Modeling DVFS and Power-Gating Actuators for Cycle-Accurate NoC-Based Simulators

Networks-on-chip (NoCs) are a widely recognized viable interconnection paradigm to support the multi-core revolution. One of the major design issues of multicore architectures is still the power, which can no longer be considered mainly due to the cores, since the NoC contribution to the overall energy budget is relevant. To face both static and dynamic power while balancing NoC performance, different actuators have been exploited in literature, mainly dynamic voltage frequency scaling (DVFS) and power gating. Typically, simulation-based tools are employed to explore the huge design space by adopting simplified models of the components. As a consequence, the majority of state-of-the-art on NoC power-performance optimization do not accurately consider timing and power overheads of actuators, or (even worse) do not consider them at all, with the risk of overestimating the benefits of the proposed methodologies. This article presents a simulation framework for power-performance analysis of multicore architectures with specific focus on the NoC. It integrates accurate power gating and DVFS models encompassing also their timing and power overheads. The value added of our proposal is manyfold: (i) DVFS and power gating actuators are modeled starting from SPICE-level simulations; (ii) such models have been integrated in the simulation environment; (iii) policy analysis support is plugged into the framework to enable assessment of different policies; (iv) a flexible GALS (globally asynchronous locally synchronous) support is provided, covering both handshake and FIFO re-synchronization schemas. To demonstrate both the flexibility and extensibility of our proposal, two simple policies exploiting the modeled actuators are discussed in the article

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

Polymorphic computing abstraction for heterogeneous architectures

Integration of multiple computing paradigms onto system on chip (SoC) has pushed the boundaries of design space exploration for hardware architectures and computing system software stack. The heterogeneity of computing styles in SoC has created a new class of architectures referred to as Heterogeneous Architectures. Novel applications developed to exploit the different computing styles are user centric for embedded SoC. Software and hardware designers are faced with several challenges to harness the full potential of heterogeneous architectures. Applications have to execute on more than one compute style to increase overall SoC resource utilization. The implication of such an abstraction is that application threads need to be polymorphic. Operating system layer is thus faced with the problem of scheduling polymorphic threads. Resource allocation is also an important problem to be dealt by the OS. Morphism evolution of application threads is constrained by the availability of heterogeneous computing resources. Traditional design optimization goals such as computational power and lower energy per computation are inadequate to satisfy user centric application resource needs. Resource allocation decisions at application layer need to permeate to the architectural layer to avoid conflicting demands which may affect energy-delay characteristics of application threads. We propose Polymorphic computing abstraction as a unified computing model for heterogeneous architectures to address the above issues. Simulation environment for polymorphic applications is developed and evaluated under various scheduling strategies to determine the effectiveness of polymorphism abstraction on resource allocation. User satisfaction model is also developed to complement polymorphism and used for optimization of resource utilization at application and network layer of embedded systems

A Scalable & Energy Efficient Graphene-Based Interconnection Framework for Intra and Inter-Chip Wireless Communication in Terahertz Band

Network-on-Chips (NoCs) have emerged as a communication infrastructure for the multi-core System-on-Chips (SoCs). Despite its advantages, due to the multi-hop communication over the metal interconnects, traditional Mesh based NoC architectures are not scalable in terms of performance and energy consumption. Folded architectures such as Torus and Folded Torus were proposed to improve the performance of NoCs while retaining the regular tile-based structure for ease of manufacturing. Ultra-low-latency and low-power express channels between communicating cores have also been proposed to improve the performance of conventional NoCs. However, the performance gain of these approaches is limited due to metal/dielectric based interconnection. Many emerging interconnect technologies such as 3D integration, photonic, Radio Frequency (RF), and wireless interconnects have been envisioned to alleviate the issues of a metal/dielectric interconnect system. However, photonic and RF interconnects need the additional physically overlaid optical waveguides or micro-strip transmission lines to enable data transmission across the NoC. Several on-chip antennas have shown to improve energy efficiency and bandwidth of on-chip data communications. However, the date rates of the mm-wave wireless channels are limited by the state-of-the-art power-efficient transceiver design. Recent research has brought to light novel graphene based antennas operating at THz frequencies. Due to the higher operating frequencies compared to mm-wave transceivers, the data rate that can be supported by these antennas are significantly higher. Higher operating frequencies imply that graphene based antennas are just hundred micrometers in size compared to dimensions in the range of a millimeter of mm-wave antennas. Such reduced dimensions are suitable for integration of several such transceivers in a single NoC for relatively low overheads. In this work, to exploit the benefits of a regular NoC structure in conjunction with emerging Graphene-based wireless interconnect. We propose a toroidal folding based NoC architecture. The novelty of this folding based approach is that we are using low power, high bandwidth, single hop direct point to point wireless links instead of multihop communication that happens through metallic wires. We also propose a novel phased based communication protocol through which multiple wireless links can be made active at a time without having any interference among the transceiver. This offers huge gain in terms of performance as compared to token based mechanism where only a single wireless link can be made active at a time. We also propose to extend Graphene-based wireless links to enable energy-efficient, phase-based chip-to-chip communication to create a seamless, wireless interconnection fabric for multichip systems as well. Through cycle-accurate system-level simulations, we demonstrate that such designs with torus like folding based on THz links instead of global wires along with the proposed phase based multichip systems. We provide estimates that they are able to provide significant gains (about 3 to 4 times better in terms of achievable bandwidth, packet latency and average packet energy when compared to wired system) in performance and energy efficiency in data transfer in a NoC as well as multichip system. Thus, realization of these kind of interconnection framework that could support high data rate links in Tera-bits-per-second that will alleviate the capacity limitations of current interconnection framework

Multilevel simulation-based co-design of next generation HPC microprocessors

This paper demonstrates the combined use of three simulation tools in support of a co-design methodology for an HPC-focused System-on-a-Chip (SoC) design. The simulation tools make different trade-offs between simulation speed, accuracy and model abstraction level, and are shown to be complementary. We apply the MUSA trace-based simulator for the initial sizing of vector register length, system-level cache (SLC) size and memory bandwidth. It has proven to be very efficient at pruning the design space, as its models enable sufficient accuracy without having to resort to highly detailed simulations. Then we apply gem5, a cycle-accurate micro-architecture simulator, for a more refined analysis of the performance potential of our reference SoC architecture, with models able to capture detailed hardware behavior at the cost of simulation speed. Furthermore, we study the network-on-chip (NoC) topology and IP placements using both gem5 for representative small- to medium-scale configurations and SESAM/VPSim, a transaction-level emulator for larger scale systems with good simulation speed and sufficient architectural details. Overall, we consider several system design concerns, such as processor subsystem sizing and NoC settings. We apply the selected simulation tools, focusing on different levels of abstraction, to study several configurations with various design concerns and evaluate them to guide architectural design and optimization decisions. Performance analysis is carried out with a number of representative benchmarks. The obtained numerical results provide guidance and hints to designers regarding SIMD instruction width, SLC sizing, memory bandwidth as well as the best placement of memory controllers and NoC form factor. Thus, we provide critical insights for efficient design of future HPC microprocessors.This work has been performed in the context of the European Processor Initiative (EPI) project, which has received funding from the European Union’s Horizon 2020 research and innovation program under Grant Agreement № 826647. A special thanks to Amir Charif and Arief Wicaksana for their invaluable contributions to the SESAM/VPSim tool in the initial phases of the EPI project.Peer ReviewedPostprint (author's final draft