The impact of soft errors in logic and its commercialisation in ARM IP

The significance of soft errors in logic has grown because of reduced memory vulnerability and the shrinking dimensions of semiconductor technology coupled with the increasing amount of logic integrated into a chip. Consequently, some of ARM’s customers are concerned about how soft errors on the bus interconnect will affect the dependability of their systems, since the interconnect is a critical hub of communication in a SoC and represents a substantial and growing amount of logic. With the rising complexity of their systems, the interconnect will become larger and more complex in the future, adding to their concern. In this work the impact of soft errors on the bus interconnect logic was investigated and a product was developed to ameliorate the effects of such errors on ARM’s customers’ products. Methods to measure the SER of ARM IP were investigated by focusing on logical masking, which is a component in the calculation of the SER. The effect that the topology of a combinatorial logic circuit has on its logical masking rate was considered by performing gate-level statistical fault injection on different implementations of adder circuits. Significant variation in logical masking was found ranging from a factor of 3.1 at a synthesis frequency of 100 MHz to a factor of 2.1 at 900 MHz. This difference is explained in an original way by correlating logical masking with the circuit’s path length and fan-out. These properties could be used to create a static method of measuring the logical masking rather than the current time-consuming method of dynamic simulation. Additionally, nearly 30% of faults injected cause more than one error, which means that the combinational SER will be underestimated if research does not take gate fan-out into consideration. Using this methodology a circuit designer can now base his choice or development of a circuit on its reliability as well as its performance, power, and area. Studying the variation in the factors that affect the SER is important to ensure accuracy in addressing customer requirements. Although it is important to consider the rate of soft error occurrence, in this work the impact of errors is demonstrated to be critical. Using protocol-level fault injection it is shown that faults on the ARM AXI bus interconnect can have a serious effect on the reliability of the entire SoC such as deadlock, memory corruption, or undefined behaviour. Using a fault-path traversal algorithm, it is demonstrated that traditional error detection codes are not sufficient at preventing these failures when faults occur on certain AXI bus signals. This led to the development of novel fault tolerant methods that provide protection for these identified signals. Based on these developments, a product was proposed for an add-on to the AXI bus interconnect that can detect, correct, and report logic soft errors without changing the AMBA standard or the customer’s connecting IP

Understanding Soft Errors in Uncore Components

The effects of soft errors in processor cores have been widely studied. However, little has been published about soft errors in uncore components, such as memory subsystem and I/O controllers, of a System-on-a-Chip (SoC). In this work, we study how soft errors in uncore components affect system-level behaviors. We have created a new mixed-mode simulation platform that combines simulators at two different levels of abstraction, and achieves 20,000x speedup over RTL-only simulation. Using this platform, we present the first study of the system-level impact of soft errors inside various uncore components of a large-scale, multi-core SoC using the industrial-grade, open-source OpenSPARC T2 SoC design. Our results show that soft errors in uncore components can significantly impact system-level reliability. We also demonstrate that uncore soft errors can create major challenges for traditional system-level checkpoint recovery techniques. To overcome such recovery challenges, we present a new replay recovery technique for uncore components belonging to the memory subsystem. For the L2 cache controller and the DRAM controller components of OpenSPARC T2, our new technique reduces the probability that an application run fails to produce correct results due to soft errors by more than 100x with 3.32% and 6.09% chip-level area and power impact, respectively.Comment: to be published in Proceedings of the 52nd Annual Design Automation Conferenc

Survey of Soft Error Mitigation Techniques Applied to LEON3 Soft Processors on SRAM-Based FPGAs

Soft-core processors implemented in SRAM-based FPGAs are an attractive option for applications to be employed in radiation environments due to their flexibility, relatively-low application development costs, and reconfigurability features enabling them to adapt to the evolving mission needs. Despite the advantages soft-core processors possess, they are seldom used in critical applications because they are more sensitive to radiation than their hard-core counterparts. For instance, both the logic and signal routing circuitry of a soft-core processor as well as its user memory are susceptible to radiation-induced faults. Therefore, soft-core processors must be appropriately hardened against ionizing-radiation to become a feasible design choice for harsh environments and thus to reap all their benefits. This survey henceforth discusses various techniques to protect the configuration and user memories of an LEON3 soft processor, which is one of the most widely used soft-core processors in radiation environments, as reported in the state-of-the-art literature, with the objective of facilitating the choice of right fault-mitigation solution for any given soft-core processor

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Dynamic Partial Reconfiguration for Dependable Systems

Moore’s law has served as goal and motivation for consumer electronics manufacturers in the last decades. The results in terms of processing power increase in the consumer electronics devices have been mainly achieved due to cost reduction and technology shrinking. However, reducing physical geometries mainly affects the electronic devices’ dependability, making them more sensitive to soft-errors like Single Event Transient (SET) of Single Event Upset (SEU) and hard (permanent) faults, e.g. due to aging effects. Accordingly, safety critical systems often rely on the adoption of old technology nodes, even if they introduce longer design time w.r.t. consumer electronics. In fact, functional safety requirements are increasingly pushing industry in developing innovative methodologies to design high-dependable systems with the required diagnostic coverage. On the other hand commercial off-the-shelf (COTS) devices adoption began to be considered for safety-related systems due to real-time requirements, the need for the implementation of computationally hungry algorithms and lower design costs. In this field FPGA market share is constantly increased, thanks to their flexibility and low non-recurrent engineering costs, making them suitable for a set of safety critical applications with low production volumes. The works presented in this thesis tries to face new dependability issues in modern reconfigurable systems, exploiting their special features to take proper counteractions with low impacton performances, namely Dynamic Partial Reconfiguration

