Submicron Systems Architecture Project : Semiannual Technical Report

The Mosaic C is an experimental fine-grain multicomputer based on single-chip nodes. The Mosaic C chip includes 64KB of fast dynamic RAM, processor, packet interface, ROM for bootstrap and self-test, and a two-dimensional selftimed router. The chip architecture provides low-overhead and low-latency handling of message packets, and high memory and network bandwidth. Sixty-four Mosaic chips are packaged by tape-automated bonding (TAB) in an 8 x 8 array on circuit boards that can, in turn, be arrayed in two dimensions to build arbitrarily large machines. These 8 x 8 boards are now in prototype production under a subcontract with Hewlett-Packard. We are planning to construct a 16K-node Mosaic C system from 256 of these boards. The suite of Mosaic C hardware also includes host-interface boards and high-speed communication cables. The hardware developments and activities of the past eight months are described in section 2.1. The programming system that we are developing for the Mosaic C is based on the same message-passing, reactive-process, computational model that we have used with earlier multicomputers, but the model is implemented for the Mosaic in a way that supports finegrain concurrency. A process executes only in response to receiving a message, and may in execution send messages, create new processes, and modify its persistent variables before it either exits or becomes dormant in preparation for receiving another message. These computations are expressed in an object-oriented programming notation, a derivative of C++ called C+-. The computational model and the C+- programming notation are described in section 2.2. The Mosaic C runtime system, which is written in C+-, provides automatic process placement and highly distributed management of system resources. The Mosaic C runtime system is described in section 2.3

DeSyRe: on-Demand System Reliability

The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints