Circuits and Systems for On-Chip RF Chemical Sensors and RF FDD Duplexers

Integrating RF bio-chemical sensors and RF duplexers helps to reduce cost and area in the current applications. Furthermore, new applications can exist based on the large scale integration of these crucial blocks. This dissertation addresses the integration of RF bio-chemical sensors and RF duplexers by proposing these initiatives. A low power integrated LC-oscillator-based broadband dielectric spectroscopy (BDS) system is presented. The real relative permittivity ε’r is measured as a shift in the oscillator frequency using an on-chip frequency-to-digital converter (FDC). The imaginary relative permittivity ε”r increases the losses of the oscillator tank which mandates a higher dc biasing current to preserve the same oscillation amplitude. An amplitude-locked loop (ALL) is used to fix the amplitude and linearize the relation between the oscillator bias current and ε”r. The proposed BDS system employs a sensing oscillator and a reference oscillator where correlated double sampling (CDS) is used to mitigate the impact of flicker noise, temperature variations and frequency drifts. A prototype is implemented in 0.18 µm CMOS process with total chip area of 6.24 mm^2 to operate in 1-6 GHz range using three dual bands LC oscillators. The achieved standard deviation in the air is 2.1 ppm for frequency reading and 110 ppm for current reading. A tunable integrated electrical balanced duplexer (EBD) is presented as a compact alternative to multiple bulky SAW and BAW duplexers in 3G/4G cellular transceivers. A balancing network creates a replica of the transmitter signal for cancellation at the input of a single-ended low noise amplifier (LNA) to isolate the receive path from the transmitter. The proposed passive EBD is based on a cross-connected transformer topology without the need of any extra balun at the antenna side. The duplexer achieves around 50 dB TX-RX isolation within 1.6-2.2 GHz range up to 22 dBm. The cascaded noise figure of the duplexer and LNA is 6.5 dB, and TX insertion loss (TXIL) of the duplexer is about 3.2 dB. The duplexer and LNA are implemented in 0.18 µm CMOS process and occupy an active area of 0.35 mm^2

Novel RF CMOS Integrated Circuits and Systems for Broadband Dielectric Spectroscopy

Broadband dielectric spectroscopy has proven to be a valuable technique for characterization of chemicals and biomaterials. It has the great potential to become an indispensable and cost-effective tool in point-of-care medical applications due to its label-free and non-invasive operation. However, most of the existing dielectric spectroscopy instruments require bulky, heavy and expensive measurement set-up, restricting their use to only special applications in industry and laboratories. Therefore, integrated dielectric spectroscopy on silicon capable of direct detection of chemicals/biomaterials' complex permittivity can yield significant cost and size reduction, system integration, portability, enormous processing, and high throughput. A CMOS wideband dielectric spectroscopy system is proposed for chemical and biological material characterization. The complex permittivity detection is performed using a configurable harmonic-rejecting receiver capable of indirectly measuring the complex admittance of sensing capacitor exposed to the material-under-test (MUT) and subject to RF signal excitation with a frequency range of 0.62-10 GHz. The sensing capacitor is embedded in a voltage divider topology with a fixed capacitor and the relative variations in the magnitude and phase of the voltages across the capacitors are used to find the real and imaginary parts of the permittivity. The sensor achieves an rms permittivity error of less than 1% over the entire operation bandwidth. Using a sub-harmonic mixing scheme, the system can perform complex permittivity measurements from 0.62 to 10 GHz while requiring an input signal source with frequency range of only from 5 to 10 GHz. Thereby, the permittivity measurement system can be easily made self-sustained by implementing a 5-10 GHz frequency synthesizer on the same chip. One of the key building blocks in such a frequency synthesizer is the voltage-controlled oscillator (VCO) which has to cover an octave of frequency range. A novel low-phase-noise wide-tuning range VCO is presented using a triple-band LC resonator. The implemented VCO in 0.18μm CMOS technology achieves a continuous tuning range of 86.7% from 5.12 GHz to 12.95 GHz while drawing 5 to 10 mA current from 1-V supply. The measured phase noise at 1 MHz offset from carrier frequencies of 5.9, 9.12 and 12.25 GHz is -122.9, -117.1 and -110.5 dBc/Hz, respectively. Also, a dual-band quadrature voltage-controlled oscillator (QVCO) is presented using a transformer-based high-order LC-ring resonator which inherently provides quadrature signals without requiring noisy coupling transistors as in traditional approaches. The proposed resonator shows two possible oscillation frequencies which are exploited to realize a wide-tuning range QVCO employing a mode-switching transistor network. Due to the use of transformers, the oscillator has minimal area penalty compared to the conventional designs. The implemented prototype in a 65-nm CMOS process achieves a continuous tuning range of 77.8% from 2.75 GHz to 6.25 GHz while consuming 9.7 to 15.6 mA current from 0.6-V supply. The measured phase noise figure-of-merit (FoM) at 1 MHz offset ranges from 184 dB to 188.2 dB throughout the entire tuning range. The QVCO also exhibits good quadrature accuracy with 1.5º maximum phase error and occupies a relatively small silicon area of 0.35 mm^2