Analyse und Erweiterung eines fehler-toleranten NoC für SRAM-basierte FPGAs in Weltraumapplikationen

Data Processing Units for scientific space mission need to process ever higher volumes of data and perform ever complex calculations. But the performance of available space-qualified general purpose processors is just in the lower three digit megahertz range, which is already insufficient for some applications. As an alternative, suitable processing steps can be implemented in hardware on a space-qualified SRAM-based FPGA. However, suitable devices are susceptible against space radiation. At the Institute for Communication and Network Engineering a fault-tolerant, network-based communication architecture was developed, which enables the construction of processing chains on the basis of different processing modules within suitable SRAM-based FPGAs and allows the exchange of single processing modules during runtime, too. The communication architecture and its protocol shall isolate non SEU mitigated or just partial SEU mitigated modules affected by radiation-induced faults to prohibit the propagation of errors within the remaining System-on-Chip. In the context of an ESA study, this communication architecture was extended with further components and implemented in a representative hardware platform. Based on the acquired experiences during the study, this work analyses the actual fault-tolerance characteristics as well as weak points of this initial implementation. At appropriate locations, the communication architecture was extended with mechanisms for fault-detection and fault-differentiation as well as with a hardware-based monitoring solution. Both, the former measures and the extension of the employed hardware-platform with selective fault-injection capabilities for the emulation of radiation-induced faults within critical areas of a non SEU mitigated processing module, are used to evaluate the effects of radiation-induced faults within the communication architecture. By means of the gathered results, further measures to increase fast detection and isolation of faulty nodes are developed, selectively implemented and verified. In particular, the ability of the communication architecture to isolate network nodes without SEU mitigation could be significantly improved.Instrumentenrechner für wissenschaftliche Weltraummissionen müssen ein immer höheres Datenvolumen verarbeiten und immer komplexere Berechnungen ausführen. Die Performanz von verfügbaren qualifizierten Universalprozessoren liegt aber lediglich im unteren dreistelligen Megahertz-Bereich, was für einige Anwendungen bereits nicht mehr ausreicht. Als Alternative bietet sich die Implementierung von entsprechend geeigneten Datenverarbeitungsschritten in Hardware auf einem qualifizierten SRAM-basierten FPGA an. Geeignete Bausteine sind jedoch empfindlich gegenüber der Strahlungsumgebung im Weltraum. Am Institut für Datentechnik und Kommunikationsnetze wurde eine fehlertolerante netzwerk-basierte Kommunikationsarchitektur entwickelt, die innerhalb eines geeigneten SRAM-basierten FPGAs Datenverarbeitungsmodule miteinander nach Bedarf zu Verarbeitungsketten verbindet, sowie den Austausch von einzelnen Modulen im Betrieb ermöglicht. Nicht oder nur partiell SEU mitigierte Module sollen bei strahlungsbedingten Fehlern im Modul durch das Protokoll und die Fehlererkennungsmechanismen der Kommunikationsarchitektur isoliert werden, um ein Ausbreiten des Fehlers im restlichen System-on-Chip zu verhindern. Im Kontext einer ESA Studie wurde diese Kommunikationsarchitektur um Komponenten erweitert und auf einer repräsentativen Hardwareplattform umgesetzt. Basierend auf den gesammelten Erfahrungen aus der Studie, wird in dieser Arbeit eine Analyse der tatsächlichen Fehlertoleranz-Eigenschaften sowie der Schwachstellen dieser ursprünglichen Implementierung durchgeführt. Die Kommunikationsarchitektur wurde an geeigneten Stellen um Fehlerdetektierungs- und Fehlerunterscheidungsmöglichkeiten erweitert, sowie um eine hardwarebasierte Überwachung ergänzt. Sowohl diese Maßnahmen, als auch die Erweiterung der Hardwareplattform um gezielte Fehlerinjektions-Möglichkeiten zum Emulieren von strahlungsinduzierten Fehlern in kritischen Komponenten eines nicht SEU mitigierten Prozessierungsmoduls werden genutzt, um die tatsächlichen auftretenden Effekte in der Kommunikationsarchitektur zu evaluieren. Anhand der Ergebnisse werden weitere Verbesserungsmaßnahmen speziell zur schnellen Detektierung und Isolation von fehlerhaften Knoten erarbeitet, selektiv implementiert und verifiziert. Insbesondere die Fähigkeit, fehlerhafte, nicht SEU mitigierte Netzwerkknoten innerhalb der Kommunikationsarchitektur zu isolieren, konnte dabei deutlich verbessert werden

GPU devices for safety-critical systems: a survey

Graphics Processing Unit (GPU) devices and their associated software programming languages and frameworks can deliver the computing performance required to facilitate the development of next-generation high-performance safety-critical systems such as autonomous driving systems. However, the integration of complex, parallel, and computationally demanding software functions with different safety-criticality levels on GPU devices with shared hardware resources contributes to several safety certification challenges. This survey categorizes and provides an overview of research contributions that address GPU devices’ random hardware failures, systematic failures, and independence of execution.This work has been partially supported by the European Research Council with Horizon 2020 (grant agreements No. 772773 and 871465), the Spanish Ministry of Science and Innovation under grant PID2019-107255GB, the HiPEAC Network of Excellence and the Basque Government under grant KK-2019-00035. The Spanish Ministry of Economy and Competitiveness has also partially supported Leonidas Kosmidis with a Juan de la Cierva Incorporación postdoctoral fellowship (FJCI-2020- 045931-I).Peer ReviewedPostprint (author's final draft

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast