Different approaches to community detection

A precise definition of what constitutes a community in networks has remained elusive. Consequently, network scientists have compared community detection algorithms on benchmark networks with a particular form of community structure and classified them based on the mathematical techniques they employ. However, this comparison can be misleading because apparent similarities in their mathematical machinery can disguise different reasons for why we would want to employ community detection in the first place. Here we provide a focused review of these different motivations that underpin community detection. This problem-driven classification is useful in applied network science, where it is important to select an appropriate algorithm for the given purpose. Moreover, highlighting the different approaches to community detection also delineates the many lines of research and points out open directions and avenues for future research.Comment: 14 pages, 2 figures. Written as a chapter for forthcoming Advances in network clustering and blockmodeling, and based on an extended version of The many facets of community detection in complex networks, Appl. Netw. Sci. 2: 4 (2017) by the same author

VLSI Design

This book provides some recent advances in design nanometer VLSI chips. The selected topics try to present some open problems and challenges with important topics ranging from design tools, new post-silicon devices, GPU-based parallel computing, emerging 3D integration, and antenna design. The book consists of two parts, with chapters such as: VLSI design for multi-sensor smart systems on a chip, Three-dimensional integrated circuits design for thousand-core processors, Parallel symbolic analysis of large analog circuits on GPU platforms, Algorithms for CAD tools VLSI design, A multilevel memetic algorithm for large SAT-encoded problems, etc

Overview of Large-Scale Computing: The Past, the Present, and the Future

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A generalization of Dijkstra's shortest path algorithm with applications to VLSI routing

AbstractWe generalize Dijkstra's algorithm for finding shortest paths in digraphs with non-negative integral edge lengths. Instead of labeling individual vertices we label subgraphs which partition the given graph. We can achieve much better running times if the number of involved subgraphs is small compared to the order of the original graph and the shortest path problems restricted to these subgraphs is computationally easy.As an application we consider the VLSI routing problem, where we need to find millions of shortest paths in partial grid graphs with billions of vertices. Here, our algorithm can be applied twice, once in a coarse abstraction (where the labeled subgraphs are rectangles), and once in a detailed model (where the labeled subgraphs are intervals). Using the result of the first algorithm to speed up the second one via goal-oriented techniques leads to considerably reduced running time. We illustrate this with a state-of-the-art routing tool on leading-edge industrial chips

Dynamic bandwidth allocation in ATM networks

Includes bibliographical references.This thesis investigates bandwidth allocation methodologies to transport new emerging bursty traffic types in ATM networks. However, existing ATM traffic management solutions are not readily able to handle the inevitable problem of congestion as result of the bursty traffic from the new emerging services. This research basically addresses bandwidth allocation issues for bursty traffic by proposing and exploring the concept of dynamic bandwidth allocation and comparing it to the traditional static bandwidth allocation schemes

Reliable SPICE Simulations of Memristors, Memcapacitors and Meminductors

Memory circuit elements, namely memristive, memcapacitive and meminductive systems, are gaining considerable attention due to their ubiquity and use in diverse areas of science and technology. Their modeling within the most widely used environment, SPICE, is thus critical to make substantial progress in the design and analysis of complex circuits. Here, we present a collection of models of different memory circuit elements and provide a methodology for their accurate and reliable modeling in the SPICE environment. We also provide codes of these models written in the most popular SPICE versions (PSpice, LTspice, HSPICE) for the benefit of the reader. We expect this to be of great value to the growing community of scientists interested in the wide range of applications of memory circuit elements

CAD methodologies for low power and reliable 3D ICs

The main objective of this dissertation is to explore and develop computer-aided-design (CAD) methodologies and optimization techniques for reliability, timing performance, and power consumption of through-silicon-via(TSV)-based and monolithic 3D IC designs. The 3D IC technology is a promising answer to the device scaling and interconnect problems that industry faces today. Yet, since multiple dies are stacked vertically in 3D ICs, new problems arise such as thermal, power delivery, and so on. New physical design methodologies and optimization techniques should be developed to address the problems and exploit the design freedom in 3D ICs. Towards the objective, this dissertation includes four research projects. The first project is on the co-optimization of traditional design metrics and reliability metrics for 3D ICs. It is well known that heat removal and power delivery are two major reliability concerns in 3D ICs. To alleviate thermal problem, two possible solutions have been proposed: thermal-through-silicon-vias (T-TSVs) and micro-fluidic-channel (MFC) based cooling. For power delivery, a complex power distribution network is required to deliver currents reliably to all parts of the 3D IC while suppressing the power supply noise to an acceptable level. However, these thermal and power networks pose major challenges in signal routability and congestion. In this project, a co-optimization methodology for signal, power, and thermal interconnects in 3D ICs is presented. The goal of the proposed approach is to improve signal, thermal, and power noise metrics and to provide fast and accurate design space explorations for early design stages. The second project is a study on 3D IC partition. For a 3D IC, the target circuit needs to be partitioned into multiple parts then mapped onto the dies. The partition style impacts design quality such as footprint, wirelength, timing, and so on. In this project, the design methodologies of 3D ICs with different partition styles are demonstrated. For the LEON3 multi-core microprocessor, three partitioning styles are compared: core-level, block-level, and gate-level. The design methodologies for such partitioning styles and their implications on the physical layout are discussed. Then, to perform timing optimizations for 3D ICs, two timing constraint generation methods are demonstrated that lead to different design quality. The third project is on the buffer insertion for timing optimization of 3D ICs. For high performance 3D ICs, it is crucial to perform thorough timing optimizations. Among timing optimization techniques, buffer insertion is known to be the most effective way. The TSVs have a large parasitic capacitance that increases the signal slew and the delay on the downstream. In this project, a slew-aware buffer insertion algorithm is developed that handles full 3D nets and considers TSV parasitics and slew effects on delay. Compared with the well-known van Ginneken algorithm and a commercial tool, the proposed algorithm finds buffering solutions with lower delay values and acceptable runtime overhead. The last project is on the ultra-high-density logic designs for monolithic 3D ICs. The nano-scale 3D interconnects available in monolithic 3D IC technology enable ultra-high-density device integration at the individual transistor-level. The benefits and challenges of monolithic 3D integration technology for logic designs are investigated. First, a 3D standard cell library for transistor-level monolithic 3D ICs is built and their timing and power behavior are characterized. Then, various interconnect options for monolithic 3D ICs that improve design quality are explored. Next, timing-closed, full-chip GDSII layouts are built and iso-performance power comparisons with 2D IC designs are performed. Important design metrics such as area, wirelength, timing, and power consumption are compared among transistor-level monolithic 3D, gate-level monolithic 3D, TSV-based 3D, and traditional 2D designs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin; Committee Member: Mukhopadhyay, Saiba

Efficient Interconnection Schemes for VLSI and Parallel Computation

This thesis is primarily concerned with two problems of interconnecting components in VLSI technologies. In the first case, the goal is to construct efficient interconnection networks for general-purpose parallel computers. The second problem is a more specialized problem in the design of VLSI chips, namely multilayer channel routing. In addition, a final part of this thesis provides lower bounds on the area required for VLSI implementations of finite-state machines. This thesis shows that networks based on Leiserson\u27s fat-tree architecture are nearly as good as any network built in a comparable amount of physical space. It shows that these universal networks can efficiently simulate competing networks by means of an appropriate correspondence between network components and efficient algorithms for routing messages on the universal network. In particular, a universal network of area A can simulate competing networks with O(lg^3A) slowdown (in bit-times), using a very simple randomized routing algorithm and simple network components. Alternatively, a packet routing scheme of Leighton, Maggs, and Rao can be used in conjunction with more sophisticated switching components to achieve O(lg^2 A) slowdown. Several other important aspects of universality are also discussed. It is shown that universal networks can be constructed in area linear in the number of processors, so that there is no need to restrict the density of processors in competing networks. Also results are presented for comparisons between networks of different size or with processors of different sizes (as determined by the amount of attached memory). Of particular interest is the fact that a universal network built from sufficiently small processors can simulate (with the slowdown already quoted) any competing network of comparable size regardless of the size of processors in the competing network. In addition, many of the results given do not require the usual assumption of unit wire delay. Finally, though most of the discussion is in the two-dimensional world, the results are shown to apply in three dimensions by way of a simple demonstration of general results on graph layout in three dimensions. The second main problem considered in this thesis is channel routing when many layers of interconnect are available, a scenario that is becoming more and more meaningful as chip fabrication technologies advance. This thesis describes a system MulCh for multilayer channel routing which extends the Chameleon system developed at U. C. Berkeley. Like Chameleon, MulCh divides a multilayer problem into essentially independent subproblems of at most three layers, but unlike Chameleon, MulCh considers the possibility of using partitions comprised of a single layer instead of only partitions of two or three layers. Experimental results show that MulCh often performs better than Chameleon in terms of channel width, total net length, and number of vias. In addition to a description of MulCh as implemented, this thesis provides improved algorithms for subtasks performed by MulCh, thereby indicating potential improvements in the speed and performance of multilayer channel routing. In particular, a linear time algorithm is given for determining the minimum width required for a single-layer channel routing problem, and an algorithm is given for maintaining the density of a collection of nets in logarithmic time per net insertion. The last part of this thesis shows that straightforward techniques for implementing finite-state machines are optimal in the worst case. Specifically, for any s and k, there is a deterministic finite-state machine with s states and k symbols such that any layout algorithm requires (ks lg s) area to lay out its realization. For nondeterministic machines, there is an analogous lower bound of (ks^2) area

Advanced photonic and electronic systems WILGA 2018

WILGA annual symposium on advanced photonic and electronic systems has been organized by young scientist for young scientists since two decades. It traditionally gathers around 400 young researchers and their tutors. Ph.D students and graduates present their recent achievements during well attended oral sessions. Wilga is a very good digest of Ph.D. works carried out at technical universities in electronics and photonics, as well as information sciences throughout Poland and some neighboring countries. Publishing patronage over Wilga keep Elektronika technical journal by SEP, IJET and Proceedings of SPIE. The latter world editorial series publishes annually more than 200 papers from Wilga. Wilga 2018 was the XLII edition of this meeting. The following topical tracks were distinguished: photonics, electronics, information technologies and system research. The article is a digest of some chosen works presented during Wilga 2018 symposium. WILGA 2017 works were published in Proc. SPIE vol.10445. WILGA 2018 works were published in Proc. SPIE vol.10808