SFERA: An Integrated Circuit for the Readout of X and γ-Ray Detectors

In this work we present SFERA, a low-noise fully-programmable 16 channel readout ASIC designed for both X- and γ-ray spectroscopy and imaging applications. The chip is designed to process signals coming from solid-state detectors and CMOS preamplifiers. The design has been guided by the use of Silicon Drift Detectors (SDDs) and CUBE charge sensitive amplifiers (CSAs), although we consider the ASIC sufficiently versatile to be used with other types of detectors. Five different gains are implemented, namely 2800 e-, 4400 e-, 10000 e-, 14000 e- and 20000 e-, considering the input connected to a 25 fF feedback capacitance CMOS preamplifier. Filter peaking times (tP) are also programmable among 0.5, 1, 2, 3, 4 and 6 μs. Each readout channel is the cascade of a 9th order semi-Gaussian shaping-amplifier (SA) and a peak detector (PKS), followed by a dedicated pile-up rejection (PUR) digital logic. Three data multiplexing strategies are implemented: the so-called polling X, intended for high-rate X-ray applications, the polling γ, for scintillation light detection and the sparse, for signals derandomization. The spectroscopic characterization has shown an energy resolution of 122.1 eV FWHM on the Mn-Kα line of an 55Fe X-ray source using a 10 mm2 SDD cooled at -35 °C at 4 μs filter peaking time. The measured resolution is 130 eV at the peaking time of 500 ns. At 1 Mcps input count rate and 500 ns peaking time, we have measured 42% of processed events at the output of the ASIC after the PUR selection. Output data can be digitized on-chip by means of an embedded 12-bit successive-approximation ADC. The effective resolution of the data converter is 10.75-bit when operated at 4.5 MS/s. The chosen technology is the AMS 0.35 μm CMOS and the chip area occupancy is 5× 5 mm2

CMOS Transducers and Programmable Interface Circuits for Resource-Efficient Sensing Applications

Modern sensors are complex systems comprising multiple sub-systems such as transducers, analog and mixed-signal interface circuits, digital processing circuits, and packaging. Over the last few decades, innovations in these sub-systems combined with their increased integration in complementary metal-oxide semiconductor (CMOS) processes have led to the rapid growth in sensors for the Internet-of-Things (IoT), wearable devices, and fundamental scientific instrumentation. This thesis introduces novel ideas for various parts of a sensor signal chain. First, CMOS-based transducers (i.e. sensing elements) are introduced. Single-photon avalanche diodes (SPADs) fabricated in 0.18µm and 0.13µm standard CMOS processes are demonstrated and characterized for various optical sensing techniques. A resistor fabricated using standard CMOS-BEOL layers in a 0.18µm process is used to demonstrate a compact, fully-integrated single-element flow sensor occupying less than 0.065mm2. Second, front-end interface circuits for single-photon optical detectors are introduced. A fully-integrated SPAD-based ambient light sensor using mostly digital circuits and fabricated in a 0.13µm CMOS process is highlighted. It consumes 125μW and achieves one of the lowest reported areas (0.046mm2) in the literature. A custom analog front-end (AFE) chip is fabricated in a 0.18µm CMOS process for interfacing with a commercial silicon photomultiplier (SiPM) for gamma spectroscopy. It incorporates tunability of dynamic range and integration time, thus making it suitable for different detectors (i.e. SiPM and scintillator crystal combinations). Third, non-linear analog-to-digital converters (NL-ADCs) are explored as a viable alternative to linear ADCs for information-aware, non-uniform quantization and a widely reconfigurable piecewise-linear analog-to-digital converter (PWL-ADC) prototype chip (0.18µm CMOS) is used to validate this. With a 7-bit output word, it achieves 5.6-bit to 9.5-bit resolution in user-defined regions of the input full-scale range (FSR), while consuming 105µW at a sampling frequency of 42kHz. Measurements with recorded ECG waveforms are used to highlight the application-specific advantages of the PWL-ADC. Finally, some of the aforementioned ideas are used at the system level in a gamma spectrometer realized on a printed circuit board (PCB). The PCB design includes the AFE and PWL-ADC IC chips, a commercial SiPM and scintillator crystal, and a FPGA-based digital back-end (DBE). Several linear and non-linear isotope spectra with variable energy bin-widths (dE/bin) are recorded and analyzed to demonstrate the utility of the proposed concepts for peak enhancement and improved peak discrimination in radiation spectroscopy

