438 research outputs found

    micromachined inertial sensors: the state-of-the-art and a look into the future

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    Development of a three-axis MEMS accelerometer

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    While originally developed to deploy air bags for the automotive industry, Microelectromechanical Systems (MEMS) based accelerometers have found their way into everything from video game controllers to cells phones. As prices drop and capabilities improve, it is expected that the use of accelerometers will further expand in the coming years. Accelerometers currently have the second highest MEMS sales volume, trailing only pressure sensors [1]. In this work several single and three-axis accelerometers are designed, fabricated, and tested under a variety of conditions. The designed accelerometers are all based off of the piezoresistive effect, where the value of a resistor changes with applied mechanical stress [2]. When accelerated, the inertia of a suspended proof mass causes stress on piezoresistors placed on support arms. The corresponding changes in these resistor values are then converted to an output voltage using a Wheatstone bridge. To sense acceleration independently in all three axes, structures with three distinct modes of vibration and three sets of Wheatstone bridges are used. Devices were fabricated at the Semiconductor and Microsystems Fabrication Laboratory (SMFL), located at RIT. A modified version of the RIT bulk MEMS process was used, consisting of 65 steps, 7 photolithography masks, bulk silicon diaphragm etch, and top hole release etch [3]. Unfortunately the finished chips show poor aluminum step coverage into contact vias and over polysilicon lines. This results in open circuits throughout the chip, prohibiting proper operation. Process corrections have been identified, and with proper fabrication the designs are still expected to yield working devices. Since the finished accelerometers were not functional, several commercial accelerometers have been tested to characterize sensitivity, linearity, cross-axis sensitivity, frequency response, and device lifetime

    A three-axis accelerometer for measuring heart wall motion

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    This thesis presents the work carried out in the design, simulation, fabrication and testing of miniaturised three-axis accelerometers. The work was carried out at the Faculty of Science and Engineering at Vestfold University College (Tønsberg, Norway), the MIcroSystems Engineering Centre (MISEC) at Heriot-Watt University and in collaboration with the Interventional Centre at Rikshospitalet University Hospital (Oslo, Norway). The accelerometers presented in this thesis were produced to be stitched to the surface of human hearts. In doing so they are used to measure the heart wall motion of patients that have just undergone heart bypass surgery. Results from studies carried out are presented and prove the concept of using such sensors for the detection of problems that can lead to the failure of heart bypasses. These studies were made possible using commercially available MEMS (MicroElectroMechanical Systems) three-axis accelerometers. However, the overall size of these sensors does not meet the requirements deemed necessary by the medical team (2(W) 2(H) 5(L) mm3) and fabrication activities were necessary to produce custom-made sensors. Design verification and performance modelling were carried out using Finite Element Analysis (FEA) and these results are presented alongside relevant analytical calculations. For fabrication, accelerometer designs were submitted to three foundry processes during the course of the work. The designs utilise the piezoresistive effect for the acceleration sensing and fabrication was carried out by bulk micromachining. Results of the characterisaton of the sensors are presente

    Development and implementation of a deflection amplification mechanism for capacitive accelerometers

