Two dimensional quantum and reliability modelling for lightly doped nanoscale devices

The downscaling of MOSFET devices leads to well-studied short channel effects and more complex quantum mechanical effects. Both quantum and short channel effects not only alter the performance but they also affect the reliability. This continued scaling of the MOS device gate length puts a demand on the reduction of the gate oxide thickness and the substrate doping density. Quantum mechanical effects give rise to the quantization of energy in the conduction band, which consequently creates a larger effective bandgap and brings a displacement of the inversion layer charge out of the Si/SiO2 interface. Such a displacement of charge is equivalent to an increase in the effective oxide layer thickness, a growth in the threshold voltage, and a decrease in the current level. Therefore, using the classical analysis approach without including the quantum effects may lead to perceptible errors in the prognosis of the performance of modern deep submicron devices. In this work, compact Verilog-A compatible 2D models including quantum short channel effects and confinement for the potential, threshold voltage, and the carrier charge sheet density for symmetrical lightly doped double-gate MOSFETs are developed. The proposed models are not only applicable to ultra-scaled devices but they have also been derived from analytical 2D Poisson and 1D Schrodinger equations including 2D electrostatics, in order to incorporate quantum mechanical effects. Electron and hole quasi-Fermi potential effects were considered. The models were further enhanced to include negative bias temperature instability (NBTI) in order to assess the reliability of the device. NBTI effects incorporated into the models constitute interface state generation and hole-trapping. The models are continuous and have been verified by comparison with COMSOL and BALMOS numerical simulations for channel lengths down to 7nm; very good agreement within ±5% has been observed for silicon thicknesses ranging from 3nm to 20nm at 1 GHz operation after 10 years

Development of room temperature operating single electron transistor using FIB etching and deposition technology

The single-electron transistor (SET) is one of the best candidates for future nano electronic circuits because of its ultralow power consumption, small size and unique functionality. SET devices operate on the principle of Coulomb blockade, which is more prominent at dimensions of a few nano meters. Typically, the SET device consists of two capacitively coupled ultra-small tunnel junctions with a nano island between them. In order to observe the Coulomb blockade effects in a SET device the charging energy of the device has to be greater that the thermal energy. This condition limits the operation of most of the existing SET devices to cryogenic temperatures. Room temperature operation of SET devices requires sub-10nm nano-islands due to the inverse dependence of charging energy on the radius of the conducting nano-island. Fabrication of sub-10nm structures using lithography processes is still a technological challenge. In the present investigation, Focused Ion Beam based etch and deposition technology is used to fabricate single electron transistors devices operating at room temperature. The SET device incorporates an array of tungsten nano-islands with an average diameter of 8nm. The fabricated devices are characterized at room temperature and clear Coulomb blockade and Coulomb oscillations are observed. An improvement in the resolution limitation of the FIB etching process is demonstrated by optimizing the thickness of the active layer. SET devices with structural and topological variation are developed to explore their impact on the behavior of the device. The threshold voltage of the device was minimized to ~500mV by minimizing the source-drain gap of the device to 17nm. Vertical source and drain terminals are fabricated to realize single-dot based SET device. A unique process flow is developed to fabricate Si dot based SET devices for better gate controllability in the device characteristic. The device vi parameters of the fabricated devices are extracted by using a conductance model. Finally, characteristic of these devices are validated with the simulated data from theoretical modeling

Design space for low sensitivity to size variations in [110] PMOS nanowire devices: The implications of anisotropy in the quantization mass

A 20-band sp3d5s* spin-orbit-coupled, semi-empirical, atomistic tight-binding model is used with a semi-classical, ballistic, field-effect-transistor (FET) model, to examine the ON-current variations to size variations of [110] oriented PMOS nanowire devices. Infinitely long, uniform, rectangular nanowires of side dimensions from 3nm to 12nm are examined and significantly different behavior in width vs. height variations are identified and explained. Design regions are identified, which show minor ON-current variations to significant width variations that might occur due to lack of line width control. Regions which show large ON-current variations to small height variations are also identified. The considerations of the full band model here show that ON-current doubling can be observed in the ON-state at the onset of volume inversion to surface inversion transport caused by structural side size variations. Strain engineering can smooth out or tune such sensitivities to size variations. The cause of variations described is the structural quantization behavior of the nanowires, which provide an additional variation mechanism to any other ON-current variations such as surface roughness, phonon scattering etc.Comment: 24 pages, 5 figure

