579 research outputs found
Optimizing Ram Testing Method For Test Time Saving Using Automatic Test Equipment
Due to the memory size increase drastically in the field programable gate array (FPGA) or system on chip (SOC) device, it become hard to meet the tests cost budget of the product especial for low-cost device. One of the major factor of test cost contributed is the test time. For the low-cost product, the tolerance number of the defects per million (DPM) are relative high compare to high cost product. By taking this advantage, an optimizing memory testing method able to implement to minimize the test time without jeopardize the test coverage. A memory Build-in Self-test (BIST) design with capability of algorithm failing sequence capture have been developed to implement in the Automate Test Equipment (ATE) flow for production screen. 3 selected algorithm have been tested on the 8 detect units in ATE flow to prove the concept of this method. The failing algorithm sequence of the units have been logged into database and analyzed for algorithm trimming. With the proper examples, the algorithm trimming location and test time saving calculation have been shown in this research. For this examples, approximate 33% of test time reduction observed for 1Kbyte memory testing with Hammer Head algorithm. In summary, this research has proposed the memory test time saving by optimizing the tests algorithm on the ATE flow
Memory built-in self-repair and correction for improving yield: a review
Nanometer memories are highly prone to defects due to dense structure, necessitating memory built-in self-repair as a must-have feature to improve yield. Today’s system-on-chips contain memories occupying an area as high as 90% of the chip area. Shrinking technology uses stricter design rules for memories, making them more prone to manufacturing defects. Further, using 3D-stacked memories makes the system vulnerable to newer defects such as those coming from through-silicon-vias (TSV) and micro bumps. The increased memory size is also resulting in an increase in soft errors during system operation. Multiple memory repair techniques based on redundancy and correction codes have been presented to recover from such defects and prevent system failures. This paper reviews recently published memory repair methodologies, including various built-in self-repair (BISR) architectures, repair analysis algorithms, in-system repair, and soft repair handling using error correcting codes (ECC). It provides a classification of these techniques based on method and usage. Finally, it reviews evaluation methods used to determine the effectiveness of the repair algorithms. The paper aims to present a survey of these methodologies and prepare a platform for developing repair methods for upcoming-generation memories
Design for testability of a latch-based design
Abstract. The purpose of this thesis was to decrease the area of digital logic in a power management integrated circuit (PMIC), by replacing selected flip-flops with latches. The thesis consists of a theory part, that provides background theory for the thesis, and a practical part, that presents a latch register design and design for testability (DFT) method for achieving an acceptable level of manufacturing fault coverage for it.
The total area was decreased by replacing flip-flops of read-write and one-time programmable registers with latches. One set of negative level active primary latches were shared with all the positive level active latch registers in the same register bank. Clock gating was used to select which latch register the write data was loaded to from the primary latches. The latches were made transparent during the shift operation of partial scan testing. The observability of the latch register clock gating logic was improved by leaving the first bit of each latch register as a flip-flop. The controllability was improved by inserting control points.
The latch register design, developed in this thesis, resulted in a total area decrease of 5% and a register bank area decrease of 15% compared to a flip-flop-based reference design. The latch register design manages to maintain the same stuck-at fault coverage as the reference design.Salpaperäisen piirin testattavuuden suunnittelu. Tiivistelmä. Tämän opinnäytetyön tarkoituksena oli pienentää digitaalisen logiikan pinta-alaa integroidussa tehonhallintapiirissä, korvaamalla valitut kiikut salpapiireillä. Opinnäytetyö koostuu teoriaosasta, joka antaa taustatietoa opinnäytetyölle, ja käytännön osuudesta, jossa esitellään salparekisteripiiri ja testattavuussuunnittelun menetelmä, jolla saavutettiin riittävän hyvä virhekattavuus salparekisteripiirille.
