Design of Low Offset and High Speed CMOS Comparator for Analog to Digital Converter

In today’s world everything is digitized but nature is analog, so it is necessary to have such a device which converts analog signal into digital and for this analog to digital converter is required. Now a day’s ADC’s require lesser power, better slew rate, high speed and less offset. Performance limiting component for ADC’s are amplifiers and comparators in which comparator is the most important.This paper presents the design of low offset low power dissipation and high speed  comparator. The proposed comparator consists of a preamplifier stage, decision stage and self biased output buffer stage. The proposed design uses a low power current mirror circuitry for providing a highly biased current. The circuit is designed using 90nm CMOS process for a supply voltage of 1V and reference voltage of 0.5V and power consumption is approximately 300?W. Keywords: CMOS Comparator, Current Mirror, Pre Amplifier, Output Buffe

Free Speech and Its Relation to Self-Government by Alexander Meiklejohn

In today’s system-on-chip (SoC) implementations, power consumption is a key performance specification. The proliferation of mobile communication devices and distributed wireless sensor networks has necessitated the development of power-efficient analog, radio-frequency (RF), and digital integrated circuits. The rapid scaling of CMOS technology nodes presents opportunities and challenges. Benefits accrue in terms of integration density and higher switching speeds for the digital logic. However, the concomitant reduction in supply voltage and reduced gain of transistors pose obstacles to the design of highperformance analog and mixed-signal circuits such as analog front-ends (AFEs) and data converters. To achieve high DC gain, multistage amplifiers are becoming necessary in AFEs and analog-to-digital converters (ADCs) implemented in the latest CMOS process nodes. This thesis includes the design of multistage amplifiers in 40 nm and 65 nm CMOS processes. An AFE for capacitive body-coupled communication is presented with transistor schematic level results in 40 nm CMOS. The AFE consists of a cascade of amplifiers to boost the received signal followed by a Schmitt trigger which provides digital signal levels at the output. Low noise and reduced power consumption are the important performance criteria for the AFE. A two-stage, single-ended amplifier incorporating indirect compensation using split-length transistors has been designed. The compensation technique does not require the nulling resistor used in traditional Miller compensation. The AFE consisting of a cascade of three amplifiers achieves 57.6 dB DC gain with an input-referred noise power spectral density (PSD) of 4.4 nV/ while consuming 6.8 mW. Numerous compensation schemes have been proposed in the literature for multistage amplifiers. Most of these works investigate frequency compensation of amplifiers which drive large capacitive loads and require low unity-gain frequency. In this thesis, the frequency compensation schemes for high-speed, lowvoltage multistage CMOS amplifiers driving small capacitive loads have been investigated. Existing compensation schemes such as the nested Miller compensation with nulling resistor (NMCNR) and reversed nested indirect compensation (RNIC) have been applied to four-stage and three-stage amplifiers designed in 40 nm and 65 nm CMOS, respectively. The performance metrics used for comparing the different frequency compensation schemes are the unity gain  frequency, phase margin (PM), and total amount of compensation capacitance used. From transistor schematic simulation results, it is concluded that RNIC is more efficient than NMCNR. Successive approximation register (SAR) analog-to-digital converters (ADCs) are becoming increasingly popular in a wide range of applications due to their high power efficiency, design simplicity and scaling-friendly architecture. Singlechannel SAR ADCs have reached high resolutions with sampling rates exceeding 50 MS/s. Time-interleaved SAR ADCs have pushed beyond 1 GS/s with medium resolution. The generation and buffering of reference voltages is often not the focus of published works. For high-speed SAR ADCs, due to the sequential nature of the successive approximation algorithm, a high-frequency clock for the SAR logic is needed. As the digital-to-analog converter (DAC) output voltage needs to settle to the desired accuracy within half clock cycle period of the system clock, a speed limitation occurs due to imprecise DAC settling. The situation is exacerbated by parasitic inductance of bondwires and printed circuit board (PCB) traces especially when the reference voltages are supplied off-chip. In this thesis, a power efficient reference voltage buffer with small area has been implemented in 180 nm CMOS for a 10-bit 1 MS/s SAR ADC which is intended to be used in a fingerprint sensor. Since the reference voltage buffer is part of an industrial SoC, critical performance specifications such as fast settling, high power supply rejection ratio (PSRR), and low noise have to be satisfied under mismatch conditions and over the entire range of process, supply voltage and temperature (PVT) corners. A single-ended, current-mirror amplifier with cascodes has been designed to buffer the reference voltage. Performance of the buffer has been verified by exhaustive simulations on the post-layout extracted netlist. Finally, we describe the design of a 10-bit 50 MS/s SAR ADC in 65 nmCMOS with a high-speed, on-chip reference voltage buffer. In a SAR ADC, the capacitive array DAC is the most area-intensive block. Also a binary-weighted capacitor array has a large spread of capacitor values for moderate and high resolutions which leads to increased power consumption. In this work, a split binary-weighted capacitive array DAC has been used to reduce area and power consumption. The proposed ADC has bootstrapped sampling switches which meet 10-bit linearity over all PVT corners and a two-stage dynamic comparator. The important design parameters of the reference voltage buffer are derived in the context of the SAR ADC. The impact of the buffer on the ADC performance is illustrated by simulations using bondwire parasitics. In post-layout simulation which includes the entire pad frame and associated parasitics, the ADC achieves an ENOB of 9.25 bits at a supply voltage of 1.2 V, typical process corner, and sampling frequency of 50 MS/s for near-Nyquist input. Excluding the reference voltage buffer, the ADC achieves an energy efficiency of 25 fJ/conversion-step while occupying a core area of 0.055 mm2

