Design for pre-bond testability in 3D integrated circuits

In this dissertation we propose several DFT techniques specific to 3D stacked IC systems. The goal has explicitly been to create techniques that integrate easily with existing IC test systems. Specifically, this means utilizing scan- and wrapper-based techniques, two foundations of the digital IC test industry. First, we describe a general test architecture for 3D ICs. In this architecture, each tier of a 3D design is wrapped in test control logic that both manages tier test pre-bond and integrates the tier into the large test architecture post-bond. We describe a new kind of boundary scan to provide the necessary test control and observation of the partial circuits, and we propose a new design methodology for test hardcore that ensures both pre-bond functionality and post-bond optimality. We present the application of these techniques to the 3D-MAPS test vehicle, which has proven their effectiveness. Second, we extend these DFT techniques to circuit-partitioned designs. We find that boundary scan design is generally sufficient, but that some 3D designs require special DFT treatment. Most importantly, we demonstrate that the functional partitioning inherent in 3D design can potentially decrease the total test cost of verifying a circuit. Third, we present a new CAD algorithm for designing 3D test wrappers. This algorithm co-designs the pre-bond and post-bond wrappers to simultaneously minimize test time and routing cost. On average, our algorithm utilizes over 90% of the wires in both the pre-bond and post-bond wrappers. Finally, we look at the 3D vias themselves to develop a low-cost, high-volume pre-bond test methodology appropriate for production-level test. We describe the shorting probes methodology, wherein large test probes are used to contact multiple small 3D vias. This technique is an all-digital test method that integrates seamlessly into existing test flows. Our experimental results demonstrate two key facts: neither the large capacitance of the probe tips nor the process variation in the 3D vias and the probe tips significantly hinders the testability of the circuits. Taken together, this body of work defines a complete test methodology for testing 3D ICs pre-bond, eliminating one of the key hurdles to the commercialization of 3D technology.PhDCommittee Chair: Lee, Hsien-Hsin; Committee Member: Bakir, Muhannad; Committee Member: Lim, Sung Kyu; Committee Member: Vuduc, Richard; Committee Member: Yalamanchili, Sudhaka

Elastic bundles :modelling and architecting asynchronous circuits with granular rigidity

PhD ThesisIntegrated Circuit (IC) designs these days are predominantly System-on-Chips (SoCs). The complexity of designing a SoC has increased rapidly over the years due to growing process and environmental variations coupled with global clock distribution di culty. Moreover, traditional synchronous design is not apt to handle the heterogeneous timing nature of modern SoCs. As a countermeasure, the semiconductor industry witnessed a strong revival of asynchronous design principles. A new paradigm of digital circuits emerged, as a result, namely mixed synchronous-asynchronous circuits. With a wave of recent innovations in synchronous-asynchronous CAD integration, this paradigm is showing signs of commercial adoption in future SoCs mainly due to the scope for reuse of synchronous functional blocks and IP cores, and the co-existence of synchronous and asynchronous design styles in a common EDA framework. However, there is a lack of formal methods and tools to facilitate mixed synchronousasynchronous design. In this thesis, we propose a formal model based on Petri nets with step semantics to describe these circuits behaviourally. Implication of this model in the veri cation and synthesis of mixed synchronous-asynchronous circuits is studied. Till date, this paradigm has been mainly explored on the basis of Globally Asynchronous Locally Synchronous (GALS) systems. Despite decades of research, GALS design has failed to gain traction commercially. To understand its drawbacks, a simulation framework characterising the physical and functional aspects of GALS SoCs is presented. A novel method for synthesising mixed synchronous-asynchronous circuits with varying levels of rigidity is proposed. Starting with a high-level data ow model of a system which is intrinsically asynchronous, the key idea is to introduce rigidity of chosen granularity levels in the model without changing functional behaviour. The system is then partitioned into functional blocks of synchronous and asynchronous elements before being transformed into an equivalent circuit which can be synthesised using standard EDA tools

Dependable Embedded Systems

This Open Access book introduces readers to many new techniques for enhancing and optimizing reliability in embedded systems, which have emerged particularly within the last five years. This book introduces the most prominent reliability concerns from today’s points of view and roughly recapitulates the progress in the community so far. Unlike other books that focus on a single abstraction level such circuit level or system level alone, the focus of this book is to deal with the different reliability challenges across different levels starting from the physical level all the way to the system level (cross-layer approaches). The book aims at demonstrating how new hardware/software co-design solution can be proposed to ef-fectively mitigate reliability degradation such as transistor aging, processor variation, temperature effects, soft errors, etc. Provides readers with latest insights into novel, cross-layer methods and models with respect to dependability of embedded systems; Describes cross-layer approaches that can leverage reliability through techniques that are pro-actively designed with respect to techniques at other layers; Explains run-time adaptation and concepts/means of self-organization, in order to achieve error resiliency in complex, future many core systems