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    Micro-Electro-Mechanical-Systems (MEMS) and especially physical sensors are part of a flourishing market ranging from consumer electronics to space applications. They have seen a great evolution throughout the last decades, and there is still considerable research effort for further improving their performance. This is reflected by the plethora of commercial applications using them but also by the demand from industry for better specifications. This demand together with the needs of novel applications fuels the research for better physical sensors.Applications such as inertial, seismic, and precision tilt sensing demand very high sensitivity and low noise. Bulk micromachined capacitive inertial sensors seem to be the most viable solution as they offer a large inertial mass, high sensitivity, good noise performance, they are easy to interface with, and of low cost. The aim of this thesis is to improve the performance of bulk micromachined capacitive sensors by enhancing their sensitivity and noise floor.MEMS physical sensors, most commonly, rely on force coupling and a resulting deflection of a proof mass or membrane to produce an output proportional to a stimulus of the physical quantity to be measured. Therefore, the sensitivity to a physical quantity may be improved by increasing the resulting deflection of a sensor. The work presented in this thesis introduces an approach based on a mechanical motion amplifier with the potential to improve the performance of mechanical MEMS sensors that rely on deflection to produce an output signal.The mechanical amplifier is integrated with the suspension system of a sensor. It comprises a system of micromachined levers (microlevers) to enhance the deflection of a proof mass caused by an inertial force. The mechanism can be used in capacitive accelerometers and gyroscopes to improve their performance by increasing their output signal. As the noise contribution of the electronic read-out circuit of a MEMS sensor is, to first order, independent of the amplitude of its input signal, the overall signal-to-noise ratio (SNR) of the sensor is improved.There is a rather limited number of reports in the literature for mechanical amplification in MEMS devices, especially when applied to amplify the deflection of inertial sensors. In this study, after a literature review, mathematical and computational methods to analyse the behaviour of microlevers were considered. By using these methods the mechanical and geometrical characteristics of microlevers components were evaluated. In order to prove the concept, a system of microlevers was implemented as a mechanical amplifier in capacitive accelerometers.All the mechanical structures were simulated using Finite Element Analysis (FEA) and system level simulations. This led to first order optimised devices that were used to design appropriate masks for fabrication. Two main fabrication processes were used; a Silicon on Insulator (SOI) process and a Silicon on Glass (SoG) process. The SOI process carried out at the University of Southampton evolved from a one mask to a two mask dicing free process with a yield of over 95%, in its third generation. The SoG is a well-established process at the University of Peking that uses three masks.The sensors were evaluated using both optical and electrical means. The results from the first prototype sensor design (1HAN) revealed an amplification factor of 40 and a mechanically amplified sensitivity of 2.39V/g. The measured natural frequency of the first mode of the sensor was at 734Hz and the full-scale measurement range was up to 7g with a maximum nonlinearity of 2%. The measurements for all the prototype sensor designs were very close to the predicted values with the highest discrepancy being 22%. The results of this research show that mechanical amplification is a very promising concept that can offer increased sensitivity in inertial sensors without increasing the noise. Experimental results show that there is plenty of room for improvement and that viable solutions may be produced by using the presented approach. The applications of this scheme are not restricted only to inertial sensors but as the results show it can be used in a broader range of micromachined devices

    Degree-per-hour mode-matched micromachined silicon vibratory gyroscopes

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    The objective of this research dissertation is to design and implement two novel micromachined silicon vibratory gyroscopes, which attempt to incorporate all the necessary attributes of sub-deg/hr noise performance requirements in a single framework: large resonant mass, high drive-mode oscillation amplitudes, large device capacitance (coupled with optimized electronics), and high-Q resonant mode-matched operation. Mode-matching leverages the high-Q (mechanical gain) of the operating modes of the gyroscope and offers significant improvements in mechanical and electronic noise floor, sensitivity, and bias stability. The first micromachined silicon vibratory gyroscope presented in this work is the resonating star gyroscope (RSG): a novel Class-II shell-type structure which utilizes degenerate flexural modes. After an iterative cycle of design optimization, an RSG prototype was implemented using a multiple-shell approach on (111) SOI substrate. Experimental data indicates sub-5 deg/hr Allan deviation bias instability operating under a mode-matched operating Q of 30,000 at 23ºC (in vacuum). The second micromachined silicon vibratory gyroscope presented in this work is the mode-matched tuning fork gyroscope (M2-TFG): a novel Class-I tuning fork structure which utilizes in-plane non-degenerate resonant flexural modes. Operated under vacuum, the M2-TFG represents the first reported high-Q perfectly mode-matched operation in Class-I vibratory microgyroscope. Experimental results of device implemented on (100) SOI substrate demonstrates sub-deg/hr Allan deviation bias instability operating under a mode-matched operating Q of 50,000 at 23ºC. In an effort to increase capacitive aspect ratio, a new fabrication technology was developed that involved the selective deposition of doped-polysilicon inside the capacitive sensing gaps (SPD Process). By preserving the structural composition integrity of the flexural springs, it is possible to accurately predict the operating-mode frequencies while maintaining high-Q operation. Preliminary characterization of vacuum-packaged prototypes was performed. Initial results demonstrated high-Q mode-matched operation, excellent thermal stability, and sub-deg/hr Allan variance bias instability.Ph.D.Committee Chair: Dr. Farrokh Ayazi; Committee Member: Dr. Mark G. Allen; Committee Member: Dr. Oliver Brand; Committee Member: Dr. Paul A. Kohl; Committee Member: Dr. Thomas E. Michael

