From FPGA to ASIC: A RISC-V processor experience

This work document a correct design flow using these tools in the Lagarto RISC- V Processor and the RTL design considerations that must be taken into account, to move from a design for FPGA to design for ASIC

A 249-Mpixel/s HEVC Video-Decoder Chip for 4K Ultra-HD Applications

High Efficiency Video Coding, the latest video standard, uses larger and variable-sized coding units and longer interpolation filters than [H.264 over AVC] to better exploit redundancy in video signals. These algorithmic techniques enable a 50% decrease in bitrate at the cost of computational complexity, external memory bandwidth, and, for ASIC implementations, on-chip SRAM of the video codec. This paper describes architectural optimizations for an HEVC video decoder chip. The chip uses a two-stage subpipelining scheme to reduce on-chip SRAM by 56 kbytes-a 32% reduction. A high-throughput read-only cache combined with DRAM-latency-aware memory mapping reduces DRAM bandwidth by 67%. The chip is built for HEVC Working Draft 4 Low Complexity configuration and occupies 1.77 mm[superscript 2] in 40-nm CMOS. It performs 4K Ultra HD 30-fps video decoding at 200 MHz while consuming 1.19 [nJ over pixel] of normalized system power.Texas Instruments Incorporate

A novel architecture for large windows processors

Several processor architectures with large instruction windows have been proposed. They improve performance by maintaining hundreds of instructions in flight to increase the level of instruction parallelism (ILP). Such architectures replace a re-order buffer (ROB) with a check-pointing mechanism and an out-of-order release of the processor resources. Check-pointing, however, leads to an imprecise state recovery on mispredicted branches and exceptions and frequent re-execution of current-path instructions during the state recovery. It also requires large register files complicating renaming, allocation and release of physical registers. This technical report proposes a new processor architecture that does not use either a traditional ROB or check-pointing, avoids the above-mentioned problems, and has a fast, distributed state recovery mechanism. Its novel register management architecture allows implementation of large register files with simpler and more scalable, register renaming and commit. It is also key to the precise recovery mechanism.Postprint (published version

Light NUCA: a proposal for bridging the inter-cache latency gap

To deal with the “memory wall” problem, microprocessors include large secondary on-chip caches. But as these caches enlarge, they originate a new latency gap between them and fast L1 caches (inter-cache latency gap). Recently, Non-Uniform Cache Architectures (NUCAs) have been proposed to sustain the size growth trend of secondary caches that is threatened by wire-delay problems. NUCAs are size-oriented, and they were not conceived to close the inter-cache latency gap. To tackle this problem, we propose Light NUCAs (L-NUCAs) leveraging on-chip wire density to interconnect small tiles through specialized networks, which convey packets with distributed and dynamic routing. Our design reduces the tile delay (cache access plus one-hop routing) to a single processor cycle and places cache lines at a finer-granularity than conventional caches reducing cache latency. Our evaluations show that in general, L-NUCA improves simultaneously performance, energy, and area when integrated into both conventional or D-NUCA hierarchies.Postprint (author’s final draft

High Peformance and Low Power On-Die Interconnect Fabrics.

Increasing power density with technology scaling has caused stagnation in operating frequency of modern day microprocessors. This has led designers to prefer multicore architectures over complex monolithic processors to keep up with the demand for rising computing throughput. Although processing units are getting smaller and simpler, the dramatic rise of their count on a single die has made the fabric that connects these processing units increasingly complex. These interconnect fabrics have become a bottleneck in improving overall system effciency. As a result, the design paradigm for multi-core chips is gradually shifting from a core-centric architecture towards an interconnect-centric architecture, where system efficiency is limited by the fabric rather than the processing ability of any individual core. This dissertation introduces three novel and synergistic circuit techniques to improve scalability of switch fabrics to make on-die integration of hundreds to thousands of cores feasible. 1) A matrix topology is proposed for designing a fully connected switch fabric that re-uses output buses for programming, and stores shue congurations at cross points. This significantly reduces routing congestion, lowers area/power, and improves per- formance. Silicon measurements demonstrate 47% energy savings in a 64-lane SIMD processor fabricated in 65nm CMOS over a conventional implementation. 2) A novel approach to handle high radix arbitration along with data routing is proposed. It optimally uses existing cross-bar interconnect resources without requiring any additional overhead. Bandwidth exceeding 2Tb/s is recorded in a test prototype fabricated in 65nm. 3) Building on the later, a new circuit topology to manage and update priority adaptively within the switch fabric without incurring additional delay or area is then proposed. Several assist circuit techniques, such as a thyristor based sense amplifier and self regenerating bi-directional repeaters are proposed for high speed energy efficient signaling to and from the switch fabric to improve overall routing efficiency. Using these techniques a 64 x 64 switch fabric with 128b data bus fabricated in 45nm achieves a throughput of 4.5Tb/s at single cycle latency while operating at 559MHz.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91506/1/sudhirks_1.pd

Circuit Techniques for Adaptive and Reliable High Performance Computing.

Increasing power density with process scaling has caused stagnation in the clock speed of modern microprocessors. Accordingly, designers have adopted message passing and shared memory based multicore architectures in order to keep up with the rapidly rising demand for computing throughput. At the same time, applications are not entirely parallel and improving single-thread performance continues to remain critical. Additionally, reliability is also worsening with process scaling, and margining for failures due to process and environmental variations in modern technologies consumes an increasingly large portion of the power/performance envelope. In the wake of multicore computing, reliability of signal synchronization between the cores is also becoming increasingly critical. This forces designers to search for alternate efficient methods to improve compute performance while addressing reliability. Accordingly, this dissertation presents innovative circuit and architectural techniques for variation-tolerance, performance and reliability targeted at datapath logic, signal synchronization and memories. Firstly, a domino logic based design style for datapath logic is presented that uses Adaptive Robustness Tuning (ART) in addition to timing speculation to provide up to 71% performance gains over conventional domino logic in 32bx32b multiplier in 65nm CMOS. Margins are reduced until functionality errors are detected, that are used to guide the tuning. Secondly, for signal synchronization across clock domains, a new class of dynamic logic based synchronizers with single-cycle synchronization latency is presented, where pulses, rather than stable intermediate voltages cause metastability. Such pulses are amplified using skewed inverters to improve mean time between failures by ~1e6x over jamb latches and double flip-flops at 2GHz in 65nm CMOS. Thirdly, a reconfigurable sensing scheme for 6T SRAMs is presented that employs auto-zero calibration and pre-amplification to improve sensing reliability (by up to 1.2 standard deviations of NMOS threshold voltage in 28nm CMOS); this increased reliability is in turn traded for ~42% sensing speedup. Finally, a main memory architecture design methodology to address reliability and power in the context of Exascale computing systems is presented. Based on 3D-stacked DRAMs, the methodology co-optimizes DRAM access energy, refresh power and the increased cost of error resilience, to meet stringent power and reliability constraints.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/107238/1/bharan_1.pd