A compact high-energy particle detector for low-cost deep space missions

Over the last few decades particle physics has led to many new discoveries, laying the foundation for modern science. However, there are still many unanswered questions which the next generation of particle detectors could address, potentially expanding our knowledge and understanding of the Universe. Owing to recent technological advancements, electronic sensors are now able to acquire measurements previously unobtainable, creating opportunities for new deep-space high-energy particle missions. Consequently, a new compact instrument was developed capable of detecting gamma rays, neutrons and charged particles. This instrument combines the latest in FPGA System-on-Chip technology as the central processor and a 3x3 array of silicon photomultipliers coupled with an organic plastic scintillator as the detector. Using modern digital pulse shape discrimination and signal processing techniques, the scintillator and photomultiplier combination has been shown to accurately discriminate between the di_erent particle types and provide information such as total energy and incident direction. The instrument demonstrated the ability to capture 30,000 particle events per second across 9 channels - around 15 times that of the U.S. based CLAS detector. Furthermore, the input signals are simultaneously sampled at a maximum rate of 5 GSPS across all channels with 14-bit resolution. Future developments will include FPGA-implemented digital signal processing as well as hardware design for small satellite based deep-space missions that can overcome radiation vulnerability

High-Speed Radhard Mega-Pixel CIS Camera for High-Energy Physics

This dissertation describes the schematic design, physical layout implementation, system-level hardware with FPGA firmware design, and testing of a camera-on-a-chip with a novel high-speed CMOS image sensor (CIS) architecture developed for a mega-pixel array. The novel features of the design include an innovative quadruple column-parallel readout (QCPRO) scheme with rolling shutter that increases pixel rate, its ability to program the frame rate and to tolerate Total Ionizing Dose effects (TID). Two versions of the architecture, a small (128 x 1,024 pixels) and large (768 x 1,024 pixels) version were designed and fabricated with a custom layout that does not include library parts. The designs achieve a performance of 20 to 4,000 frames per second (fps) and they tolerate up to 125 krads of radiation exposure. The high-speed CIS architecture proposes and implements a creative quadruple column-parallel readout (QCPRO) scheme to achieve a maximum pixel rate, 10.485 gigapixels/s. The QCPRO scheme consists of four readout blocks per column and to complete four rows of pixels readout process at one line time. Each column-level readout block includes an analog time-interleaving (ATI) sampling circuit, a switched-capacitor programmable gain amplifier (SC-PGA), a 10-bit successive-approximation register (SAR) ADC, two 10-bit memory banks. The column-parallel SAR ADC is area-efficient to be laid out in half of one pixel pitch, 10 um. The analog ATI sampling circuit has two sample-and-hold circuits. Each sampling circuit can independently complete correlated double sampling (CDS) operation. Furthermore, to deliver over 10^10 pixel data in one second, a high-speed differential Scalable Low-Voltage Signaling (SLVS) transmitter for every 16 columns is designed to have 1 Gbps/ch at 0.4 V. Two memory banks provide a ping-pong operation: one connecting to the ADC for storing digital data and the other to the SLVS for delivering data to the off-chip FPGA. Therefore, the proposed CIS architecture can achieve 10,000 frames per second for a 1,024 x 1,024 pixel array. The floor plan of the proposed CIS architecture is symmetrical having one-half of pixel rows to read out on top, and the other half read out on the bottom of the pixel array. The rolling shutter feature with multi-lines readout in parallel and oversampling technique relaxes the image artifacts for capturing fast-moving objects. The CIS camera can provide complete digital input control and digital pixel data output. Many other components are designed and integrated into the proposed CMOS imager, including the Serial Peripheral Interface (SPI), bandgap reference, serializers, phase-locked loops (PLLs), and sequencers with configuration registers. Also, the proposed CIS can program the frame rate for wider applications by modifying three parameters: input clock frequency, the region of interest, and the counter size in the sequencer. The radiation hardening feature is achieved by using the combination of enclosed geometry technique and P-type guard-rings in the 0.18 um CMOS technology. The peripheral circuits use P-type guard-rings to cut the TID-induced leakage path between device to device. Each pixel cell is radiation tolerant by using enclosed layout transistors. The pinned photodiode is also used to get low dark current, and correlated double sampling to suppress pixel-level fixed-pattern noise and reset noise. The final pixel cell is laid out in 20 x 20 um^2. The total area of the pixel array is 2.56 x 20.28 mm^2 for low-resolution imager prototype and 15.36 x 20.28 mm^2 for high-resolution imager prototype. The entire CIS camera system is developed by the implementation of the hardware and FPGA firmware of the small-format prototype with 128 x 1,024 pixels and 754 pads in a 4.24 x 25.125 mm^2 die area. Different testing methods are also briefly described for different test purposes. Measurement results validate the functionalities of the readout path, sequencer, on-chip PLLs, and the SLVS transmitters. The programmable frame rate feature is also demonstrated by checking the digital control outputs from the sequencer at different frame rates. Furthermore, TID radiation tests proved the pixels can work under 125 krads radiation exposure