0.42 THz Transmitter with Dielectric Resonator Array Antenna

Off chip antennas do not occupy the expensive die area, as there is no limitation on their building material, and can be built in any size and shape to match the system requirements, which are all in contrast to on-chip antenna solutions. However, integration of off-chip antennas with Monolithic-Microwave-Integrated Chips (MMIC) and designing a low loss signal transmission from the signal source inside the MMIC to the antenna module is a major challenge and trade off. High resistivity silicon (HRS), is a low cost and extremely low loss material at sub-THz. It has become a prevailing material in fabrication of passive components for THz applications. This work makes use of HRS to build an off-chip Dielectric Resonator Antenna Array Module (DRAAM) to realize a highly efficient transmitter at 420 GHz. This work proposes novel techniques and solutions for design and integration of DRRAM with MMIC as the signal source. A proposed scalable 4×4 antenna structure aligns DRRAM on top of MMIC within 2 μm accuracy through an effortless assembly procedure. DRAAM shows 15.8 dB broadside gain and 0.85 efficiency. DRAs in the DRAAM are differentially excited through aperture coupling. Differential excitation not only inherently provides a mechanism to deliver more power to the antenna, it also removes the additional loss of extra balluns when outputs are differential inside MMIC. In addition, this work proposes a technique to double the radiation power from each DRA. Same radiating mode at 0.42 THz inside every DRA is excited through two separate differential sources. This approach provides an almost loss-less power combining mechanism inside DRA. Two 140_GHz oscillators followed by triplers drive each DRA in the demonstrated 4×4 antenna array. Each oscillator generates 7.2 dBm output power at 140 GHz with -83 dBc/Hz phase noise at 100 KHz and consumes 25 mW of power. An oscillator is followed by a tripler that generates -8 dBm output power at 420 GHz. Oscillator and tripler circuits use a smart layer stack up arrangement for their passive elements where the top metal layer of the die is grounded to comply with the planned integration arrangement. This work shows a novel circuit topology for exciting the antenna element which creates the feed element part of the tuned load for the tripler circuit, therefore eliminates the loss of the transition component, and maximizes the output power delivered to the antenna. The final structure is composed of 32 injection locked oscillators and drives a 4×4 DRAAM achieves 22.8 dBm EIRP

Novel RF/Microwave Circuits And Systems for Lab on-Chip/on-Board Chemical Sensors