Kokonaispinta-alaa pienennettiin korvaamalla luku-kirjoitusrekistereiden ja kerran ohjelmoitavien rekistereiden kiikut salpapiireillä. Yhdet negatiivisella tasolla aktiiviset isäntä-salpapiirit jaettiin kaikkien samassa rekisteripankissa olevien positiivisella tasolla aktiivisten salparekistereiden kanssa. Kellon portittamisella valittiin mihin salparekisteriin kirjoitusdata ladattiin yhteisistä isäntä-salpapireistä. Osittaisessa testipolkuihin perustuvassa testauksessa salpapiirit tehtiin läpinäkyviksi siirtooperaation aikana. Salparekisterin kellon portituslogiikan havaittavuutta parannettiin jättämällä jokaisen salparekisterin ensimmäinen bitti kiikuksi. Ohjattavuutta parannettiin lisäämällä ohjauspisteitä.
Salparekisteripiiri, joka suunniteltiin tässä diplomityössä, pienensi kokonaispinta-alaa 5 % ja rekisteripankin pinta-alaa 15 % verrattuna kiikkuperäiseen vertailupiiriin. Salparekisteripiiri onnistuu pitämään saman juuttumisvikamallin virhekattavuuden kuin vertailupiiri
A re-configurable pipeline ADC architecture with built-in self-test techniques
High-performance analog and mixed-signal integrated circuits are integral parts of today\u27s and future networking and communication systems. The main challenge facing the semiconductor industry is the ability to economically produce these analog ICs. This translates, in part, into the need to efficiently evaluate the performance of such ICs during manufacturing (production testing) and to come up with dynamic architectures that enable the performance of these ICs to be maximized during manufacturing and later when they\u27re operating in the field. On the performance evaluation side, this dissertation deals with the concept of Built-In-Self-Test (BIST) to allow the efficient and economical evaluation of certain classes of high-performance analog circuits. On the dynamic architecture side, this dissertation deals with pipeline ADCs and the use of BIST to dynamically, during production testing or in the field, re-configure them to produce better performing ICs.;In the BIST system proposed, the analog test signal is generated on-chip by sigma-delta modulation techniques. The performance of the ADC is measured on-chip by a digital narrow-band filter. When this system is used on the wafer level, significant testing time and thus testing cost can be saved.;A re-configurable pipeline ADC architecture to improve the dynamic performance is proposed. Based on dynamic performance measurements, the best performance configuration is chosen from a collection of possible pipeline configurations. This basic algorithm can be applied to many pipeline analog systems. The proposed grouping algorithm cuts down the number of evaluation permutation from thousands to 18 for a 9-bit ADC thus allowing the method to be used in real applications.;To validate the developments of this dissertation, a 40MS/s 9-bit re-configurable pipeline ADC was designed and implemented in TSMC\u27s 0.25mum single-poly CMOS digital process. This includes a fully differential folded-cascode gain-boosting operational amplifier with high gain and high unity-gain bandwidth. The experimental results strongly support the effectiveness of reconfiguration algorithm, which provides an average of 0.5bit ENOB improvement among the set of configurations. For many applications, this is a very significant performance improvement.;The BIST and re-configurability techniques proposed are not limited to pipeline ADCs only. The BIST methodology is applicable to many analog systems and the re-configurability is applicable to any analog pipeline system
Interconnect yield analysis and fault tolerance for field programmable gate arrays
Imperial Users onl
Innovative Techniques for Testing and Diagnosing SoCs
We rely upon the continued functioning of many electronic devices for our everyday welfare,
usually embedding integrated circuits that are becoming even cheaper and smaller
with improved features. Nowadays, microelectronics can integrate a working computer
with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC).
SoCs are also employed on automotive safety-critical applications, but need to be tested
thoroughly to comply with reliability standards, in particular the ISO26262 functional
safety for road vehicles.
