1,983 research outputs found

    Investigation of FACTS devices to improve power quality in distribution networks

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    Flexible AC transmission system (FACTS) technologies are power electronic solutions that improve power transmission through enhanced power transfer volume and stability, and resolve quality and reliability issues in distribution networks carrying sensitive equipment and non-linear loads. The use of FACTS in distribution systems is still in its infancy. Voltages and power ratings in distribution networks are at a level where realistic FACTS devices can be deployed. Efficient power converters and therefore loss minimisation are crucial prerequisites for deployment of FACTS devices. This thesis investigates high power semiconductor device losses in detail. Analytical closed form equations are developed for conduction loss in power devices as a function of device ratings and operating conditions. These formulae have been shown to predict losses very accurately, in line with manufacturer data. The developed formulae enable circuit designers to quickly estimate circuit losses and determine the sensitivity of those losses to device voltage and current ratings, and thus select the optimal semiconductor device for a specific application. It is shown that in the case of majority carrier devices (such as power MOSFETs), the conduction power loss (at rated current) increases linearly in relation to the varying rated current (at constant blocking voltage), but is a square root of the variable blocking voltage when rated current is fixed. For minority carrier devices (such as a pin diode or IGBT), a similar relationship is observed for varying current, however where the blocking voltage is altered, power losses are derived as a square root with an offset (from the origin). Finally, this thesis conducts a power loss-oriented evaluation of cascade type multilevel converters suited to reactive power compensation in 11kV and 33kV systems. The cascade cell converter is constructed from a series arrangement of cell modules. Two prospective structures of cascade type converters were compared as a case study: the traditional type which uses equal-sized cells in its chain, and a second with a ternary relationship between its dc-link voltages. Modelling (at 81 and 27 levels) was carried out under steady state conditions, with simplified models based on the switching function and using standard circuit simulators. A detailed survey of non punch through (NPT) and punch through (PT) IGBTs was completed for the purpose of designing the two cascaded converters. Results show that conduction losses are dominant in both types of converters in NPT and PT IGBTs for 11kV and 33kV systems. The equal-sized converter is only likely to be useful in one case (27-levels in the 33kV system). The ternary-sequence converter produces lower losses in all other cases, and this is especially noticeable for the 81-level converter operating in an 11kV network

    Bidirectional Electric Vehicles Service Integration in Smart Power Grid with Renewable Energy Resources

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    As electric vehicles (EVs) become more popular, the utility companies are forced to increase power generations in the grid. However, these EVs are capable of providing power to the grid to deliver different grid ancillary services in a concept known as vehicle-to-grid (V2G) and grid-to-vehicle (G2V), in which the EV can serve as a load or source at the same time. These services can provide more benefits when they are integrated with Photovoltaic (PV) generation. The proper modeling, design and control for the power conversion systems that provide the optimum integration among the EVs, PV generations and grid are investigated in this thesis. The coupling between the PV generation and integration bus is accomplished through a unidirectional converter. Precise dynamic and small-signal models for the grid-connected PV power system are developed and utilized to predict the system’s performance during the different operating conditions. An advanced intelligent maximum power point tracker based on fuzzy logic control is developed and designed using a mix between the analytical model and genetic algorithm optimization. The EV is connected to the integration bus through a bidirectional inductive wireless power transfer system (BIWPTS), which allows the EV to be charged and discharged wirelessly during the long-term parking, transient stops and movement. Accurate analytical and physics-based models for the BIWPTS are developed and utilized to forecast its performance, and novel practical limitations for the active and reactive power-flow during G2V and V2G operations are stated. A comparative and assessment analysis for the different compensation topologies in the symmetrical BIWPTS was performed based on analytical, simulation and experimental data. Also, a magnetic design optimization for the double-D power pad based on finite-element analysis is achieved. The nonlinearities in the BIWPTS due to the magnetic material and the high-frequency components are investigated rely on a physics-based co-simulation platform. Also, a novel two-layer predictive power-flow controller that manages the bidirectional power-flow between the EV and grid is developed, implemented and tested. In addition, the feasibility of deploying the quasi-dynamic wireless power transfer technology on the road to charge the EV during the transient stops at the traffic signals is proven