Nanowires: Promising Candidates for Electrostatic Control in Future Nanoelectronic Devices

International audienc

Localization and Capacitance Fluctuations in Disordered Au Nano-junctions

Nano-junctions, containing atomic-scale gold contacts between strongly disordered leads, exhibit different transport properties at room temperature and at low temperature. At room temperature, the nano-junctions exhibit conductance quantization effects. At low temperatures, the contacts exhibit Coulomb-Blockade. We show that the differences between the room-temperature and low temperature properties arise from the localization of electronic states in the leads. The charging energy and capacitance of the nano-junctions exhibit strong fluctuations with applied magnetic field at low temperature, as predicted theoretically.Comment: 20 pages 8 figure

Modeling and optimization of Tunnel-FET architectures exploiting carrier gas dimensionality

The semiconductor industry, governed by the Moore's law, has achieved the almost unbelievable feat of exponentially increasing performance while lowering the costs for years. The main enabler for this achievement has been the scaling of the CMOS transistor that allowed the manufacturers to pack more and more functionality into the same chip area. However, it is now widely agreed that the happy days of scaling are well over and we are about to reach the physical limits of the CMOS concept. One major, insurmountable limit of CMOS is the so-called thermionic emission limit which dictates that the switching slope of the transistor cannot go below 60mV/dec at room temperature. This makes it impossible to scale down the supply voltage for CMOS transistor without dramatically increasing the static power consumption. To address this issue, a novel transistor concept called Tunnel FET (TFET) which utilizes the quantum mechanical band-to-band tunneling (BTBT) has been proposed. TFETs possess the potential to overcome the thermionic emission limit and therefore allow for low supply voltage operation. This thesis aims at investigating the performance of TFETs with alternative architectures exploiting quantized carrier gases through quantum mechanical simulations. To this end, 1D and 2D self-consistent Schrödinger-Poisson solvers with closed boundaries are developed along with the phonon-assisted and direct BTBT models implemented as a post-processing step. Moreover, we propose an efficient method to incorporate the quantization along the transverse direction which enables us to simulate different dimensionality combinations. The implemented models are calibrated against experimental and more fundamental quantum mechanical simulation methods such as k.p and tight-binding NEGF using tunneling diode structures. Using these tools, we simulate an advanced TFET architecture called electron-hole bilayer TFET (EHBTFET) which exploits BTBT between 2D electron and hole gases electrostatically induced by two separate oppositely biased gates. The subband-to-subband tunneling is first analyzed with the 1D simulator where the device working principle is demonstrated. Then, non-idealities of the EHBTFET operation such as the lateral tunneling and corner effects are investigated using the 2D simulator. The origin of the lateral leakage and techniques to reduce it are analyzed in detail. A parameter space analysis of the EHBTFET is performed by simulating a wide range of channel materials, channel thickness and oxide thicknesses. Our results indicate the possibility of having 2D-2D and 3D-3D tunneling for the EHBTFET, depending on the parameters chosen. A novel digital logic scheme utilizing the independent biasing property of the EHBTFET n- and p-gates is proposed and verified through quantum-corrected TCAD simulations. The performance benchmarking against a 28nm FD-SOI CMOS technology is performed as well. The results indicate that the EHBTFET logic can outperform the CMOS counterpart in the low supply voltage (subthreshold) regime, where it can offer significantly higher drive current due to its steep switching slope. We also compare the different dimensionality cases and highlight important differences between the face and edge tunneling devices in terms of their dependence on the device parameters (channel material, channel thickness and EOT)

Simulation and Modeling of Silicon Based Emerging Nanodevices: From Device to Circuit Level

