3,250 research outputs found
CAD of Stacked Patch Antennas Through Multipurpose Admittance Matrices From FEM and Neural Networks
In this work, a novel computer-aided design methodology for probe-fed, cavity-backed, stacked microstrip patch antennas is proposed. The methodology incorporates the rigor of a numerical technique, such as finite element methods, which, in turn, makes use of a newly developed procedure (multipurpose admittance matrices) to carry out a full-wave analysis in a given structure in spite of certain physical shapes and dimensions not yet being established. With the aid of this technique, we form a training set for a neural network, whose output is the desired response of the antenna according to the value of design parameters. Last, taking advantage of this neural network, we perform a global optimization through a genetic algorithm or simulated annealing to obtain a final design. The proposed methodology is validated through a real design whose numerical results are compared with measurements with good agreement
The Quantum Socket: Three-Dimensional Wiring for Extensible Quantum Computing
Quantum computing architectures are on the verge of scalability, a key
requirement for the implementation of a universal quantum computer. The next
stage in this quest is the realization of quantum error correction codes, which
will mitigate the impact of faulty quantum information on a quantum computer.
Architectures with ten or more quantum bits (qubits) have been realized using
trapped ions and superconducting circuits. While these implementations are
potentially scalable, true scalability will require systems engineering to
combine quantum and classical hardware. One technology demanding imminent
efforts is the realization of a suitable wiring method for the control and
measurement of a large number of qubits. In this work, we introduce an
interconnect solution for solid-state qubits: The quantum socket. The quantum
socket fully exploits the third dimension to connect classical electronics to
qubits with higher density and better performance than two-dimensional methods
based on wire bonding. The quantum socket is based on spring-mounted micro
wires the three-dimensional wires that push directly on a micro-fabricated
chip, making electrical contact. A small wire cross section (~1 mmm), nearly
non-magnetic components, and functionality at low temperatures make the quantum
socket ideal to operate solid-state qubits. The wires have a coaxial geometry
and operate over a frequency range from DC to 8 GHz, with a contact resistance
of ~150 mohm, an impedance mismatch of ~10 ohm, and minimal crosstalk. As a
proof of principle, we fabricated and used a quantum socket to measure
superconducting resonators at a temperature of ~10 mK.Comment: Main: 31 pages, 19 figs., 8 tables, 8 apps.; suppl.: 4 pages, 5 figs.
(HiRes figs. and movies on request). Submitte
Modeling for the Computer-Aided Design of Long Interconnects
L'abstract Ăš presente nell'allegato / the abstract is in the attachmen
- âŠ