Tri-axis convective accelerometer with closed-loop heat source

In this paper, we report the details and findings of a study on tri-axis convective accelerometer, which is designed with the closed-loop type heat source and thermal sensing hotwire elements. The closed-loopheat source enhances the convective flow to the central part where a hotwire is placed to measure the vertical component of acceleration. The simulation was conducted using numerical analysis, and the devicewas prototyped by additive manufacturing. The device, functioning as a tilt sensor and an accelerometer,was tested up to acceleration of 20 g. The experiments were successfully conducted and the experimental results agreed reasonably with those obtained by numerical analysis. The results demonstrated that the closed-loop heat source could reduce the cross effect between the acceleration components. The scalefactor and cross-sensitivity had the values of 0.26 micro�V/g and 1.2%, respectively. The cross-sensitivity andthe effects of heating power were also investigated in this study

MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

Sensing Movement: Microsensors for Body Motion Measurement

Recognition of body posture and motion is an important physiological function that can keep the body in balance. Man-made motion sensors have also been widely applied for a broad array of biomedical applications including diagnosis of balance disorders and evaluation of energy expenditure. This paper reviews the state-of-the-art sensing components utilized for body motion measurement. The anatomy and working principles of a natural body motion sensor, the human vestibular system, are first described. Various man-made inertial sensors are then elaborated based on their distinctive sensing mechanisms. In particular, both the conventional solid-state motion sensors and the emerging non solid-state motion sensors are depicted. With their lower cost and increased intelligence, man-made motion sensors are expected to play an increasingly important role in biomedical systems for basic research as well as clinical diagnostics

Optimization studies of thermal bimorph cantilevers, electrostatic torsion actuators and variable capacitors

In this dissertation, theoretical analyses and optimization studies are given for three kinds of MEMS devices: thermal bimorph cantilevers, electrostatic torsion actuators, and variable capacitors. Calculation, simulation, and experimental data are used to confirm the device behavior and demonstrate the application of the design approaches. For thermal bimorph cantilevers, an analytical model is presented which allows theoretical analysis and quantitative optimization of the performance based on material properties and device dimensions. Bimorph cantilevers are divided into two categories for deflection optimization: either the total thickness is constant, or the cantilever has one constant and one variable layer thickness. The optimum equations are then derived for each case and can be used as design rules. The results show that substantial improvements are possible over existing design approaches. Other parameters like static temperature distribution, power consumption, and dynamic behavior are also discussed, as are design tradeoffs such as feature size, application constraints, fabrication feasibility, and cost. The electrostatic torsion actuator studies are conducted for two device types: round and rectangular. The first case describes an analytical study of the pull-in effect in round, double-gimbaled, electrostatic torsion actuators with buried, variable length electrodes, designed for optical cross-connect applications. It is found that the fractional tilt at pull-in for the inner round plate in this system depends only on the ratio of the length of the buried electrode to the radius of the plate. The fractional tilt at pull-in for the outer support ring depends only on the ratio of the length of the buried electrode to the outer radius of the ring and the ratio of the ring\u27s inner and outer radii. Expressions for the pull-in voltage are determined in both cases. General relationships are also derived relating the applied voltage to the resulting tilt angle, both normalized by their pull-in values. Calculated results are verified by comparison with finite element MEMCAD simulations, with fractional difference smaller than 4% for torsion mode dominant systems. For the second case, a fast, angle based design approach for rectangular electrostatic torsion actuators based on several simple equations is developed. This approach is significantly more straightforward than the usual full calculation or simulation methods. The main results of the simplified approach are verified by comparing them with analytical calculations and MEMCAD simulations with fractional difference smaller than 3% for torsion mode dominant actuators. Also, good agreement is found by comparison with the measured behavior of a micro-fabricated full-plate device. In the last topic, ultra-thin silicon wafers, SU-8 bonding and deep reactive ion etching technology have been combined for the fabrication of folded spring, dual electrostatic drive, vertical plate variable capacitor devices with displacement limiting bumpers. Due to the presence of the bumpers, the variable capacitor with parallel plate drive electrodes has two tuning voltage regimes: first a parabolic region that achieves roughly a 290% tuning range, then a linear region that achieves an additional 310%, making the total tuning range about 600%. The variable capacitor with comb drive electrodes has a parabolic region that achieves roughly a 205% tuning range, then a linear region that achieves an additional 37%, making its total tuning range about 242%. The variable capacitors have Q factors around 100 owing to the use of silicon electrodes other than lower resistivity metal

Micro-Electro-Mechanical-Systems (MEMS) and Fluid Flows

The micromachining technology that emerged in the late 1980s can provide micron-sized sensors and actuators. These micro transducers are able to be integrated with signal conditioning and processing circuitry to form micro-electro-mechanical-systems (MEMS) that can perform real-time distributed control. This capability opens up a new territory for flow control research. On the other hand, surface effects dominate the fluid flowing through these miniature mechanical devices because of the large surface-to-volume ratio in micron-scale configurations. We need to reexamine the surface forces in the momentum equation. Owing to their smallness, gas flows experience large Knudsen numbers, and therefore boundary conditions need to be modified. Besides being an enabling technology, MEMS also provide many challenges for fundamental flow-science research

Development and Packaging of Microsystems Using Foundry Services

Micro-electro-mechanical systems (MEMS) are a new and rapidly growing field of research. Several advances to the MEMS state of the art were achieved through design and characterization of novel devices. Empirical and theoretical model of polysilicon thermal actuators were developed to understand their behavior. The most extensive investigation of the Multi-User MEMS Processes (MUMPs) polysilicon resistivity was also performed. The first published value for the thermal coefficient of resistivity (TCR) of the MUMPs Poly 1 layer was determined as 1.25 x 10(exp -3)/K. The sheet resistance of the MUMPs polysilicon layers was found to be dependent on linewidth due to presence or absence of lateral phosphorus diffusion. The functional integration of MEMS with CMOS was demonstrated through the design of automated positioning and assembly systems, and a new power averaging scheme was devised. Packaging of MEMS using foundry multichip modules (MCMs) was shown to be a feasible approach to physical integration of MEMS with microelectronics. MEMS test die were packaged using Micro Module Systems MCM-D and General Electric High Density Intercounect and Chip-on-Flex MCM foundries. Xenon difluoride (XeF2) was found to be an excellent post-packaging etchant for bulk micromachined MEMS. For surface micromachining, hydrofluoric acid (HF) can be used

Localized annealing of polysilicon microstructures by inductively heated ferromagnetic films

The monolithic integration of dissimilar microsystems is often limited by conflicts in thermal budget. One of the most prevalent examples is the fabrication of active micro-electromechanical systems (MEMS), as structural films utilized for surface micromachining such as polysilicon typically require processing at temperatures unsuitable for microelectronic circuitry. A localized annealing process could provide for the post-deposition heat treatment of integrated structures without compromising active devices. This dissertation presents a new microfabrication technology based on the inductive heating of ferromagnetic films patterned to define regions for heat treatment. Support is provided through theory, finite-element modeling, and experimentation, concluding with the demonstration of inductive annealing on polysilicon inertial sensing structures. Though still in its infancy, the results confirm the technology to be a viable option for integrated MEMS as well as any microsystem fabrication process requiring a thermal gradient

An Analytical Model of Joule Heating in Piezoresistive Microcantilevers

The present study investigates Joule heating in piezoresistive microcantilever sensors. Joule heating and thermal deflections are a major source of noise in such sensors. This work uses analytical and numerical techniques to characterise the Joule heating in 4-layer piezoresistive microcantilevers made of silicon and silicon dioxide substrates but with the same U-shaped silicon piezoresistor. A theoretical model for predicting the temperature generated due to Joule heating is developed. The commercial finite element software ANSYS Multiphysics was used to study the effect of electrical potential on temperature and deflection produced in the cantilevers. The effect of piezoresistor width on Joule heating is also studied. Results show that Joule heating strongly depends on the applied potential and width of piezoresistor and that a silicon substrate cantilever has better thermal characteristics than a silicon dioxide cantilever