A fault-tolerant last level cache for CMPs operating at ultra-low voltage

Voltage scaling to values near the threshold voltage is a promising technique to hold off the many-core power wall. However, as voltage decreases, some SRAM cells are unable to operate reliably and show a behavior consistent with a hard fault. Block disabling is a micro-architectural technique that allows low-voltage operation by deactivating faulty cache entries, at the expense of reducing the effective cache capacity. In the case of the last-level cache, this capacity reduction leads to an increase in off-chip memory accesses, diminishing the overall energy benefit of reducing the voltage supply. In this work, we exploit the reuse locality and the intrinsic redundancy of multi-level inclusive hierarchies to enhance the performance of block disabling with negligible cost. The proposed fault-aware last-level cache management policy maps critical blocks, those not present in private caches and with a higher probability of being reused, to active cache entries. Our evaluation shows that this fault-aware management results in up to 37.3% and 54.2% fewer misses per kilo instruction (MPKI) than block disabling for multiprogrammed and parallel workloads, respectively. This translates to performance enhancements of up to 13% and 34.6% for multiprogrammed and parallel workloads, respectively.Peer ReviewedPostprint (author's final draft

Exploiting Natural On-chip Redundancy for Energy Efficient Memory and Computing

Power density is currently the primary design constraint across most computing segments and the main performance limiting factor. For years, industry has kept power density constant, while increasing frequency, lowering transistors supply (Vdd) and threshold (Vth) voltages. However, Vth scaling has stopped because leakage current is exponentially related to it. Transistor count and integration density keep doubling every process generation (Moore’s Law), but the power budget caps the amount of hardware that can be active at the same time, leading to dark silicon. With each new generation, there are more resources available, but we cannot fully exploit their performance potential. In the last years, different research trends have explored how to cope with dark silicon and unlock the energy efficiency of the chips, including Near-Threshold voltage Computing (NTC) and approximate computing. NTC aggressively lowers Vdd to values near Vth. This allows a substantial reduction in power, as dynamic power scales quadratically with supply voltage. The resultant power reduction could be used to activate more chip resources and potentially achieve performance improvements. Unfortunately, Vdd scaling is limited by the tight functionality margins of on-chip SRAM transistors. When scaling Vdd down to values near-threshold, manufacture-induced parameter variations affect the functionality of SRAM cells, which eventually become not reliable. A large amount of emerging applications, on the other hand, features an intrinsic error-resilience property, tolerating a certain amount of noise. In this context, approximate computing takes advantage of this observation and exploits the gap between the level of accuracy required by the application and the level of accuracy given by the computation, providing that reducing the accuracy translates into an energy gain. However, deciding which instructions and data and which techniques are best suited for approximation still poses a major challenge. This dissertation contributes in these two directions. First, it proposes a new approach to mitigate the impact of SRAM failures due to parameter variation for effective operation at ultra-low voltages. We identify two levels of natural on-chip redundancy: cache level and content level. The first arises because of the replication of blocks in multi-level cache hierarchies. We exploit this redundancy with a cache management policy that allocates blocks to entries taking into account the nature of the cache entry and the use pattern of the block. This policy obtains performance improvements between 2% and 34%, with respect to block disabling, a technique with similar complexity, incurring no additional storage overhead. The latter (content level redundancy) arises because of the redundancy of data in real world applications. We exploit this redundancy compressing cache blocks to fit them in partially functional cache entries. At the cost of a slight overhead increase, we can obtain performance within 2% of that obtained when the cache is built with fault-free cells, even if more than 90% of the cache entries have at least a faulty cell. Then, we analyze how the intrinsic noise tolerance of emerging applications can be exploited to design an approximate Instruction Set Architecture (ISA). Exploiting the ISA redundancy, we explore a set of techniques to approximate the execution of instructions across a set of emerging applications, pointing out the potential of reducing the complexity of the ISA, and the trade-offs of the approach. In a proof-of-concept implementation, the ISA is shrunk in two dimensions: Breadth (i.e., simplifying instructions) and Depth (i.e., dropping instructions). This proof-of-concept shows that energy can be reduced on average 20.6% at around 14.9% accuracy loss