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Cross-Layer Approaches for an Aging-Aware Design of Nanoscale Microprocessors

Thanks to aggressive scaling of transistor dimensions, computers have revolutionized our life. However, the increasing unreliability of devices fabricated in nanoscale technologies emerged as a major threat for the future success of computers. In particular, accelerated transistor aging is of great importance, as it reduces the lifetime of digital systems. This thesis addresses this challenge by proposing new methods to model, analyze and mitigate aging at microarchitecture-level and above

Performance and power optimizations in chip multiprocessors for throughput-aware computation

The so-called "power (or power density) wall" has caused core frequency (and single-thread performance) to slow down, giving rise to the era of multi-core/multi-thread processors. For example, the IBM POWER4 processor, released in 2001, incorporated two single-thread cores into the same chip. In 2010, IBM released the POWER7 processor with eight 4-thread cores in the same chip, for a total capacity of 32 execution contexts. The ever increasing number of cores and threads gives rise to new opportunities and challenges for software and hardware architects. At software level, applications can benefit from the abundant number of execution contexts to boost throughput. But this challenges programmers to create highly-parallel applications and operating systems capable of scheduling them correctly. At hardware level, the increasing core and thread count puts pressure on the memory interface, because memory bandwidth grows at a slower pace ---phenomenon known as the "bandwidth (or memory) wall". In addition to memory bandwidth issues, chip power consumption rises due to manufacturers' difficulty to lower operating voltages sufficiently every processor generation. This thesis presents innovations to improve bandwidth and power consumption in chip multiprocessors (CMPs) for throughput-aware computation: a bandwidth-optimized last-level cache (LLC), a bandwidth-optimized vector register file, and a power/performance-aware thread placement heuristic. In contrast to state-of-the-art LLC designs, our organization avoids data replication and, hence, does not require keeping data coherent. Instead, the address space is statically distributed all over the LLC (in a fine-grained interleaving fashion). The absence of data replication increases the cache effective capacity, which results in better hit rates and higher bandwidth compared to a coherent LLC. We use double buffering to hide the extra access latency due to the lack of data replication. The proposed vector register file is composed of thousands of registers and organized as an aggregation of banks. We leverage such organization to attach small special-function "local computation elements" (LCEs) to each bank. This approach ---referred to as the "processor-in-regfile" (PIR) strategy--- overcomes the limited number of register file ports. Because each LCE is a SIMD computation element and all of them can proceed concurrently, the PIR strategy constitutes a highly-parallel super-wide-SIMD device (ideal for throughput-aware computation). Finally, we present a heuristic to reduce chip power consumption by dynamically placing software (application) threads across hardware (physical) threads. The heuristic gathers chip-level power and performance information at runtime to infer characteristics of the applications being executed. For example, if an application's threads share data, the heuristic may decide to place them in fewer cores to favor inter-thread data sharing and communication. In such case, the number of active cores decreases, which is a good opportunity to switch off the unused cores to save power. It is increasingly harder to find bulletproof (micro-)architectural solutions for the bandwidth and power scalability limitations in CMPs. Consequently, we think that architects should attack those problems from different flanks simultaneously, with complementary innovations. This thesis contributes with a battery of solutions to alleviate those problems in the context of throughput-aware computation: 1) proposing a bandwidth-optimized LLC; 2) proposing a bandwidth-optimized register file organization; and 3) proposing a simple technique to improve power-performance efficiency.El excesivo consumo de potencia de los procesadores actuales ha desacelerado el incremento en la frecuencia operativa de los mismos para dar lugar a la era de los procesadores con múltiples núcleos y múltiples hilos de ejecución. Por ejemplo, el procesador POWER7 de IBM, lanzado al mercado en 2010, incorpora ocho núcleos en el mismo chip, con cuatro hilos de ejecución por núcleo. Esto da lugar a nuevas oportunidades y desafíos para los arquitectos de software y hardware. A nivel de software, las aplicaciones pueden beneficiarse del abundante número de núcleos e hilos de ejecución para aumentar el rendimiento. Pero esto obliga a los programadores a crear aplicaciones altamente paralelas y sistemas operativos capaces de planificar correctamente la ejecución de las mismas. A nivel de hardware, el creciente número de núcleos e hilos de ejecución ejerce presión sobre la interfaz de memoria, ya que el ancho de banda de memoria crece a un ritmo más lento. Además de los problemas de ancho de banda de memoria, el consumo de energía del chip se eleva debido a la dificultad de los fabricantes para reducir suficientemente los voltajes de operación entre generaciones de procesadores. Esta tesis presenta innovaciones para mejorar el ancho de banda y consumo de energía en procesadores multinúcleo en el ámbito de la computación orientada a rendimiento ("throughput-aware computation"): una memoria caché de último nivel ("last-level cache" o LLC) optimizada para ancho de banda, un banco de registros vectorial optimizado para ancho de banda, y una heurística para planificar la ejecución de aplicaciones paralelas orientada a mejorar la eficiencia del consumo de potencia y desempeño. En contraste con los diseños de LLC de última generación, nuestra organización evita la duplicación de datos y, por tanto, no requiere de técnicas de coherencia. El espacio de direcciones de memoria se distribuye estáticamente en la LLC con un entrelazado de grano fino. La ausencia de replicación de datos aumenta la capacidad efectiva de la memoria caché, lo que se traduce en mejores tasas de acierto y mayor ancho de banda en comparación con una LLC coherente. Utilizamos la técnica de "doble buffering" para ocultar la latencia adicional necesaria para acceder a datos remotos. El banco de registros vectorial propuesto se compone de miles de registros y se organiza como una agregación de bancos. Incorporamos a cada banco una pequeña unidad de cómputo de propósito especial ("local computation element" o LCE). Este enfoque ---que llamamos "computación en banco de registros"--- permite superar el número limitado de puertos en el banco de registros. Debido a que cada LCE es una unidad de cómputo con soporte SIMD ("single instruction, multiple data") y todas ellas pueden proceder de forma concurrente, la estrategia de "computación en banco de registros" constituye un dispositivo SIMD altamente paralelo. Por último, presentamos una heurística para planificar la ejecución de aplicaciones paralelas orientada a reducir el consumo de energía del chip, colocando dinámicamente los hilos de ejecución a nivel de software entre los hilos de ejecución a nivel de hardware. La heurística obtiene, en tiempo de ejecución, información de consumo de potencia y desempeño del chip para inferir las características de las aplicaciones. Por ejemplo, si los hilos de ejecución a nivel de software comparten datos significativamente, la heurística puede decidir colocarlos en un menor número de núcleos para favorecer el intercambio de datos entre ellos. En tal caso, los núcleos no utilizados se pueden apagar para ahorrar energía. Cada vez es más difícil encontrar soluciones de arquitectura "a prueba de balas" para resolver las limitaciones de escalabilidad de los procesadores actuales. En consecuencia, creemos que los arquitectos deben atacar dichos problemas desde diferentes flancos simultáneamente, con innovaciones complementarias

