Energy Efficient Network Generation for Application Specific NoC

Networks-on-Chip is emerging as a communication platform for future complex SoC designs, composed of a large number of homogenous or heterogeneous processing resources. Most SoC platforms are customized to the domainspecific requirements of their applications, which communicate in a specific, mostly irregular way. The specific but often diverse communication requirements among cores of the SoC call for the design of application-specific network of SoC for improved performance in terms of communication energy, latency, and throughput. In this work, we propose a methodology for the design of customized irregular network architecture of SoC. The proposed method exploits priori knowledge of the application2019;s communication characteristic to generate an energy optimized network and corresponding routing tables

An Energy Conscious Topology Augmentation Methodology for On-Chip Interconnection Networks

On-chip communication, modular, scalable packet-switched micro-network of interconnects, generally known as Network-on-Chip (NoC) architecture can be designed as regular or application-specific (irregular) network topologies. Application specific custom network topologies are advantageous in terms of optimized design according to given performance metrics and regular network topologies are advantageous in terms of its modularity, lower design time and efforts required and thus are suitable for mass production. So to offer the advantages of both the topologies this paper proposes a methodology to augment the regular topology according to the application characteristics. The experimental results demonstrate that the proposed methodology can reduce dynamic communication energy consumption by on average of 32.79% and reduction in average per flit latency by on average of 16.22% over regular 2D NoC architecture

Physical parameter-aware Networks-on-Chip design

PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable and power-efficient communication fabric for chip multiprocessors (CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine both the performance and the reliability of such systems, with a significant power demand that is expected to increase due to developments in both technology and architecture. In terms of architecture, an important trend in many-core systems architecture is to increase the number of cores on a chip while reducing their individual complexity. This trend increases communication power relative to computation power. Moreover, technology-wise, power-hungry wires are dominating logic as power consumers as technology scales down. For these reasons, the design of future very large scale integration (VLSI) systems is moving from being computation-centric to communication-centric. On the other hand, chip’s physical parameters integrity, especially power and thermal integrity, is crucial for reliable VLSI systems. However, guaranteeing this integrity is becoming increasingly difficult with the higher scale of integration due to increased power density and operating frequencies that result in continuously increasing temperature and voltage drops in the chip. This is a challenge that may prevent further shrinking of devices. Thus, tackling the challenge of power and thermal integrity of future many-core systems at only one level of abstraction, the chip and package design for example, is no longer sufficient to ensure the integrity of physical parameters. New designtime and run-time strategies may need to work together at different levels of abstraction, such as package, application, network, to provide the required physical parameter integrity for these large systems. This necessitates strategies that work at the level of the on-chip network with its rising power budget. This thesis proposes models, techniques and architectures to improve power and thermal integrity of Network-on-Chip (NoC)-based many-core systems. The thesis is composed of two major parts: i) minimization and modelling of power supply variations to improve power integrity; and ii) dynamic thermal adaptation to improve thermal integrity. This thesis makes four major contributions. The first is a computational model of on-chip power supply variations in NoCs. The proposed model embeds a power delivery model, an NoC activity simulator and a power model. The model is verified with SPICE simulation and employed to analyse power supply variations in synthetic and real NoC workloads. Novel observations regarding power supply noise correlation with different traffic patterns and routing algorithms are found. The second is a new application mapping strategy aiming vii to minimize power supply noise in NoCs. This is achieved by defining a new metric, switching activity density, and employing a force-based objective function that results in minimizing switching density. Significant reductions in power supply noise (PSN) are achieved with a low energy penalty. This reduction in PSN also results in a better link timing accuracy. The third contribution is a new dynamic thermal-adaptive routing strategy to effectively diffuse heat from the NoC-based threedimensional (3D) CMPs, using a dynamic programming (DP)-based distributed control architecture. Moreover, a new approach for efficient extension of two-dimensional (2D) partially-adaptive routing algorithms to 3D is presented. This approach improves three-dimensional networkon- chip (3D NoC) routing adaptivity while ensuring deadlock-freeness. Finally, the proposed thermal-adaptive routing is implemented in field-programmable gate array (FPGA), and implementation challenges, for both thermal sensing and the dynamic control architecture are addressed. The proposed routing implementation is evaluated in terms of both functionality and performance. The methodologies and architectures proposed in this thesis open a new direction for improving the power and thermal integrity of future NoC-based 2D and 3D many-core architectures

