36 research outputs found

    Data analytics approach for optimal qualification testing of electronic components

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    In electronics manufacturing, required quality of electronic components and parts is ensured through qualification testing using standards and user-defined requirements. The challenge for the industry is that product qualification testing is time-consuming and comes at a substantial cost. The work reported with this paper focus on the development and demonstration of a novel approach that can support “smart qualification testing” by using data analytics and data-driven prognostics modelling. Data analytics approach is developed and applied to historical qualification test datasets for an electronic module (Device under Test, DUT). The qualification spec involves a series of sequentially performed electrical and functional parameter tests on the DUTs. Data analytics is used to identify the tests that are sensitive to pending failure as well as to cross-evaluate the similarity in measurements between all tests, thus generating also knowledge on potentially redundant tests. The capability of data-driven prognostics modelling, using machine learning techniques and available historical qualification datasets, is also investigated. The results obtained from the study showed that predictive models developed from the identified so-called “sensitive to pending failure” tests feature superior performance compared with conventional, as measured, use of the test data. This work is both novel and original because at present, to the best knowledge of the authors, no similar predictive analytics methodology for qualification test time reduction (respectively cost reduction) is used in the electronics industry

    Data-driven prognostics for smart qualification testing of electronic products

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    A flaw or drift from expected operational performance in one electronic module or component may affect the reliability of the entire upper-level electronic product or system. Therefore, it is important to ensure the required quality of each individual electronic part through qualification testing specified using standards or user requirements. Qualification testing is time-consuming and comes at a substantial cost for product manufacturers. Many electronics manufacturers have access to large historical sets of qualification testing data from their products which may hold information to enable optimization of the respective qualification procedures. In this paper, techniques from the domain of computational intelligence are applied. The development of data-driven models capable to forecast accurately and in-line the end result of a sequence of qualification tests is discussed and presented. Data-driven prognostics models are developed using test data of the electronic module by Neural Network (NN) and Support Vector Machine (SVM) techniques. The performances of the models in predicting the qualification outcomes (pass or fail) are assessed

    MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS

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    This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due tothe breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter- and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies

    Prognostics and Health Monitoring for ECU Based on Piezoresistive Sensor Measurements

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    This dissertation presents a new approach to prognostics and health monitoring for automotive applications using a piezoresistive silicon stress sensor. The stress sensor is a component with promising performance for monitoring the condition of an electronic system, as it is able to measure stress values that can be directly related to the damage sustained by the system. The primary challenge in this study is to apply a stress sensor to system-level monitoring. To achieve this goal, this study firstly evaluates the uncertainties of measurement conducted with the sensor, and then the study develops a reliable solution for gathering data with a large number of sensors. After overcoming these preliminary challenges, the study forms a framework for monitoring an electronic system with a piezoresistive stress sensor. Following this, an approach to prognostics and health monitoring involving this sensor is established. Specifically, the study chooses to use a fusion approach, which includes both model-based and data-driven approaches to prognostics; such an approach minimizes the drawbacks of using these methods separately. As the first step, the physics of failure model for the investigated product is established. The process of physics of failure model development is supported by a detailed numerical analysis of the investigated product under both active and passive thermal loading. Accurate FEM modeling provides valuable insight into the product behavior and enables quantitative evaluation of loads acting in the considered design elements. Then, a real-time monitoring of the investigated product under given loading conditions is realized to enable the system to estimate the remaining useful life based on the existing model. However, the load in the design element may abruptly change when delamination occurs. A developed data-driven approach focuses on delamination detection based on a monitoring signal. The data driven methodology utilizes statistical pattern recognition methods in order to ensure damage detection in an automatic and reliable manner. Finally, a way to combine the developed physics-of-failure and data-driven approaches is proposed, thus creating fusion approach to prognostics and health monitoring based on piezoresistive stress sensor measurements

    Prognostics and Health Management in Nuclear Power Plants: A Review of Technologies and Applications

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    Lifecycle Prognostics Architecture for Selected High-Cost Active Components

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    ELECTRONIC PROGNOSTICS AND HEALTH MANAGEMENT: A RETURN ON INVESTMENT ANALYSIS

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    Prognostics and Health Management (PHM) provides the potential to lower sustainment costs, to improve maintenance decision-making, and to provide product usage feedback into the product design and validation process. A case analysis was developed using a discrete event simulation to determine the benefits and the potential cost avoidance resulting from the use of PHM in avionics. The model allows for variability in implementation costs, operational profile, false alarms, random failure rates, and system composition to enable a comprehensive calculation of the Return on Investment (ROI) in support of acquisition decision making. The case analysis compared the life cycle costs using unscheduled maintenance to the life cycle costs using two types of PHM approaches
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