The Development of Novel Interconnection Technologies for 3D Packaging of Wire Bondless Silicon Carbide Power Modules

This dissertation advances the cause for the 3D packaging and integration of silicon carbide power modules. 3D wire bondless approaches adopted for enhancing the performance of silicon power modules were surveyed, and their merits were assessed to serve as a vision for the future of SiC power packaging. Current efforts pursuing 3D wire bondless SiC power modules were investigated, and the concept for a novel SiC power module was discussed. This highly-integrated SiC power module was assessed for feasibility, with a focus on achieving ultralow parasitic inductances in the critical switching loops. This will enable higher switching frequencies, leading to a reduction in the size of the passive devices in the system and resulting in systems with lower weight and volume. The proposed concept yielded an order-of-magnitude reduction in system parasitics, alongside the possibility of a compact system integration. The technological barriers to realizing these concepts were identified, and solutions for novel interconnection schemes were proposed and evaluated. A novel sintered silver preform was developed to facilitate flip-chip interconnections for a bare-die power device while operating in a high ambient temperature. The preform was demonstrated to have 3.75× more bonding strength than a conventional sintered silver bond and passed rigorous thermal shock tests. A chip-scale and flip-chip capable power device was also developed. The novel package combined the ease of assembly of a discrete device with a performance exceeding a wire bonded module. It occupied a 14× smaller footprint than a discrete device, and offered power loop inductances which were less than a third of a conventional wire bonded module. A detailed manufacturing process flow and qualification is included in this dissertation. These novel devices were implemented in various electrical systems—a discrete Schottky barrier diode package, a half-bridge module with external gate drive, and finally a half-bridge with integrated gate driver in-module. The results of these investigations have been reported and their benefits assessed. The wire bondless modules showed \u3c 5% overshoot under all test conditions. No observable detrimental effects due to dv/dt were observed for any of the modules even under aggressive voltage slew rates of 20-25 V/ns

NASA Tech Briefs, January 1989

Topics include: Electronic Components & and Circuits. Electronic Systems, A Physical Sciences, Materials, Computer Programs, Mechanics, Machinery, Fabrication Technology, Mathematics and Information Sciences, and Life Sciences

Platform Embedded Security Technology Revealed

Computer scienc

Prototype micro-électronique d'un décodeur itératif pour des codes doublement orthogonaux

Ce mémoire porte sur le prototypage microélectronique FPGA d'un décodeur itératif doublement orthogonal issu de récents travaux de recherche. Le nouvel algorithme est simple et présente un certain nombre d'avantages par rapport aux codes turbo très prisés actuellement dans le codage de canal. En effet, ces derniers outre la complexité de leur algorithme de décodage, souffrent d'un problème de latence qui les rend inadaptés pour certaines applications, comme la téléphonie par exemple. Le décodeur utilisé, est un décodeur itératif à quantification souple, basé sur le décodage seuil tel que présenté par Massey et amélioré par l'approximation de la probabilité a posteriori (AAPP). Grâce à cette approche, on arrive à concilier complexité, latence, performance en correction d'erreurs, et haut débit de fonctionnement. Le prototype vise à valider les résultats de simulation, ainsi que l'estimation de la complexité et de la fréquence maximale que l'on peut atteindre sur des FPGA Virtex-II XC2V6000 et ceci pour différentes structures du décodeur

DragonflEYE: a passive approach to aerial collision sensing

"This dissertation describes the design, development and test of a passive wide-field optical aircraft collision sensing instrument titled 'DragonflEYE'. Such a ""sense-and-avoid"" instrument is desired for autonomous unmanned aerial systems operating in civilian airspace. The instrument was configured as a network of smart camera nodes and implemented using commercial, off-the-shelf components. An end-to-end imaging train model was developed and important figures of merit were derived. Transfer functions arising from intermediate mediums were discussed and their impact assessed. Multiple prototypes were developed. The expected performance of the instrument was iteratively evaluated on the prototypes, beginning with modeling activities followed by laboratory tests, ground tests and flight tests. A prototype was mounted on a Bell 205 helicopter for flight tests, with a Bell 206 helicopter acting as the target. Raw imagery was recorded alongside ancillary aircraft data, and stored for the offline assessment of performance. The ""range at first detection"" (R0), is presented as a robust measure of sensor performance, based on a suitably defined signal-to-noise ratio. The analysis treats target radiance fluctuations, ground clutter, atmospheric effects, platform motion and random noise elements. Under the measurement conditions, R0 exceeded flight crew acquisition ranges. Secondary figures of merit are also discussed, including time to impact, target size and growth, and the impact of resolution on detection range. The hardware was structured to facilitate a real-time hierarchical image-processing pipeline, with selected image processing techniques introduced. In particular, the height of an observed event above the horizon compensates for angular motion of the helicopter platform.

Large space structures and systems in the space station era: A bibliography with indexes (supplement 05)

Bibliographies and abstracts are listed for 1363 reports, articles, and other documents introduced into the NASA scientific and technical information system between January 1, 1991 and July 31, 1992. Topics covered include technology development and mission design according to system, interactive analysis and design, structural and thermal analysis and design, structural concepts and control systems, electronics, advanced materials, assembly concepts, propulsion and solar power satellite systems

Annals of Scientific Society for Assembly, Handling and Industrial Robotics

This Open Access proceedings present a good overview of the current research landscape of industrial robots. The objective of MHI Colloquium is a successful networking at academic and management level. Thereby the colloquium is focussing on a high level academic exchange to distribute the obtained research results, determine synergetic effects and trends, connect the actors personally and in conclusion strengthen the research field as well as the MHI community. Additionally there is the possibility to become acquainted with the organizing institute. Primary audience are members of the scientific association for assembly, handling and industrial robots (WG MHI)

Suspension Near-Field Electrospinning: a Nanofabrication Method of Polymer Nanoarray Architectures for Tissue Engineering

Chapter 1. This chapter is divided into six sections. The first will discuss the issue of nerve tissue loss, and the strategies of therapy (1.1). The second describes the role of nanofabrication in tissue engineering (1.2). The third section details the theoretical background of electrospinning in terms of solution and process parameters (1.3). The fourth section introduces near-field electrospinning (NFES), recent advances in this field and the principles of NFES techniques (1.4). The fifth section details objectives for a tissue engineered construct for neural cell therapy, and presents possible viable solutions (1.5). The sixth summarizes the aims and structure of this thesis (1.6)..