    A Low-Power, Laser-Based Delta-Sigma Modulator for the Measurement of Atmospheric Gas Composition

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    With the increased attention on monitoring the atmosphere’s gas composition, new ways of accurately measuring these concentrations are needed. Along with the needed increase in measurement accuracy; size, space, and power reduction is also essential in modern systems. As semiconductor technology has advanced, the abilities to meet the previously mentioned criteria are becoming more realizable. Instrumentation used to measure the atmosphere’s composition is traditionally large, taking up much needed space and using larger amounts of power. While the larger instrumentation provides the necessary accuracy, the other constraints are sacrificed. For this reason, a smaller, yet highly accurate solution is needed. The Proof-of-Concept (POC) solution that is proposed in this thesis is a Delta-Sigma (ΔΣ) Modulator designed in a 0.5 micron (µm) Bulk CMOS Process. Using a 1.55 micron (µm) laser as the signal input while using a specified reference, the Delta-Sigma Modulator will use oversampling and noise shaping to provide an accurate, one-bit digital output count that correlates the difference between the reference signal and the laser’s intensity that is input to the system. This allows for the possibility of a high resolution output, with high accuracy, and significant reductions in space used and power consumed

    Technology Independent Synthesis of CMOS Operational Amplifiers

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    Analog circuit design does not enjoy as much automation as its digital counterpart. Analog sizing is inherently knowledge intensive and requires accurate modeling of the different parametric effects of the devices. Besides, the set of constraints in a typical analog design problem is large, involving complex tradeoffs. For these reasons, the task of modeling an analog design problem in a form viable for automation is much more tedious than the digital design. Consequently, analog blocks are still handcrafted intuitively and often become a bottleneck in the integrated circuit design, thereby increasing the time to market. In this work, we address the problem of automatically solving an analog circuit design problem. Specifically, we propose methods to automate the transistor-level sizing of OpAmps. Given the specifications and the netlist of the OpAmp, our methodology produces a design that has the accuracy of the BSIM models used for simulation and the advantage of a quick design time. The approach is based on generating an initial first-order design and then refining it. In principle, the refining approach is a simulated-annealing scheme that uses (i) localized simulations and (ii) convex optimization scheme (COS). The optimal set of input variables for localized simulations has been selected by using techniques from Design of Experiments (DOE). To formulate the design problem as a COS problem, we have used monomial circuit models that are fitted from simulation data. These models accurately predict the performance of the circuit in the proximity of the initial guess. The models can also be used to gain valuable insight into the behavior of the circuit and understand the interrelations between the different performance constraints. A software framework that implements this methodology has been coded in SKILL language of Cadence. The methodology can be applied to design different OpAmp topologies across different technologies. In other words, the framework is both technology independent and topology independent. In addition, we develop a scheme to empirically model the small signal parameters like \u27gm\u27 and \u27gds\u27 of CMOS transistors. The monomial device models are reusable for a given technology and can be used to formulate the OpAmp design problem as a COS problem. The efficacy of the framework has been demonstrated by automatically designing different OpAmp topologies across different technologies. We designed a two-stage OpAmp and a telescopic OpAmp in TSMC025 and AMI016 technologies. Our results show significant (10–15%) improvement in the performance of both the OpAmps in both the technologies. While the methodology has shown encouraging results in the sub-micrometer regime, the effectiveness of the tool has to be investigated in the deep-sub-micron technologies

    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

    Standby Supply Voltage Minimization for Reliable Nanoscale SRAMs

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    AI/ML Algorithms and Applications in VLSI Design and Technology

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    An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations
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