inter-layer bandwidth by serialization does not improve the system performance because of the bus-bottleneck problem. In the latter scenario, the inter-layer ultra-wide bandwidth can be exploited as each memory bank can be accessed randomly through the NoC. Thus further widening the inter-layer bandwidth through serialization, the system performance will be improved

Electro-optic architecture (EOA) for sensors and actuators in aircraft propulsion systems

Results of a study to design an optimal architecture for electro-optical sensing and control in advanced aircraft and space systems are described. The propulsion full authority digital Electronic Engine Control (EEC) was the focus for the study. The recommended architecture is an on-engine EEC which contains electro-optic interface circuits for fiber-optic sensors on the engine. Size and weight are reduced by multiplexing arrays of functionally similar sensors on a pair of optical fibers to common electro-optical interfaces. The architecture contains common, multiplex interfaces to seven sensor groups: (1) self luminous sensors; (2) high temperatures; (3) low temperatures; (4) speeds and flows; (5) vibration; (6) pressures; and (7) mechanical positions. Nine distinct fiber-optic sensor types were found to provide these sensing functions: (1) continuous wave (CW) intensity modulators; (2) time division multiplexing (TDM) digital optic codeplates; (3) time division multiplexing (TDM) analog self-referenced sensors; (4) wavelength division multiplexing (WDM) digital optic code plates; (5) wavelength division multiplexing (WDM) analog self-referenced intensity modulators; (6) analog optical spectral shifters; (7) self-luminous bodies; (8) coherent optical interferometers; and (9) remote electrical sensors. The report includes the results of a trade study including engine sensor requirements, environment, the basic sensor types, and relevant evaluation criteria. These figures of merit for the candidate interface types were calculated from the data supplied by leading manufacturers of fiber-optic sensors

Speeding-up model-based fault injection of deep-submicron CMOS fault models through dynamic and partially reconfigurable FPGAS

Actualmente, las tecnologías CMOS submicrónicas son básicas para el desarrollo de los modernos sistemas basados en computadores, cuyo uso simplifica enormemente nuestra vida diaria en una gran variedad de entornos, como el gobierno, comercio y banca electrónicos, y el transporte terrestre y aeroespacial. La continua reducción del tamaño de los transistores ha permitido reducir su consumo y aumentar su frecuencia de funcionamiento, obteniendo por ello un mayor rendimiento global. Sin embargo, estas mismas características que mejoran el rendimiento del sistema, afectan negativamente a su confiabilidad. El uso de transistores de tamaño reducido, bajo consumo y alta velocidad, está incrementando la diversidad de fallos que pueden afectar al sistema y su probabilidad de aparición. Por lo tanto, existe un gran interés en desarrollar nuevas y eficientes técnicas para evaluar la confiabilidad, en presencia de fallos, de sistemas fabricados mediante tecnologías submicrónicas. Este problema puede abordarse por medio de la introducción deliberada de fallos en el sistema, técnica conocida como inyección de fallos. En este contexto, la inyección basada en modelos resulta muy interesante, ya que permite evaluar la confiabilidad del sistema en las primeras etapas de su ciclo de desarrollo, reduciendo por tanto el coste asociado a la corrección de errores. Sin embargo, el tiempo de simulación de modelos grandes y complejos imposibilita su aplicación en un gran número de ocasiones. Esta tesis se centra en el uso de dispositivos lógicos programables de tipo FPGA (Field-Programmable Gate Arrays) para acelerar los experimentos de inyección de fallos basados en simulación por medio de su implementación en hardware reconfigurable. Para ello, se extiende la investigación existente en inyección de fallos basada en FPGA en dos direcciones distintas: i) se realiza un estudio de las tecnologías submicrónicas existentes para obtener un conjunto representativo de modelos de fallos transitoriosAndrés Martínez, DD. (2007). Speeding-up model-based fault injection of deep-submicron CMOS fault models through dynamic and partially reconfigurable FPGAS [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/1943Palanci