    MEMS Accelerometers

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    Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc

    Sensing Movement: Microsensors for Body Motion Measurement

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    Recognition of body posture and motion is an important physiological function that can keep the body in balance. Man-made motion sensors have also been widely applied for a broad array of biomedical applications including diagnosis of balance disorders and evaluation of energy expenditure. This paper reviews the state-of-the-art sensing components utilized for body motion measurement. The anatomy and working principles of a natural body motion sensor, the human vestibular system, are first described. Various man-made inertial sensors are then elaborated based on their distinctive sensing mechanisms. In particular, both the conventional solid-state motion sensors and the emerging non solid-state motion sensors are depicted. With their lower cost and increased intelligence, man-made motion sensors are expected to play an increasingly important role in biomedical systems for basic research as well as clinical diagnostics

    CMOS systems and circuits for sub-degree per hour MEMS gyroscopes

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    The objective of our research is to develop system architectures and CMOS circuits that interface with high-Q silicon microgyroscopes to implement navigation-grade angular rate sensors. The MEMS sensor used in this work is an in-plane bulk-micromachined mode-matched tuning fork gyroscope (M² – TFG ), fabricated on silicon-on-insulator substrate. The use of CMOS transimpedance amplifiers (TIA) as front-ends in high-Q MEMS resonant sensors is explored. A T-network TIA is proposed as the front-end for resonant capacitive detection. The T-TIA provides on-chip transimpedance gains of 25MΩ, has a measured capacitive resolution of 0.02aF /√Hz at 15kHz, a dynamic range of 104dB in a bandwidth of 10Hz and consumes 400μW of power. A second contribution is the development of an automated scheme to adaptively bias the mechanical structure, such that the sensor is operated in the mode-matched condition. Mode-matching leverages the inherently high quality factors of the microgyroscope, resulting in significant improvement in the Brownian noise floor, electronic noise, sensitivity and bias drift of the microsensor. We developed a novel architecture that utilizes the often ignored residual quadrature error in a gyroscope to achieve and maintain perfect mode-matching (i.e.0Hz split between the drive and sense mode frequencies), as well as electronically control the sensor bandwidth. A CMOS implementation is developed that allows mode-matching of the drive and sense frequencies of a gyroscope at a fraction of the time taken by current state of-the-art techniques. Further, this mode-matching technique allows for maintaining a controlled separation between the drive and sense resonant frequencies, providing a means of increasing sensor bandwidth and dynamic range. The mode-matching CMOS IC, implemented in a 0.5μm 2P3M process, and control algorithm have been interfaced with a 60μm thick M2−TFG to implement an angular rate sensor with bias drift as low as 0.1°/hr ℃ the lowest recorded to date for a silicon MEMS gyro.Ph.D.Committee Chair: Farrokh Ayazi; Committee Member: Jennifer Michaels; Committee Member: Levent Degertekin; Committee Member: Paul Hasler; Committee Member: W. Marshall Leac

    Development of a wireless MEMS inertial system for health monitoring of structures