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Modular Architectures And Optimization Techniques For Power And Reliability In Future Many Core Microprocessors

Power and reliability issues are expected to increase in future multicore systems with a higher degree of component integration. As the feature sizes of transistors continue to shrink, more resources can be incorporated in microprocessors to address a broader spectrum of different application requirements. However, power constraints will limit the amount of resources that can be powered on at any given time. Recent studies have shown that future multicore systems will be able to power on less than 80% of their transistors in the near future, and less than 50% in the long term. The most difficult challenge is deciding which transistors should be powered on at any given time to deliver high performance under strict power constraints. At the same time, device reliability issues - the proliferation of devices that will either be defective at manufacturing time or will fail in the field with usage - are projected to be exacerbated by the continued scaling of device sizes. We present a modular, dynamically reconfigurable architecture as a promising unified solution to the problems of dark silicon (the inability to power all available computing resources) and reliability. Our modular architecture implements deconfigurable lanes within the decoupled sections of a superscalar pipeline that can be easily powered on or off to isolate faults or create an energy-efficient hardware configuration tailored to the needs of the running software. At the system level, we propose a novel framework that uses surrogate response surfaces and heuristic global optimization algorithms to characterize the behavior of applications at runtime and dynamically redistribute the available chip-wide power to obtain hardware configurations customized for the software diversity and system goals. Our reconfigurable architecture is able to provide high performance under a strict power budget, maintain a certain performance level at a reduced power cost, and in the case of hard faults, restore the system's performance to pre-fault levels

Approaches to multiprocessor error recovery using an on-chip interconnect subsystem

For future multicores, a dedicated interconnect subsystem for on-chip monitors was found to be highly beneficial in terms of scalability, performance and area. In this thesis, such a monitor network (MNoC) is used for multicores to support selective error identification and recovery and maintain target chip reliability in the context of dynamic voltage and frequency scaling (DVFS). A selective shared memory multiprocessor recovery is performed using MNoC in which, when an error is detected, only the group of processors sharing an application with the affected processors are recovered. Although the use of DVFS in contemporary multicores provides significant protection from unpredictable thermal events, a potential side effect can be an increased processor exposure to soft errors. To address this issue, a flexible fault prevention and recovery mechanism has been developed to selectively enable a small amount of per-core dual modular redundancy (DMR) in response to increased vulnerability, as measured by the processor architectural vulnerability factor (AVF). Our new algorithm for DMR deployment aims to provide a stable effective soft error rate (SER) by using DMR in response to DVFS caused by thermal events. The algorithm is implemented in real-time on the multicore using MNoC and controller which evaluates thermal information and multicore performance statistics in addition to error information. DVFS experiments with a multicore simulator using standard benchmarks show an average 6% improvement in overall power consumption and a stable SER by using selective DMR versus continuous DMR deployment

High Performance and Power Efficient On-Chip Network Designs through Multiple Injection Ports

Las redes dentro de un chip se están convirtiendo en el elemento principal de los sistemas multiprocesador. A medida que aumenta la escala de integración, más elementos de cómputo (procesadores) se incluyen en el mismo chip. Estos componentes se interconectan con una red dentro del chip que debe ofrecer latencias de transmisión ultra bajas (orden de nanosegundos) y anchos de banda elevados. El diseño, pues, de una red eficiente dentro del chip juega un papel fundamental. En la presente tesis se analizan diferentes alternativas de diseño de las redes en el chip. En particular, se hace uso de la posibilidad de utilizar diferentes puertos de inyección desde los procesadores con el fin de obtener diferentes mejoras. En primer lugar, las prestaciones aumentan al tener procesadores con distintas alternativas de inyección de tráfico. En segundo lugar, además aumenta la tolerancia a fallos frente a defectos de fabricación (mas importantes conforme avanza la tecnología). Y en tercer lugar, permite una política de apagado de componentes más agresiva que nos permita un ahorro significativo de energía. Hemos evaluado diferentes topologías derivadas del mecanismo de inyección en términos de prestaciones, coste de implementación, y ahorro de consumo. Además, hemos desarrollado simuladores específicos para las distintas técnicas utilizadas. Cada topología diseñada supone una mejora respecto a la anterior, y por supuesto, teniendo en cuenta las topologías existentes. En resumen, nuestro esfuerzo se centra en conseguir un excelente compromiso entre prestaciones, consumo y tolerancia a fallos dentro de una red en chip. Para la primera propuesta (topología NR-Mesh), se alcanzan mejoras en prestaciones de un 7\% y hasta de un 75\% en reducción de consumo de media, comparado con la malla 2D o malla de 2 dimensiones. Para la siguiente propuesta, la malla concentrada paralela (PC-Mesh), el beneficio en prestaciones que se obtiene es de hasta un 20\%, así cómo de un 60\% en reducción deCamacho Villanueva, J. (2012). High Performance and Power Efficient On-Chip Network Designs through Multiple Injection Ports [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/18235Palanci

Adaptive Distributed Architectures for Future Semiconductor Technologies.

Year after year semiconductor manufacturing has been able to integrate more components in a single computer chip. These improvements have been possible through systematic shrinking in the size of its basic computational element, the transistor. This trend has allowed computers to progressively become faster, more efficient and less expensive. As this trend continues, experts foresee that current computer designs will face new challenges, in utilizing the minuscule devices made available by future semiconductor technologies. Today's microprocessor designs are not fit to overcome these challenges, since they are constrained by their inability to handle component failures by their lack of adaptability to a wide range of custom modules optimized for specific applications and by their limited design modularity. The focus of this thesis is to develop original computer architectures, that can not only survive these new challenges, but also leverage the vast number of transistors available to unlock better performance and efficiency. The work explores and evaluates new software and hardware techniques to enable the development of novel adaptive and modular computer designs. The thesis first explores an infrastructure to quantitatively assess the fallacies of current systems and their inadequacy to operate on unreliable silicon. In light of these findings, specific solutions are then proposed to strengthen digital system architectures, both through hardware and software techniques. The thesis culminates with the proposal of a radically new architecture design that can fully adapt dynamically to operate on the hardware resources available on chip, however limited or abundant those may be.PHDComputer Science and EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/102405/1/apellegr_1.pd

A Holistic Solution for Reliability of 3D Parallel Systems

As device scaling slows down, emerging technologies such as 3D integration and carbon nanotube field-effect transistors are among the most promising solutions to increase device density and performance. These emerging technologies offer shorter interconnects, higher performance, and lower power. However, higher levels of operating temperatures and current densities project significantly higher failure rates. Moreover, due to the infancy of the manufacturing process, high variation, and defect densities, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Silicon-based transistors. The goal of this dissertation is to introduce new architectural and circuit techniques that can work around high-fault rates in the emerging 3D technologies, improving performance and reliability comparable to Silicon. We propose a new holistic approach to the reliability problem that addresses the necessary aspects of an effective solution such as detection, diagnosis, repair, and prevention synergically for a practical solution. By leveraging 3D fabric layouts, it proposes the underlying architecture to efficiently repair the system in the presence of faults. This thesis presents a fault detection scheme by re-executing instructions on idle identical units that distinguishes between transient and permanent faults while localizing it to the granularity of a pipeline stage. Furthermore, with the use of a dynamic and adaptive reconfiguration policy based on activity factors and temperature variation, we propose a framework that delivers a significant improvement in lifetime management to prevent faults due to aging. Finally, a design framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up Carbon Nano Tube-based technology is presented. The proposed framework is capable of efficiently supporting high-variation technologies by providing protection against manufacturing defects at different granularities: module and pipeline-stage levels.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168118/1/javadb_1.pd