Nanostructure based devices are very promising candidates for the emerging nanotechnologies with advantage in terms of power consumption and functional density. Nanowire Field Effect Transistor (NWFET) and Single Electron Transistor (SET) are the focus of this work. The serious challenges faced by the MOSFET due to scaling limits can be solved by these devices. NWFET provides better gate control and overcomes the short channel effects. SET operates in the quantum confinement regime where the basic operation of MOSFET becomes a challenge. SET works better when the dimensions are small encouraging the process of scaling down. Because of these characteristics of the nanodevices, they have achieved a huge interest from the viewpoint of theoretical as well as applied electronics. The studies focus on the understanding of the basic transport characteristics of the devices. The necessity is to develop a model which is efficient, can be used at circuit level and also provides physical insights of the device. The first part of this work focuses on developing the model for SET and to implement it at the circuit level. The transport properties of SET are studied through quantum simulations. The behavioral characterization of the device is performed and the effect of different device parameters on the transport is studied. Furthermore, the impact of gate voltage is analyzed which modulates the current by shifting the energy levels of the device. After observing the transport through SET, a model is developed that efficiently evaluates the IV characteristics of the device. The quantum simulations are used as reference and a huge computational over-head is achieved while maintaining accuracy. Then the model is implemented in hardware descriptive language showing its functional variability at circuit level by designing some logic circuits like AND, OR and FA. In the second part, the performance of the nanoarrays based on NWFET is characterized. A device level model is developed to evaluate the gate capacitance and drain current of NWFET. Starting from the output of the model, in-house simulator is modified and used to evaluate the switching activity of the devices in nanoarray. A nanoarray implementation for bio-sequence alignment based on a systolic array is realized and its essential performance is evaluated. The power consumption, area and performance of the nanoarray implementation are compared with CMOS implementation. A wide solution space can be explored to find the optimal solution trading power and performance and considering the technological limitations of a realistic implementation

Sub-10nm Transistors for Low Power Computing: Tunnel FETs and Negative Capacitance FETs

One of the major roadblocks in the continued scaling of standard CMOS technology is its alarmingly high leakage power consumption. Although circuit and system level methods can be employed to reduce power, the fundamental limit in the overall energy efficiency of a system is still rooted in the MOSFET operating principle: an injection of thermally distributed carriers, which does not allow subthreshold swing (SS) lower than 60mV/dec at room temperature. Recently, a new class of steep-slope devices like Tunnel FETs (TFETs) and Negative-Capacitance FETs (NCFETs) have garnered intense interest due to their ability to surpass the 60mV/dec limit on SS at room temperature. The focus of this research is on the simulation and design of TFETs and NCFETs for ultra-low power logic and memory applications. Using full band quantum mechanical model within the Non-Equilibrium Greens Function (NEGF) formalism, source-underlapping has been proposed as an effective technique to lower the SS in GaSb-InAs TFETs. Band-tail states, associated with heavy source doping, are shown to significantly degrade the SS in TFETs from their ideal value. To solve this problem, undoped source GaSb-InAs TFET in an i-i-n configuration is proposed. A detailed circuit-to-system level evaluation is performed to investigate the circuit level metrics of the proposed devices. To demonstrate their potential in a memory application, a 4T gain cell (GC) is proposed, which utilizes the low-leakage and enhanced drain capacitance of TFETs to realize a robust and long retention time GC embedded-DRAMs. The device/circuit/system level evaluation of proposed TFETs demonstrates their potential for low power digital applications. The second part of the thesis focuses on the design space exploration of hysteresis-free Negative Capacitance FETs (NCFETs). A cross-architecture analysis using HfZrOx ferroelectric (FE-HZO) integrated on bulk MOSFET, fully-depleted SOI-FETs, and sub-10nm FinFETs shows that FDSOI and FinFET configurations greatly benefit the NCFET performance due to their undoped body and improved gate-control which enables better capacitance matching with the ferroelectric. A low voltage NC-FinFET operating down to 0.25V is predicted using ultra-thin 3nm FE-HZO. Next, we propose one-transistor ferroelectric NOR type (Fe-NOR) non-volatile memory based on HfZrOx ferroelectric FETs (FeFETs). The enhanced drain-channel coupling in ultrashort channel FeFETs is utilized to dynamically modulate memory window of storage cells thereby resulting in simple erase-, program-and read-operations. The simulation analysis predicts sub-1V program/erase voltages in the proposed Fe-NOR memory array and therefore presents a significantly lower power alternative to conventional FeRAM and NOR flash memories