Electronics for Sensors

The aim of this Special Issue is to explore new advanced solutions in electronic systems and interfaces to be employed in sensors, describing best practices, implementations, and applications. The selected papers in particular concern photomultiplier tubes (PMTs) and silicon photomultipliers (SiPMs) interfaces and applications, techniques for monitoring radiation levels, electronics for biomedical applications, design and applications of time-to-digital converters, interfaces for image sensors, and general-purpose theory and topologies for electronic interfaces

The upgrade of the ALICE TPC with GEMs and continuous readout

The upgrade of the ALICE TPC will allow the experiment to cope with the high interaction rates foreseen for the forthcoming Run 3 and Run 4 at the CERN LHC. In this article, we describe the design of new readout chambers and front-end electronics, which are driven by the goals of the experiment. Gas Electron Multiplier (GEM) detectors arranged in stacks containing four GEMs each, and continuous readout electronics based on the SAMPA chip, an ALICE development, are replacing the previous elements. The construction of these new elements, together with their associated quality control procedures, is explained in detail. Finally, the readout chamber and front-end electronics cards replacement, together with the commissioning of the detector prior to installation in the experimental cavern, are presented. After a nine-year period of R&D, construction, and assembly, the upgrade of the TPC was completed in 2020.publishedVersio

A Low-Power Silicon-Photomultiplier Readout ASIC for the CALICE Analog Hadronic Calorimeter

The future e + e − collider experiments, such as the international linear collider, provide precise measurements of the heavy bosons and serve as excellent tests of the underlying fundamental physics. To reconstruct these bosons with an unprecedented resolution from their multi-jet final states, a detector system employing the particle flow approach has been proposed, requesting calorimeters with imaging capabilities. The analog hadron calorimeter based on the SiPM-on-tile technology is one of the highly granular candidates of the imaging calorimeters. To achieve the compactness, the silicon-photomultiplier (SiPM) readout electronics require a low-power monolithic solution. This thesis presents the design of such an application-specific integrated circuit (ASIC) for the charge and timing readout of the SiPMs. The ASIC provides precise charge measurement over a large dynamic range with auto-triggering and local zero-suppression functionalities. The charge and timing information are digitized using channel-wise analog-to-digital and time-to-digital converters, providing a fully integrated solution for the SiPM readout. Dedicated to the analog hadron calorimeter, the power-pulsing technique is applied to the full chip to meet the stringent power consumption requirement. This work also initializes the commissioning of the calorimeter layer with the use of the designed ASIC. An automatic calibration procedure has been developed to optimized the configuration settings for the chip. The new calorimeter base unit with the designed ASIC has been produced and its functionality has been tested

Data Acquisition Applications

Data acquisition systems have numerous applications. This book has a total of 13 chapters and is divided into three sections: Industrial applications, Medical applications and Scientific experiments. The chapters are written by experts from around the world, while the targeted audience for this book includes professionals who are designers or researchers in the field of data acquisition systems. Faculty members and graduate students could also benefit from the book