System-on-chip Computing and Interconnection Architectures for Telecommunications and Signal Processing

This dissertation proposes novel architectures and design techniques targeting SoC building blocks for telecommunications and signal processing applications. Hardware implementation of Low-Density Parity-Check decoders is approached at both the algorithmic and the architecture level. Low-Density Parity-Check codes are a promising coding scheme for future communication standards due to their outstanding error correction performance. This work proposes a methodology for analyzing effects of finite precision arithmetic on error correction performance and hardware complexity. The methodology is throughout employed for co-designing the decoder. First, a low-complexity check node based on the P-output decoding principle is designed and characterized on a CMOS standard-cells library. Results demonstrate implementation loss below 0.2 dB down to BER of 10^{-8} and a saving in complexity up to 59% with respect to other works in recent literature. High-throughput and low-latency issues are addressed with modified single-phase decoding schedules. A new "memory-aware" schedule is proposed requiring down to 20% of memory with respect to the traditional two-phase flooding decoding. Additionally, throughput is doubled and logic complexity reduced of 12%. These advantages are traded-off with error correction performance, thus making the solution attractive only for long codes, as those adopted in the DVB-S2 standard. The "layered decoding" principle is extended to those codes not specifically conceived for this technique. Proposed architectures exhibit complexity savings in the order of 40% for both area and power consumption figures, while implementation loss is smaller than 0.05 dB. Most modern communication standards employ Orthogonal Frequency Division Multiplexing as part of their physical layer. The core of OFDM is the Fast Fourier Transform and its inverse in charge of symbols (de)modulation. Requirements on throughput and energy efficiency call for FFT hardware implementation, while ubiquity of FFT suggests the design of parametric, re-configurable and re-usable IP hardware macrocells. In this context, this thesis describes an FFT/IFFT core compiler particularly suited for implementation of OFDM communication systems. The tool employs an accuracy-driven configuration engine which automatically profiles the internal arithmetic and generates a core with minimum operands bit-width and thus minimum circuit complexity. The engine performs a closed-loop optimization over three different internal arithmetic models (fixed-point, block floating-point and convergent block floating-point) using the numerical accuracy budget given by the user as a reference point. The flexibility and re-usability of the proposed macrocell are illustrated through several case studies which encompass all current state-of-the-art OFDM communications standards (WLAN, WMAN, xDSL, DVB-T/H, DAB and UWB). Implementations results are presented for two deep sub-micron standard-cells libraries (65 and 90 nm) and commercially available FPGA devices. Compared with other FFT core compilers, the proposed environment produces macrocells with lower circuit complexity and same system level performance (throughput, transform size and numerical accuracy). The final part of this dissertation focuses on the Network-on-Chip design paradigm whose goal is building scalable communication infrastructures connecting hundreds of core. A low-complexity link architecture for mesochronous on-chip communication is discussed. The link enables skew constraint looseness in the clock tree synthesis, frequency speed-up, power consumption reduction and faster back-end turnarounds. The proposed architecture reaches a maximum clock frequency of 1 GHz on 65 nm low-leakage CMOS standard-cells library. In a complex test case with a full-blown NoC infrastructure, the link overhead is only 3% of chip area and 0.5% of leakage power consumption. Finally, a new methodology, named metacoding, is proposed. Metacoding generates correct-by-construction technology independent RTL codebases for NoC building blocks. The RTL coding phase is abstracted and modeled with an Object Oriented framework, integrated within a commercial tool for IP packaging (Synopsys CoreTools suite). Compared with traditional coding styles based on pre-processor directives, metacoding produces 65% smaller codebases and reduces the configurations to verify up to three orders of magnitude

Exploiting heterogeneity in Chip-Multiprocessor Design

In the past decade, semiconductor manufacturers are persistent in building faster and smaller transistors in order to boost the processor performance as projected by Moore’s Law. Recently, as we enter the deep submicron regime, continuing the same processor development pace becomes an increasingly difficult issue due to constraints on power, temperature, and the scalability of transistors. To overcome these challenges, researchers propose several innovations at both architecture and device levels that are able to partially solve the problems. These diversities in processor architecture and manufacturing materials provide solutions to continuing Moore’s Law by effectively exploiting the heterogeneity, however, they also introduce a set of unprecedented challenges that have been rarely addressed in prior works. In this dissertation, we present a series of in-depth studies to comprehensively investigate the design and optimization of future multi-core and many-core platforms through exploiting heteroge-neities. First, we explore a large design space of heterogeneous chip multiprocessors by exploiting the architectural- and device-level heterogeneities, aiming to identify the optimal design patterns leading to attractive energy- and cost-efficiencies in the pre-silicon stage. After this high-level study, we pay specific attention to the architectural asymmetry, aiming at developing a heterogeneity-aware task scheduler to optimize the energy-efficiency on a given single-ISA heterogeneous multi-processor. An advanced statistical tool is employed to facilitate the algorithm development. In the third study, we shift our concentration to the device-level heterogeneity and propose to effectively leverage the advantages provided by different materials to solve the increasingly important reliability issue for future processors

Baseband analog front-end and digital back-end for reconfigurable multi-standard terminals

Multimedia applications are driving wireless network operators to add high-speed data services such as Edge (E-GPRS), WCDMA (UMTS) and WLAN (IEEE 802.11a,b,g) to the existing GSM network. This creates the need for multi-mode cellular handsets that support a wide range of communication standards, each with a different RF frequency, signal bandwidth, modulation scheme etc. This in turn generates several design challenges for the analog and digital building blocks of the physical layer. In addition to the above-mentioned protocols, mobile devices often include Bluetooth, GPS, FM-radio and TV services that can work concurrently with data and voice communication. Multi-mode, multi-band, and multi-standard mobile terminals must satisfy all these different requirements. Sharing and/or switching transceiver building blocks in these handsets is mandatory in order to extend battery life and/or reduce cost. Only adaptive circuits that are able to reconfigure themselves within the handover time can meet the design requirements of a single receiver or transmitter covering all the different standards while ensuring seamless inter-interoperability. This paper presents analog and digital base-band circuits that are able to support GSM (with Edge), WCDMA (UMTS), WLAN and Bluetooth using reconfigurable building blocks. The blocks can trade off power consumption for performance on the fly, depending on the standard to be supported and the required QoS (Quality of Service) leve

Open-access silicon photonics: current status and emerging initiatives

Silicon photonics is widely acknowledged as a game-changing technology driven by the needs of datacom and telecom. Silicon photonics builds on highly capital-intensive manufacturing infrastructure, and mature open-access silicon photonics platforms are translating the technology from research fabs to industrial manufacturing levels. To meet the current market demands for silicon photonics manufacturing, a variety of open-access platforms is offered by CMOS pilot lines, R&D institutes, and commercial foundries. This paper presents an overview of existing and upcoming commercial and noncommercial open-access silicon photonics technology platforms. We also discuss the diversity in these open-access platforms and their key differentiators

Design of complex integrated systems based on networks-on-chip: Trading off performance, power and reliability

The steady advancement of microelectronics is associated with an escalating number of challenges for design engineers due to both the tiny dimensions and the enormous complexity of integrated systems. Against this background, this work deals with Network-On-Chip (NOC) as the emerging design paradigm to cope with diverse issues of nanotechnology. The detailed investigations within the chapters focus on the communication-centric aspects of multi-core-systems, whereas performance, power consumption as well as reliability are considered likewise as the essential design criteria

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

An Outlook on Design Technologies for Future Integrated Systems

The economic and social demand for ubiquitous and multifaceted electronic systems-in combination with the unprecedented opportunities provided by the integration of various manufacturing technologies-is paving the way to a new class of heterogeneous integrated systems, with increased performance and connectedness and providing us with gateways to the living world. This paper surveys design requirements and solutions for heterogeneous systems and addresses design technologies for realizing them

A review of advances in pixel detectors for experiments with high rate and radiation

The Large Hadron Collider (LHC) experiments ATLAS and CMS have established hybrid pixel detectors as the instrument of choice for particle tracking and vertexing in high rate and radiation environments, as they operate close to the LHC interaction points. With the High Luminosity-LHC upgrade now in sight, for which the tracking detectors will be completely replaced, new generations of pixel detectors are being devised. They have to address enormous challenges in terms of data throughput and radiation levels, ionizing and non-ionizing, that harm the sensing and readout parts of pixel detectors alike. Advances in microelectronics and microprocessing technologies now enable large scale detector designs with unprecedented performance in measurement precision (space and time), radiation hard sensors and readout chips, hybridization techniques, lightweight supports, and fully monolithic approaches to meet these challenges. This paper reviews the world-wide effort on these developments.Comment: 84 pages with 46 figures. Review article.For submission to Rep. Prog. Phy