MEMS Accelerometers

Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

CMOS systems and circuits for sub-degree per hour MEMS gyroscopes

The objective of our research is to develop system architectures and CMOS circuits that interface with high-Q silicon microgyroscopes to implement navigation-grade angular rate sensors. The MEMS sensor used in this work is an in-plane bulk-micromachined mode-matched tuning fork gyroscope (M² – TFG ), fabricated on silicon-on-insulator substrate. The use of CMOS transimpedance amplifiers (TIA) as front-ends in high-Q MEMS resonant sensors is explored. A T-network TIA is proposed as the front-end for resonant capacitive detection. The T-TIA provides on-chip transimpedance gains of 25MΩ, has a measured capacitive resolution of 0.02aF /√Hz at 15kHz, a dynamic range of 104dB in a bandwidth of 10Hz and consumes 400μW of power. A second contribution is the development of an automated scheme to adaptively bias the mechanical structure, such that the sensor is operated in the mode-matched condition. Mode-matching leverages the inherently high quality factors of the microgyroscope, resulting in significant improvement in the Brownian noise floor, electronic noise, sensitivity and bias drift of the microsensor. We developed a novel architecture that utilizes the often ignored residual quadrature error in a gyroscope to achieve and maintain perfect mode-matching (i.e.0Hz split between the drive and sense mode frequencies), as well as electronically control the sensor bandwidth. A CMOS implementation is developed that allows mode-matching of the drive and sense frequencies of a gyroscope at a fraction of the time taken by current state of-the-art techniques. Further, this mode-matching technique allows for maintaining a controlled separation between the drive and sense resonant frequencies, providing a means of increasing sensor bandwidth and dynamic range. The mode-matching CMOS IC, implemented in a 0.5μm 2P3M process, and control algorithm have been interfaced with a 60μm thick M2−TFG to implement an angular rate sensor with bias drift as low as 0.1°/hr ℃ the lowest recorded to date for a silicon MEMS gyro.Ph.D.Committee Chair: Farrokh Ayazi; Committee Member: Jennifer Michaels; Committee Member: Levent Degertekin; Committee Member: Paul Hasler; Committee Member: W. Marshall Leac

DESIGN AND MICROFABRICATION OF A CMOS-MEMS PIEZORESISTIVE ACCELEROMETER AND A NANO-NEWTON FORCE SENSOR

DESIGN AND MICROFABRICATION OF A CMOS-MEMS PIEZORESISTIVE ACCELEROMETER AND A NANO-NEWTON FORCE SENSOR by Mohd Haris Md Khir Adviser: Hongwei Qu, Ph.D. This thesis work consists of three aspects of research efforts: I. Design, fabrication, and characterization of a CMOS-MEMS piezoresistive accelerometer 2. Design, fabrication, and characterization of a CMOS-MEMS nano-Newton force sensor 3. Observer-based controller design of a nano-Newton force sensor actuator system A low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass has been fabricated. Inherent CMOS polysilicon thin film was utilized as piezoresistive material and full Wheatstone bridge was constructed through easy wiring allowed by three metal layers in CMOS thin films. The device fabrication process consists of a standard CMOS process for sensor configuration and a deep reactive ion etching (DRIE) based post-CMOS microfabrication for MEMS structure release. Bulk single-crystal silicon (SCS) substrate was included in the proof mass to increase sensor sensitivity. Using a low operating power of 1.67 m W, the sensitivity was measured as 30.7 mV/g after amplification and 0.077 mV/g prior to amplification. With a total noise floor of 1.03 mg!-!Hz, the minimum detectable acceleration is found to be 32.0 mg for a bandwidth of I kHz which is sufficient for many applications. The second device investigated in this thesis work is a CMOS-MEMS capacitive force sensor capable ofnano-Newton out-of-plane force measurement. Sidewall and fringe capacitance formed by the multiple CMOS metal layers were utilized and fully differential sensing was enabled by common-centroid wiring of the sensing capacitors. Single-crystal silicon (SCS) is incorporated in the entire sensing element for robust structures and reliable sensor deployment in force measurement. A sensitivity of 8 m V /g prior to amplification was observed. With a total noise floor of 0.63 mg!-IHz, the minimum detection acceleration is found to be 19.8 mg, which is equivalent to a sensing force of 449 nN. This work also addresses the design and simulation of an observer-based nonlinear controller employed in a CMOS-MEMS nano-Newton force sensor actuator system. Measurement errors occur when there are in-plane movements of the probe tip; these errors can be controlled by the actuators incorporated within the sensor. Observerbased controller is necessitated in real-world control applications where not all the state variables are accessible for on-line measurements. V

Seismic and vibration signal analysis and monitoring using LabView

Every year there are around 20 earthquakes of magnitude 7 or above . This kind of seismic events are potentially destructive and can cause several structural damage, economic and human loss. In order to perform an efficient risk management and prevention work geophysics must be equipped with suitable software and hardware tools. Seismic studies comprise not only risk management but earth structure studies that are useful in gas and oil prospections. Vibration monitoring has also turned in a very useful scientific approach to deal with structural safety and maintenance. Among these devices, MEMS accelerometer combines great performance with low costs, characteristics that have made it one of the most popular devices when it comes to this task. Seismic analysis software has been developed using LabVIEW. The software decodes SAC data files and retrieves important seismic parameters like arrival wave times, location and magnitude. The precision and performance reached is acceptable for the scope of this project and it could be used as a domestic seismic analyser but not for its use in a professional seismic station. The seismic data for the system evaluation was retrieved from IRIS database. A vibration DAQ and monitoring module has been designed and implemented. It successfully measures and monitors acceleration versus time and the signal’s spectra. Zooming options were included in order to make easier the background noise and ambient vibration study. An instant and maximum earthquake intensity gauge was programmed to give an idea of the experienced event potential danger. The user can selectively save acceleration time responses in LVM format. An analogue output was implemented. It is capable of reading acceleration versus time responses saved in LVM and SAC files and output them using a DAQ card analogue output function. This voltage can be seen in an oscilloscope or input to other devices. In order to acquire and save the analogue waveforms created with the previous function an analogue input was included as an initial objective in the Scheme of Work. However, it was dropped in the final implementation because it was considered that its function was too similar to the vibration DAQ module and it did not have enough practical application

THE ADVANTAGES OF MODEL 4807A HIGH RESOLUTION ACCELEROMETER

This paper is aimed to inform the advantages of model 4807A accelerometer as device of measurement base on literature review. The model 4807A accelerometer is produced by Measurement Specialties, Inc. It has many advantages such as hermetically sealed and offers an amplified signal output covering ranges from ± 2 g to ± 200 g, and built-in mechanical overload stops for shock protection to 5,000 g. This model accelerometer can be applied in many fields, such as Vibration Isolation, Flight Testing, Trajectory Profiling, Structural Monitoring, and Researches & Development

Advanced single-chip temperature stabilization system for silicon MEMS resonators and gyroscopes

The main objective of this research is to develop temperature and frequency stabilization techniques for silicon MEMS oven-controlled crystal oscillators (MEMS OCXO) with high-frequency stability. The device was built upon an ovenized platform that used a micro-heater to adjust the temperature of the resonator. Structural resistance-based (Rstruc) temperature sensing was used to improve the self-temperature monitoring accuracy of the silicon MEMS resonator. An analog feedback micro-oven control loop and a feedforward digital calibration scheme were developed for a 77MHz MEMS oscillator, which achieved a ±0.3ppm frequency stability from -25°C to 85°C. An AC heating scheme was also developed to enable tighter integration of the resonator, temperature sensor (Rstruc) and heaters. This temperature stabilization technique was also applied to silicon MEMS mode-matched vibratory x/y-axis and z-axis gyroscopes on a single chip. The temperature-induced frequency change, scale factor and output bias variations were all reduced significantly. The complete interface circuit for the single-chip three axes gyroscopes were also developed with an innovative trans-impedance amplifier to reduce the input-referred noise. For the first time, the simultaneous operation of mode-matched vibratory 3-axis MEMS gyroscopes on a single chip was demonstrated.Ph.D