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    Health monitoring of structures by experimental modal analysis is typically performed with piezoelectric based transducers. These transducers are usually heavy, large in size, and require high power to operate, all of which reduce their versatility and applicability to small components and structures. The advanced developments of microfabrication and microelectromechanical systems (MEMS) have lead to progressive designs of small footprint, low dynamic mass and actuation power, and high-resolution inertial sensors. Because of their small dimensions and masses, MEMS inertial sensors could potentially replace the piezoelectric transducers for experimental modal analysis of small components and structures. To transfer data from MEMS inertial sensors to signal analyzers, traditional wiring methods may be utilized. Such methods provide reliable data transfer and are simple to integrate. However, in order to study complex structures, multiple inertial sensors, attached to different locations on a structure, are required. In such cases, using wires increases complexity and eliminates possibility of achieving long distance monitoring. Therefore, there is a need to implement wireless communications capabilities to MEMS sensors. In this thesis, two different wireless communication systems have been developed to achieve wireless health monitoring of structures using MEMS inertial sensors. One of the systems is designed to transmit analog signals, while the other transmits digital signals. The analog wireless system is characterized by a linear frequency response function in the range of 400 Hz to 16 kHz, which covers the frequency bandwidth of the MEMS inertial sensors. This system is used to perform modal analysis of a test structure by applying multiple sensors to the structure. To verify the results obtained with MEMS inertial sensors, noninvasive, laser optoelectronic holography (OEH) methodology is utilized to determine modal characteristics of the structure. The structure is also modeled with analytical and computational methods for correlation of and verification with the experimental measurements. Results indicate that attachment of MEMS inertial sensors, in spite of their small mass, has measurable effects on the modal characteristics of the structure being considered, verifying their applicability in health monitoring of structures. The digital wireless system is used to perform high resolution tilt and rotation measurements of an object subjected to angular and linear accelerations. Since the system has been developed based on a microcontroller, programs have been developed to interface the output signals of the sensors to the microcontroller and RF components. The system is calibrated using the actual driving electronics of the MEMS sensors, and it has achieved an angular resolution of 1.8 mrad. The results show viability of the wireless MEMS inertial sensors in applications requiring accurate tilt and rotation measurements. Additional results presented included application of a MEMS gyroscope and microcontroller to perform angular rate measurements. Since the MEMS gyroscope only generates analog output signals, an analog to digital conversion circuit was developed. Also, a program has been developed to perform analog to digital conversion with two decimal places of accuracy. The experimental results demonstrate feasibility of using the microcontroller and the gyroscope to perform wireless angular rate measurements

    Development and experimental analysis of a micromachined Resonant Gyrocope

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    This thesis is concerned with the development and experimental analysis of a resonant gyroscope. Initially, this involved the development of a fabrication process suitable for the construction of metallic microstructures, employing a combination of nickel electroforming and sacrificial layer techniques to realise free-standing and self-supporting mechanical elements. This was undertaken and achieved. Simple beam elements of typically 2.7mm x 1mm x 40µm dimensions have been constructed and subject to analysis using laser doppler interferometry. This analysis tool was used to implement a fill modal analysis in order to experimentally derive dynamic parameters. The characteristic resonance frequencies of these cantilevers have been measured, with 3.14kHz, 23.79kHz, 37.94kHz and 71.22kHz being the typical frequencies of the first four resonant modes. Q-factors of 912, 532, 1490 and 752 have been measured for these modes respectively at 0.01mbar ambient pressure. Additionally the mode shapes of each resonance was derived experimentally and found to be in excellent agreement with finite element predictions. A 4mm nickel ring gyroscope structure has been constructed and analysed using both optical analysis tools and electrical techniques. Using laser doppler interferometry the first four out-of-plane modes of the ring structure were found to be typically 9.893 kHz, 11.349 kHz, 11.418 kHz and 13.904 kHz with respective Q-factors of 1151, 1659, 1573 and 1407 at 0.01 mbar ambient pressure. Although electrical measurements were found to be obscured through cross coupling between drive and detection circuitry, the in-plane operational modes of the gyroscope were sucessfully determined. The Cos2Ө and Sin2Ө operational modes were measured at 36.141 kHz and 36.346 kHz, highlighting a frequency split of 205kHz. Again all experimentally derived modal parameters were in good agreement with finite element predictions. Furthermore, using the analysis model, the angular resolution of the gyroscope has been predicted to be approximately 4.75º/s
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