High-Linearity Self-Biased CMOS Current Buffer

A highly linear fully self-biased class AB current buffer designed in a standard 0.18 mu m CMOS process with 1.8 V power supply is presented in this paper. It is a simple structure that, with a static power consumption of 48 mu W, features an input resistance as low as 89 Omega, high accuracy in the input-output current ratio and total harmonic distortion (THD) figures lower than -60 dB at 30 mu A amplitude signal and 1 kHz frequency. Robustness was proved through Monte Carlo and corner simulations, and finally validated through experimental measurements, showing that the proposed configuration is a suitable choice for high performance low voltage low power applications

A Robust 43-GHz VCO in CMOS for OC-768 SONET Applications

In this paper, we present a 43-GHz LC-VCO in 0.13-/spl mu/m CMOS for use in SONET OC-768 optical networks. A tuned output buffer is used to provide 1.3 V/sub p-p/ (single-ended) into a 90-fF capacitive load as is required when the VCO is used in typical clock and data recovery (CDR) circuits. Phase noise is -90 dBc/Hz at a 1-MHz offset from the carrier; this meets SONET jitter specifications. The design has a tune range of 4.2%. The VCO, including output buffers, consumes 14 mA from a 1-V supply and occupies 0.06 mm/sup 2/ of die area. Modern CMOS process characteristics and the high center frequency of this design mean that the tank loss is not dominated by the integrated inductor, but rather by the tank capacitance. An area-efficient inductor design that does not require any optimization is used

A 90 nm CMOS 16 Gb/s Transceiver for Optical Interconnects

Interconnect architectures which leverage high-bandwidth optical channels offer a promising solution to address the increasing chip-to-chip I/O bandwidth demands. This paper describes a dense, high-speed, and low-power CMOS optical interconnect transceiver architecture. Vertical-cavity surface-emitting laser (VCSEL) data rate is extended for a given average current and corresponding reliability level with a four-tap current summing FIR transmitter. A low-voltage integrating and double-sampling optical receiver front-end provides adequate sensitivity in a power efficient manner by avoiding linear high-gain elements common in conventional transimpedance-amplifier (TIA) receivers. Clock recovery is performed with a dual-loop architecture which employs baud-rate phase detection and feedback interpolation to achieve reduced power consumption, while high-precision phase spacing is ensured at both the transmitter and receiver through adjustable delay clock buffers. A prototype chip fabricated in 1 V 90 nm CMOS achieves 16 Gb/s operation while consuming 129 mW and occupying 0.105 mm^2

Design of a 4.2-5.4 GHz Differential LC VCO using 0.35 m SiGe BiCMOS Technology

In this paper, a 4.2-5.4 GHz, Gm LC voltage controlled oscillator (VCO) for IEEE 802.11a standard is presented. The circuit is designed with AMS 0.35´m SiGe BiCMOS process that includes high-speed SiGe Heterojunction Bipolar Transistors (HBTs). Phase noise is -110.7 dBc/Hz at 1MHz offset from 5.4 GHz carrier frequency and -113.5 dBc/Hz from 4.2 GHz carrier frequency. A linear, 1200 MHz tuning range is obtained utilizing accumulation-mode varactors. Phase noise is relatively low due to taking the advantage of differential tuning concept. Output power of the fundamental frequency changes between 4.8 dBm and 5.5 dBm depending on the tuning voltage. The circuit draws 2 mA without buffers and 14.5 mA from 2.5 V supply including buffer circuits leading to a total power dissipation of 36.25 mW. The circuit occupies an area of 0.6 mm2 on Si substrate including RF and DC pads

Design of a ROIC for scanning type HgCdTe LWIR focal plane arrays

Design of a silicon readout integrated circuit (ROIC) for LWIR HgCdTe Focal Plane is presented. ROIC incorporates time delay integration (TDI) functionality over seven elements with a supersampling rate of three, increasing SNR and the spatial resolution. Novelty of this topology is inside TDI stage; integration of charges in TDI stage implemented in current domain by using switched current structures that reduces required area for chip and improves linearity performance. ROIC, in terms of functionality, is capable of bidirectional scan, programmable integration time and 5 gain settings at the input. Programming can be done parallel or serially with digital interface. ROIC can handle up to 3.5V dynamic range with the input stage to be direct injection (DI) type. With the load being 10pF capacitive in parallel with 1MΩ resistance, output settling time is less than 250nsec enabling the clock frequency up to 4MHz. The manufacturing technology is 0.35μm, double poly-Si, four-metal (3 metals and 1 top metal) 5V CMOS process

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads