IEEE Standard 1500 Compliance Verification for Embedded Cores

Core-based design and reuse are the two key elements for an efficient system-on-chip (SoC) development. Unfortunately, they also introduce new challenges in SoC testing, such as core test reuse and the need of a common test infrastructure working with cores originating from different vendors. The IEEE 1500 Standard for Embedded Core Testing addresses these issues by proposing a flexible hardware test wrapper architecture for embedded cores, together with a core test language (CTL) used to describe the implemented wrapper functionalities. Several intellectual property providers have already announced IEEE Standard 1500 compliance in both existing and future design blocks. In this paper, we address the problem of guaranteeing the compliance of a wrapper architecture and its CTL description to the IEEE Standard 1500. This step is mandatory to fully trust the wrapper functionalities in applying the test sequences to the core. We present a systematic methodology to build a verification framework for IEEE Standard 1500 compliant cores, allowing core providers and/or integrators to verify the compliance of their products (sold or purchased) to the standar

New Structure of Test Pattern Generator Stimulating Crosstalks in Bus-type Connections

The paper discloses the idea of a new structure for a Test Pattern Generator (TPG) for detection of crosstalk faults that may happen to bus-type interconnections between built-in blocks within a System on a Chip structure. The new idea is an improvement of the TPG design proposed by the author in one of previous studies. The TPG circuit is meant to generate test sequences that guarantee detection of all crosstalk faults with the capacitance nature that may occur between individual lines within an interconnecting bus. The study comprises a synthesizable and parameterized model developed for the presented TPG in the VLSI Hardware Description Language (VHDL) with further investigation of properties and features of the offered module. The significant advantages of the proposed TPG structure include less area occupied on a chip and higher operation frequency as compared to other solutions. In addition, the design demonstrates good scalability in terms of both the hardware overhead and the length of the generated test sequence

High Performance, Point-to-Point, Transmission Line Signaling

Inter-chip signaling latency and bandwidth can be key factors limiting the performance of large VLSI systems. We present a high performance, transmission line signaling scheme for point-to-point communications between VLSI components. In particular, we detail circuitry which allows a pad driver to sense the voltage level on the attached pad during signaling and adjust the drive impedance to match the external transmission line impedance. This allows clean, reflection-free signaling despite the wide range of variations common in IC device processing and interconnect fabrication. Further, we show how similar techniques can be used to adjust the arrival time of signals to allow high signaling bandwidth despite variations in interconnect delays. This scheme employed for high performance signaling is a specific embodiment of a more general technique. Conventional electronic systems must accommodate a range of system characteristics (e.g. delay, voltage, impedance). As a result, circuit designers traditionally build large operating margins into their circuits to guarantee proper operation across all possible ranges of these characteristics. These margins are generally added at the expense of performance. The alternative scheme exemplified here is to sample these system characteristics in the device\u27s final operating environment and use this feedback to tune system operation around the observed characteristics. This tuning operation reduces the range of characteristics the system must accommodate, allowing increased performance. We briefly contrast this sampled, system-level feedback with the more conventional, fine-grained feedback employed on ICs (e.g. PLLs)

Studies on Core-Based Testing of System-on-Chips Using Functional Bus and Network-on-Chip Interconnects

The tests of a complex system such as a microprocessor-based system-onchip (SoC) or a network-on-chip (NoC) are difficult and expensive. In this thesis, we propose three core-based test methods that reuse the existing functional interconnects-a flat bus, hierarchical buses of multiprocessor SoC's (MPSoC), and a N oC-in order to avoid the silicon area cost of a dedicated test access mechanism (TAM). However, the use of functional interconnects as functional TAM's introduces several new problems. During tests, the interconnects-including the bus arbitrator, the bus bridges, and the NoC routers-operate in the functional mode to transport the test stimuli and responses, while the core under tests (CUT) operate in the test mode. Second, the test data is transported to the CUT through the functional bus, and not directly to the test port. Therefore, special core test wrappers that can provide the necessary control signals required by the different functional interconnect are proposed. We developed two types of wrappers, one buffer-based wrapper for the bus-based systems and another pair of complementary wrappers for the NoCbased systems. Using the core test wrappers, we propose test scheduling schemes for the three functionally different types of interconnects. The test scheduling scheme for a flat bus is developed based on an efficient packet scheduling scheme that minimizes both the buffer sizes and the test time under a power constraint. The schedulingscheme is then extended to take advantage of the hierarchical bus architecture of the MPSoC systems. The third test scheduling scheme based on the bandwidth sharing is developed specifically for the NoC-based systems. The test scheduling is performed under the objective of co-optimizing the wrapper area cost and the resulting test application time using the two complementary NoC wrappers. For each of the proposed methodology for the three types of SoC architec .. ture, we conducted a thorough experimental evaluation in order to verify their effectiveness compared to other methods

Test Planning for 3D SICs using ILP

In this paper we propose a test planning scheme for corebased 3D stacked integrated circuits where the total test cost for wafer sort of each individual chip and the test cost of the complete stack at package test is minimized. We use an Integer Linear Programming (ILP) model to find the optimal test cost, which is given as the weighted sum of the test time and the test access mechanism (TAM). As ILP is time consuming, we use a scheme to bound the test time and the TAM such that the search space is reduced. The proposed bounding scheme and the ILP model were applied on several ITC’02 benchmarks and the results show that optimal solutions were obtained at low computation time

A Hardware Security Solution against Scan-Based Attacks

Scan based Design for Test (DfT) schemes have been widely used to achieve high fault coverage for integrated circuits. The scan technique provides full access to the internal nodes of the device-under-test to control them or observe their response to input test vectors. While such comprehensive access is highly desirable for testing, it is not acceptable for secure chips as it is subject to exploitation by various attacks. In this work, new methods are presented to protect the security of critical information against scan-based attacks. In the proposed methods, access to the circuit containing secret information via the scan chain has been severely limited in order to reduce the risk of a security breach. To ensure the testability of the circuit, a built-in self-test which utilizes an LFSR as the test pattern generator (TPG) is proposed. The proposed schemes can be used as a countermeasure against side channel attacks with a low area overhead as compared to the existing solutions in literature

Design and application of reconfigurable circuits and systems

Open Acces

PACKER: a switchbox router based on conflict elimination by local transformations

PACKER is an algorithm for switchbox routing, based on a novel approach. In an initial phase, the connectivity of each net is established without taking the other nets into account. In general, this gives rise to conflicts (short circuits). In the second stage, the conflicts are removed iteratively using connectivity-preserving local transformations. They reshape a net by displacing one of its segments without disconnecting it from the net. The transformations are applied in a asystematic way using a scan line technique. The results obtained by PACKER are very positive: it solves all well-known benchmark example

On the test of single via related defects in digital VLSI designs

Vias are critical for digital circuit manufacturing, as they represent a common defect location, and a general DfM rule suggests replicating every instance for redundancy. When this is not achievable, a mandatory requirement is that the remaining single vias must be tested. We propose an automated method for generating tests and accurately evaluating test coverage of such defects, ready for use in any digital implementation flow and for integration within EDA tools, and also providing a useful quality metric. A prototype tool implementation and experimental results for an industrial case study are presented