Sincronização em sistemas integrados a alta velocidade

Doutoramento em Engenharia ElectrotécnicaA distribui ção de um sinal relógio, com elevada precisão espacial (baixo skew) e temporal (baixo jitter ), em sistemas sí ncronos de alta velocidade tem-se revelado uma tarefa cada vez mais demorada e complexa devido ao escalonamento da tecnologia. Com a diminuição das dimensões dos dispositivos e a integração crescente de mais funcionalidades nos Circuitos Integrados (CIs), a precisão associada as transições do sinal de relógio tem sido cada vez mais afectada por varia ções de processo, tensão e temperatura. Esta tese aborda o problema da incerteza de rel ogio em CIs de alta velocidade, com o objetivo de determinar os limites do paradigma de desenho sí ncrono. Na prossecu ção deste objectivo principal, esta tese propõe quatro novos modelos de incerteza com âmbitos de aplicação diferentes. O primeiro modelo permite estimar a incerteza introduzida por um inversor est atico CMOS, com base em parâmetros simples e su cientemente gen éricos para que possa ser usado na previsão das limitações temporais de circuitos mais complexos, mesmo na fase inicial do projeto. O segundo modelo, permite estimar a incerteza em repetidores com liga ções RC e assim otimizar o dimensionamento da rede de distribui ção de relógio, com baixo esfor ço computacional. O terceiro modelo permite estimar a acumula ção de incerteza em cascatas de repetidores. Uma vez que este modelo tem em considera ção a correla ção entre fontes de ruí do, e especialmente util para promover t ecnicas de distribui ção de rel ogio e de alimentação que possam minimizar a acumulação de incerteza. O quarto modelo permite estimar a incerteza temporal em sistemas com m ultiplos dom ínios de sincronismo. Este modelo pode ser facilmente incorporado numa ferramenta autom atica para determinar a melhor topologia para uma determinada aplicação ou para avaliar a tolerância do sistema ao ru ído de alimentação. Finalmente, usando os modelos propostos, são discutidas as tendências da precisão de rel ogio. Conclui-se que os limites da precisão do rel ogio são, em ultima an alise, impostos por fontes de varia ção dinâmica que se preveem crescentes na actual l ogica de escalonamento dos dispositivos. Assim sendo, esta tese defende a procura de solu ções em outros ní veis de abstração, que não apenas o ní vel f sico, que possam contribuir para o aumento de desempenho dos CIs e que tenham um menor impacto nos pressupostos do paradigma de desenho sí ncrono.Distributing a the clock simultaneously everywhere (low skew) and periodically everywhere (low jitter) in high-performance Integrated Circuits (ICs) has become an increasingly di cult and time-consuming task, due to technology scaling. As transistor dimensions shrink and more functionality is packed into an IC, clock precision becomes increasingly a ected by Process, Voltage and Temperature (PVT) variations. This thesis addresses the problem of clock uncertainty in high-performance ICs, in order to determine the limits of the synchronous design paradigm. In pursuit of this main goal, this thesis proposes four new uncertainty models, with di erent underlying principles and scopes. The rst model targets uncertainty in static CMOS inverters. The main advantage of this model is that it depends only on parameters that can easily be obtained. Thus, it can provide information on upcoming constraints very early in the design stage. The second model addresses uncertainty in repeaters with RC interconnects, allowing the designer to optimise the repeater's size and spacing, for a given uncertainty budget, with low computational e ort. The third model, can be used to predict jitter accumulation in cascaded repeaters, like clock trees or delay lines. Because it takes into consideration correlations among variability sources, it can also be useful to promote oorplan-based power and clock distribution design in order to minimise jitter accumulation. A fourth model is proposed to analyse uncertainty in systems with multiple synchronous domains. It can be easily incorporated in an automatic tool to determine the best topology for a given application or to evaluate the system's tolerance to power-supply noise. Finally, using the proposed models, this thesis discusses clock precision trends. Results show that limits in clock precision are ultimately imposed by dynamic uncertainty, which is expected to continue increasing with technology scaling. Therefore, it advocates the search for solutions at other abstraction levels, and not only at the physical level, that may increase system performance with a smaller impact on the assumptions behind the synchronous design paradigm