Embedded dynamic programming networks for networks-on-chip

PhD ThesisRelentless technology downscaling and recent technological advancements in three dimensional integrated circuit (3D-IC) provide a promising prospect to realize heterogeneous system-on-chip (SoC) and homogeneous chip multiprocessor (CMP) based on the networks-onchip (NoCs) paradigm with augmented scalability, modularity and performance. In many cases in such systems, scheduling and managing communication resources are the major design and implementation challenges instead of the computing resources. Past research efforts were mainly focused on complex design-time or simple heuristic run-time approaches to deal with the on-chip network resource management with only local or partial information about the network. This could yield poor communication resource utilizations and amortize the benefits of the emerging technologies and design methods. Thus, the provision for efficient run-time resource management in large-scale on-chip systems becomes critical. This thesis proposes a design methodology for a novel run-time resource management infrastructure that can be realized efficiently using a distributed architecture, which closely couples with the distributed NoC infrastructure. The proposed infrastructure exploits the global information and status of the network to optimize and manage the on-chip communication resources at run-time. There are four major contributions in this thesis. First, it presents a novel deadlock detection method that utilizes run-time transitive closure (TC) computation to discover the existence of deadlock-equivalence sets, which imply loops of requests in NoCs. This detection scheme, TC-network, guarantees the discovery of all true-deadlocks without false alarms in contrast to state-of-the-art approximation and heuristic approaches. Second, it investigates the advantages of implementing future on-chip systems using three dimensional (3D) integration and presents the design, fabrication and testing results of a TC-network implemented in a fully stacked three-layer 3D architecture using a through-silicon via (TSV) complementary metal-oxide semiconductor (CMOS) technology. Testing results demonstrate the effectiveness of such a TC-network for deadlock detection with minimal computational delay in a large-scale network. Third, it introduces an adaptive strategy to effectively diffuse heat throughout the three dimensional network-on-chip (3D-NoC) geometry. This strategy employs a dynamic programming technique to select and optimize the direction of data manoeuvre in NoC. It leads to a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate the proposed approach. Fourth, it presents a new dynamic programming-based run-time thermal management (DPRTM) system, including reactive and proactive schemes, to effectively diffuse heat throughout NoC-based CMPs by routing packets through the coolest paths, when the temperature does not exceed chip’s thermal limit. When the thermal limit is exceeded, throttling is employed to mitigate heat in the chip and DPRTM changes its course to avoid throttled paths and to minimize the impact of throttling on chip performance. This thesis enables a new avenue to explore a novel run-time resource management infrastructure for NoCs, in which new methodologies and concepts are proposed to enhance the on-chip networks for future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)

NC-G-SIM: A Parameterized Generic Simulator for 2D-Mesh, 3D-Mesh

As chip density keeps doubling during each course of generation, the use of NoC has become an integral part of modern microprocessors and a very prevalent architectural feature of all types of SoCs. To meet the ever expanding communication challenges, diverse and novel NoC solutions are being developed which rely on accurate modeling and simulations to evaluate the impact and analyze their performances. Consequently, this aggravates the need to rely on simulation tools to probe and optimize these NoC architectures. In this work, we present NC-G-SIM (Network on Chip-Generic-SIMulator), a highly flexible, modular, cycle-accurate, configurable simulator for NoCs. To make NC-G-SIM suitable for advanced NoC exploration, it is made highly generic that supports extensive range of cores in any kind of topology whether 2D, 3D or irregular. Simulation results have been evaluated in terms of latencies, throughput and the amount of energy consumed during the simulation period at different levels

Energy Efficient Branch and Bound based On-Chip Irregular Network Design

Here we present a technique which construct the topology for heterogeneous SoC, (Application Specific NoC) such that total Dynamic communication energy is optimized. The topology is certain to satisfy the constraints of node degree as well the link length. We first layout the topology by finding the shortest path between traffic characteristics with the branch and bound optimization technique. Deadlock is dealt with escape routing using Spanning tree. Investigation outcome show that the proposed design methodology is fast and achieves significant dynamic energy gain

Control Plane for Embedded DSP

This project is sponsored by MITRE Corporation to develop a scalable and reusable control plane architecture for VLSI design. The main goal of this project is to develop a communication platform for a wide range of applications to reduce the development and testing time associated with the design of a interconnect system. Thorough research has been conducted in the area of network-on-chip designs that are suitable for these types of applications. The necessary components are built and verified in hardware description language. The deliverable components are packaged as reusable and parameterized SystemVerilog code