Architectures for dependable modern microprocessors

Η εξέλιξη των ολοκληρωμένων κυκλωμάτων σε συνδυασμό με τους αυστηρούς χρονικούς περιορισμούς καθιστούν την επαλήθευση της ορθής λειτουργίας των επεξεργαστών μία εξαιρετικά απαιτητική διαδικασία. Με κριτήριο το στάδιο του κύκλου ζωής ενός επεξεργαστή, από την στιγμή κατασκευής των πρωτοτύπων και έπειτα, οι τεχνικές ελέγχου ορθής λειτουργίας διακρίνονται στις ακόλουθες κατηγορίες: (1) Silicon Debug: Τα πρωτότυπα ολοκληρωμένα κυκλώματα ελέγχονται εξονυχιστικά, (2) Manufacturing Testing: ο τελικό ποιοτικός έλεγχος και (3) In-field verification: Περιλαμβάνει τεχνικές, οι οποίες διασφαλίζουν την λειτουργία του επεξεργαστή σύμφωνα με τις προδιαγραφές του. Η διδακτορική διατριβή προτείνει τα ακόλουθα: (1) Silicon Debug: Η εργασία αποσκοπεί στην επιτάχυνση της διαδικασίας ανίχνευσης σφαλμάτων και στον αυτόματο εντοπισμό τυχαίων προγραμμάτων που δεν περιέχουν νέα -χρήσιμη- πληροφορία σχετικά με την αίτια ενός σφάλματος. Η κεντρική ιδέα αυτής της μεθόδου έγκειται στην αξιοποίηση της έμφυτης ποικιλομορφίας των αρχιτεκτονικών συνόλου εντολών και στην δυνατότητα από-διαμόρφωσης τμημάτων του κυκλώματος, (2) Manufacturing Testing: προτείνεται μία μέθοδο για την βελτιστοποίηση του έλεγχου ορθής λειτουργίας των πολυνηματικών και πολυπύρηνων επεξεργαστών μέσω της χρήση λογισμικού αυτοδοκιμής, (3) Ιn-field verification: Αναλύθηκε σε βάθος η επίδραση που έχουν τα μόνιμα σφάλματα σε μηχανισμούς αύξησης της απόδοσης. Επιπρόσθετα, προτάθηκαν τεχνικές για την ανίχνευση και ανοχή μόνιμων σφαλμάτων υλικού σε μηχανισμούς πρόβλεψης διακλάδωσης.Technology scaling, extreme chip integration and the compelling requirement to diminish the time-to-market window, has rendered microprocessors more prone to design bugs and hardware faults. Microprocessor validation is grouped into the following categories, based on where they intervene in a microprocessor’s lifecycle: (a) Silicon debug: the first hardware prototypes are exhaustively validated, (b) Μanufacturing testing: the final quality control during massive production, and (c) In-field verification: runtime error detection techniques to guarantee correct operation. The contributions of this thesis are the following: (1) Silicon debug: We propose the employment of deconfigurable microprocessor architectures along with a technique to generate self-checking random test programs to avoid the simulation step and triage the redundant debug sessions, (2) Manufacturing testing: We propose a self-test optimization strategy for multithreaded, multicore microprocessors to speedup test program execution time and enhance the fault coverage of hard errors; and (3) In-field verification: We measure the effect of permanent faults performance components. Then, we propose a set of low-cost mechanisms for the detection, diagnosis and performance recovery in the front-end speculative structures. This thesis introduces various novel methodologies to address the validation challenges posed throughout the life-cycle of a chip

Autonomously Reconfigurable Artificial Neural Network on a Chip

Artificial neural network (ANN), an established bio-inspired computing paradigm, has proved very effective in a variety of real-world problems and particularly useful for various emerging biomedical applications using specialized ANN hardware. Unfortunately, these ANN-based systems are increasingly vulnerable to both transient and permanent faults due to unrelenting advances in CMOS technology scaling, which sometimes can be catastrophic. The considerable resource and energy consumption and the lack of dynamic adaptability make conventional fault-tolerant techniques unsuitable for future portable medical solutions. Inspired by the self-healing and self-recovery mechanisms of human nervous system, this research seeks to address reliability issues of ANN-based hardware by proposing an Autonomously Reconfigurable Artificial Neural Network (ARANN) architectural framework. Leveraging the homogeneous structural characteristics of neural networks, ARANN is capable of adapting its structures and operations, both algorithmically and microarchitecturally, to react to unexpected neuron failures. Specifically, we propose three key techniques --- Distributed ANN, Decoupled Virtual-to-Physical Neuron Mapping, and Dual-Layer Synchronization --- to achieve cost-effective structural adaptation and ensure accurate system recovery. Moreover, an ARANN-enabled self-optimizing workflow is presented to adaptively explore a "Pareto-optimal" neural network structure for a given application, on the fly. Implemented and demonstrated on a Virtex-5 FPGA, ARANN can cover and adapt 93% chip area (neurons) with less than 1% chip overhead and O(n) reconfiguration latency. A detailed performance analysis has been completed based on various recovery scenarios

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Topical Workshop on Electronics for Particle Physics

The purpose of the workshop was to present results and original concepts for electronics research and development relevant to particle physics experiments as well as accelerator and beam instrumentation at future facilities; to review the status of electronics for the LHC experiments; to identify and encourage common efforts for the development of electronics; and to promote information exchange and collaboration in the relevant engineering and physics communities

Technology 2002: The Third National Technology Transfer Conference and Exposition, volume 2

Proceedings from symposia of the Technology 2002 Conference and Exposition, December 1-3, 1992, Baltimore, MD. Volume 2 features 60 papers presented during 30 concurrent sessions

Cumulative index to NASA Tech Briefs, 1986-1990, volumes 10-14

Tech Briefs are short announcements of new technology derived from the R&D activities of the National Aeronautics and Space Administration. These briefs emphasize information considered likely to be transferrable across industrial, regional, or disciplinary lines and are issued to encourage commercial application. This cumulative index of Tech Briefs contains abstracts and four indexes (subject, personal author, originating center, and Tech Brief number) and covers the period 1986 to 1990. The abstract section is organized by the following subject categories: electronic components and circuits, electronic systems, physical sciences, materials, computer programs, life sciences, mechanics, machinery, fabrication technology, and mathematics and information sciences

The CMS experiment at the CERN LHC

The Compact Muon Solenoid (CMS) detector is described. The detector operates at the Large Hadron Collider (LHC) at CERN. It was conceived to study proton-proton (and leadlead) collisions at a centre-of-mass energy of 14 TeV (5.5 TeV nucleon-nucleon) and at luminosities up to 1034 cm-2s-1 (1027 cm-2s-1). At the core of the CMS detector sits a high-magnetic field and large-bore superconducting solenoid surrounding an all-silicon pixel and strip tracker, a lead-tungstate scintillating-crystals electromagnetic calorimeter, and a brass-scintillator sampling hadron calorimeter. The iron yoke of the flux-return is instrumented with four stations of muon detectors covering most of the 4π solid angle. Forward sampling calorimeters extend the pseudorapidity coverage to high values (|η| ≤ 5) assuring very good hermeticity. The overall dimensions of the CMS detector are a length of 21.6 m, a diameter of 14.6 m and a total weight of 12500 t