Energy-Efficient and Reliable Computing in Dark Silicon Era

Dark silicon denotes the phenomenon that, due to thermal and power constraints, the fraction of transistors that can operate at full frequency is decreasing in each technology generation. Moore’s law and Dennard scaling had been backed and coupled appropriately for five decades to bring commensurate exponential performance via single core and later muti-core design. However, recalculating Dennard scaling for recent small technology sizes shows that current ongoing multi-core growth is demanding exponential thermal design power to achieve linear performance increase. This process hits a power wall where raises the amount of dark or dim silicon on future multi/many-core chips more and more. Furthermore, from another perspective, by increasing the number of transistors on the area of a single chip and susceptibility to internal defects alongside aging phenomena, which also is exacerbated by high chip thermal density, monitoring and managing the chip reliability before and after its activation is becoming a necessity. The proposed approaches and experimental investigations in this thesis focus on two main tracks: 1) power awareness and 2) reliability awareness in dark silicon era, where later these two tracks will combine together. In the first track, the main goal is to increase the level of returns in terms of main important features in chip design, such as performance and throughput, while maximum power limit is honored. In fact, we show that by managing the power while having dark silicon, all the traditional benefits that could be achieved by proceeding in Moore’s law can be also achieved in the dark silicon era, however, with a lower amount. Via the track of reliability awareness in dark silicon era, we show that dark silicon can be considered as an opportunity to be exploited for different instances of benefits, namely life-time increase and online testing. We discuss how dark silicon can be exploited to guarantee the system lifetime to be above a certain target value and, furthermore, how dark silicon can be exploited to apply low cost non-intrusive online testing on the cores. After the demonstration of power and reliability awareness while having dark silicon, two approaches will be discussed as the case study where the power and reliability awareness are combined together. The first approach demonstrates how chip reliability can be used as a supplementary metric for power-reliability management. While the second approach provides a trade-off between workload performance and system reliability by simultaneously honoring the given power budget and target reliability

Ocin_tsim - A DVFS Aware Simulator for NoC Design Space Exploration and Optimization

Networks-on-Chip (NoCs) are a general purpose, scalable replacement for shared medium wired interconnects offering many practical applications in industry. Dynamic Voltage Frequency Scaling (DVFS) is a technique whereby a chip?s voltage-frequency levels are varied at run time, often used to conserve dynamic power. Various DVFSbased NoC optimization techniques have been proposed. However, due to the resources required to validate architectural decisions through prototyping, few are implemented. As a result, designers are faced with a lack of insight into potential power savings or performance gains at early architecture stages. This thesis proposes a DVFS aware NoC simulator with support for per node power-frequency modeling to allow fine-tuning of such optimization techniques early on in the design cycle. The proposed simulator also provides a framework for benchmarking various candidate strategies to allow selective prototyping and optimization. As part of the research, DVFS extensions were built for an existing NoC performance simulator and released for public use. This thesis presents some of the preliminary results from our simulator that show the average power consumed per node for all the benchmarks in SPLASH 2 benchmark suite [74] to be quite similar to each other. This thesis also serves as a technical manual for the simulator extensions. Important links for downloading and using the simulator are provided at the end of this document in Appendix C