The goal of this PhD. thesis is to improve SoC reliability by proposing innovative
techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals,
and GPUs. The proposed approaches in the sequence appearing in this thesis are described
as follows:
1. Embedded Memory Diagnosis: Memories are dense and complex circuits which
are susceptible to design and manufacturing errors. Hence, it is important to understand
the fault occurrence in the memory array. In practice, the logical and physical
array representation differs due to an optimized design which adds enhancements to
the device, namely scrambling. This part proposes an accurate memory diagnosis
by showing the efforts of a software tool able to analyze test results, unscramble
the memory array, map failing syndromes to cell locations, elaborate cumulative
analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing
syndromes were analyzed as case studies gathered on an industrial automotive
32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually,
and results were confirmed by real photos taken from a microscope.
2. Functional Test Pattern Generation: The key for a successful test is the pattern applied
to the device. They can be structural or functional; the former usually benefits
from embedded test modules targeting manufacturing errors and is only effective
before shipping the component to the client. The latter, on the other hand, can be
applied during mission minimally impacting on performance but is penalized due
to high generation time. However, functional test patterns may benefit for having
different goals in functional mission mode. Part III of this PhD thesis proposes
three different functional test pattern generation methods for CPU cores embedded
in SoCs, targeting different test purposes, described as follows:
a. Functional Stress Patterns: Are suitable for optimizing functional stress during
I
Operational-life Tests and Burn-in Screening for an optimal device reliability
characterization
b. Functional Power Hungry Patterns: Are suitable for determining functional
peak power for strictly limiting the power of structural patterns during manufacturing
tests, thus reducing premature device over-kill while delivering high test
coverage
c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns
with functional ones, allowing its execution periodically during mission.
In addition, an external hardware communicating with a devised SBST was proposed.
It helps increasing in 3% the fault coverage by testing critical Hardly
Functionally Testable Faults not covered by conventional SBST patterns.
An automatic functional test pattern generation exploiting an evolutionary algorithm
maximizing metrics related to stress, power, and fault coverage was employed
in the above-mentioned approaches to quickly generate the desired patterns. The
approaches were evaluated on two industrial cases developed by STMicroelectronics;
8051-based and a 32-bit Power Architecture SoCs. Results show that generation
time was reduced upto 75% in comparison to older methodologies while
increasing significantly the desired metrics.
3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices
are suitable for generating structural patterns, testing and activating mitigation techniques,
and validating robust hardware and software applications. GPGPUs are
known for fast parallel computation used in high performance computing and advanced
driver assistance where reliability is the key point. Moreover, GPGPU manufacturers
do not provide design description code due to content secrecy. Therefore,
commercial fault injectors using the GPGPU model is unfeasible, making radiation
tests the only resource available, but are costly. In the last part of this thesis, we
propose a software implemented fault injector able to inject bit-flip in memory elements
of a real GPGPU. It exploits a software debugger tool and combines the
C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in
program variables. The goal is to validate robust parallel algorithms by studying
fault propagation or activating redundancy mechanisms they possibly embed. The
effectiveness of the tool was evaluated on two robust applications: redundant parallel
matrix multiplication and floating point Fast Fourier Transform
Infrastructures and Algorithms for Testable and Dependable Systems-on-a-Chip
Every new node of semiconductor technologies provides further miniaturization and higher performances, increasing the number of advanced functions that electronic products can offer. Silicon area is now so cheap that industries can integrate in a single chip usually referred to as System-on-Chip (SoC), all the components and functions that historically were placed on a hardware board. Although adding such advanced functionality can benefit users, the manufacturing process is becoming finer and denser, making chips more susceptible to defects. Today’s very deep-submicron semiconductor technologies (0.13 micron and below) have reached susceptibility levels that put conventional semiconductor manufacturing at an impasse. Being able to rapidly develop, manufacture, test, diagnose and verify such complex new chips and products is crucial for the continued success of our economy at-large. This trend is expected to continue at least for the next ten years making possible the design and production of 100 million transistor chips.
To speed up the research, the National Technology Roadmap for Semiconductors identified in 1997 a number of major hurdles to be overcome. Some of these hurdles are related to test and dependability.
Test is one of the most critical tasks in the semiconductor production process where Integrated Circuits (ICs) are tested several times starting from the wafer probing to the end of production test. Test is not only necessary to assure fault free devices but it also plays a key role in analyzing defects in the manufacturing process. This last point has high relevance since increasing time-to-market pressure on semiconductor fabrication often forces foundries to start volume production on a given semiconductor technology node before reaching the defect densities, and hence yield levels, traditionally obtained at that stage. The feedback derived from test is the only way to analyze and isolate many of the defects in today’s processes and to increase process’s yield.
With the increasing need of high quality electronic products, at each new physical assembly level, such as board and system assembly, test is used for debugging, diagnosing and repairing the sub-assemblies in their new environment. Similarly, the increasing reliability, availability and serviceability requirements, lead the users of high-end products performing periodic tests in the field throughout the full life cycle.
To allow advancements in each one of the above scaling trends, fundamental changes are expected to emerge in different Integrated Circuits (ICs) realization disciplines such as IC design, packaging and silicon process. These changes have a direct impact on test methods, tools and equipment. Conventional test equipment and methodologies will be inadequate to assure high quality levels. On chip specialized block dedicated to test, usually referred to as Infrastructure IP (Intellectual Property), need to be developed and included in the new complex designs to assure that new chips will be adequately tested, diagnosed, measured, debugged and even sometimes repaired.
In this thesis, some of the scaling trends in designing new complex SoCs will be analyzed one at a time, observing their implications on test and identifying the key hurdles/challenges to be addressed. The goal of the remaining of the thesis is the presentation of possible solutions. It is not sufficient to address just one of the challenges; all must be met at the same time to fulfill the market requirements
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Testability considerations for implementing an embedded memory subsystem
textThere are a number of testability considerations for VLSI design,
but test coverage, test time, accuracy of test patterns and
correctness of design information for DFD (Design for debug) are
the most important ones in design with embedded memories. The goal
of DFT (Design-for-Test) is to achieve zero defects. When it comes
to the memory subsystem in SOCs (system on chips), many flavors of
memory BIST (built-in self test) are able to get high test
coverage in a memory, but often, no proper attention is given to
the memory interface logic (shadow logic). Functional testing and
BIST are the most prevalent tests for this logic, but functional
testing is impractical for complicated SOC designs. As a result,
industry has widely used at-speed scan testing to detect delay
induced defects. Compared with functional testing, scan-based
testing for delay faults reduces overall pattern generation
complexity and cost by enhancing both controllability and
observability of flip-flops. However, without proper modeling of
memory, Xs are generated from memories. Also, when the design has
chip compression logic, the number of ATPG patterns is increased
significantly due to Xs from memories. In this dissertation, a
register based testing method and X prevention logic are presented
to tackle these problems.
An important design stage for scan based testing with memory
subsystems is the step to create a gate level model and verify
with this model. The flow needs to provide a robust ATPG netlist
model. Most industry standard CAD tools used to analyze fault
coverage and generate test vectors require gate level models.
However, custom embedded memories are typically designed using a
transistor-level flow, there is a need for an abstraction step to
generate the gate models, which must be equivalent to the actual
design (transistor level). The contribution of the research is a
framework to verify that the gate level representation of custom
designs is equivalent to the transistor-level design.
Compared to basic stuck-at fault testing, the number of patterns
for at-speed testing is much larger than for basic stuck-at fault
testing. So reducing test and data volume are important. In this
desertion, a new scan reordering method is introduced to reduce
test data with an optimal routing solution. With in depth
understanding of embedded memories and flows developed during the
study of custom memory DFT, a custom embedded memory Bit Mapping
method using a symbolic simulator is presented in the last chapter
to achieve high yield for memories.Electrical and Computer Engineerin
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