Recent research focuses on expanding the use of RF/Microwave circuits and systems to include multi-disciplinary applications. One example is the detection of the dielectric properties of chemicals and bio-chemicals at microwave frequencies, which is useful for pharmaceutical applications, food and drug safety, medical diagnosis and material characterization. Dielectric spectroscopy is also quite relevant to detect the frequency dispersive characteristics of materials over a wide frequency range for more accurate detection. In this dissertation, on-chip and on-board solutions for microwave chemical sensing are proposed. An example of an on-chip dielectric detection technique for chemical sensing is presented. An on-chip sensing capacitor, whose capacitance changes when exposed to material under test (MUT), is a part of an LC voltage-controlled oscillator (VCO). The VCO is embedded inside a frequency synthesizer to convert the change in the free runing frequency frequency of the VCO into a change of its input voltage. The system is implemented using 90 nm CMOS technology and the permittivities of MUTs are evaluated using a unique detection procedure in the 7-9 GHz frequency range with an accuracy of 3.7% in an area of 2.5 × 2.5 mm^2 with a power consumption of 16.5 mW. The system is also used for binary mixture detection with a fractional volume accuracy of 1-2%. An on-board miniaturized dielectric spectroscopy system for permittivity detec- tion is also presented. The sensor is based on the detection of the phase difference be- tween the input and output signals of cascaded broadband True-Time-Delay (TTD) cells. The sensing capacitor exposed to MUTs is a part of the TTD cell. The change of the permittivity results in a change of the phase of the microwave signal passing through the TTD cell. The system is fabricated on Rogers Duroid substrates with a total area of 8 × 7.2 cm2. The permittivities of MUTs are detected in the 1-8 GHz frequency range with a detection accuracy of 2%. Also, the sensor is used to extract the fractional volumes of mixtures with accuracy down to 1%. Additionally, multi-band and multi-standard communication systems motivate the trend to develop broadband front-ends covering all the standards for low cost and reduced chip area. Broadband amplifiers are key building blocks in wideband front-ends. A broadband resistive feedback low-noise amplifier (LNA) is presented using a composite cross-coupled CMOS pair for a higher gain and reduced noise figure. The LNA is implemented using 90 nm CMOS technology consuming 18 mW in an area of 0.06 mm2. The LNA shows a gain of 21 dB in the 2-2300 MHz frequency range, a minimum noise figure of 1.4 dB with an IIP3 of -1.5 dBm. Also, a four-stage distributed amplifier is presented providing bandwidth extension with 1-dB flat gain response up to 16 GHz. The flat extended bandwidth is provided using coupled inductors in the gate line with series peaking inductors in the cascode gain stages. The amplifier is fabricated using 180 nm CMOS technology in an area of 1.19 mm2 achieving a power gain of 10 dB, return losses better than 16 dB, noise figure of 3.6-4.9 dB and IIP3 of 0 dBm with 21 mW power consumption. All the implemented circuits and systems in this dissertation are validated, demonstrated and published in several IEEE Journals and Conferences

SILICON TERAHERTZ ELECTRONICS: CIRCUITS AND SYSTEMS FOR FUTURE APPLICATIONS

The terahertz frequency bands are gaining increasing attention these days for the potential applications in imaging, sensing, spectroscopy, and communication. These applications can be used in a wide range of fields, such as military, security, biomedical analysis, material science, astronomy, etc. Unfortunately, utilizing these frequency bands is very challenging due to the notorious ”terahertz gap”. Consequently, current terahertz systems are very bulky and expensive, sometimes even require cryogenic conditions. Silicon terahertz electronics now becomes very attractive, since it can achieve significantly lower cost and make portable consumer terahertz devices feasible. However, due to the limited device fmax and low breakdown voltage, signal generation and processing on silicon platform in this frequency range is challenging. This thesis aims to tackle these challenges and implement high-performance terahertz systems. First of all, the devices are investigated under the terahertz frequency range and optimum termination conditions for maximizing the efficacy of the devices is derived. Then, novel passive surrounding networks are designed to provide the devices with the optimal termination conditions to push the performances of the terahertz circuit blocks. Finally, the high-performance circuit blocks are used to build terahertz systems, and system-level innovations are also proposed to push the state of the art forward. In Chapter 2, using a device-centric bottom-up design method, a 210-GHz harmonic oscillator is designed. With the parasitic tuning mechanism, a wide frequency tuning range is achieved without using lossy varactors. A passive network based on the return-path gap coupler and self-feeding structure is also designed to provide optimal terminations for the active devices to maximize the harmonic power generation. Fabricated with a 0.13-um SiGe BiCMOS process, the oscillator is highly compact with a core size of only 290x95 um2. The output frequency can be tuned from 197.5 GHz to 219.7 GHz, which is around 10.6% compared to the center frequency. It also achieves a peak output power and dc-to-RF efficiency of 1.4 dBm and 2.4%, respectively. The measured output phase noise at 1 MHz offset is -87.5 dBc/Hz. The high power, wide tuning range, low phase noise, as well as compact size, make this oscillator very suitable for terahertz systems integration. In Chapter 3, the design of a 320-GHz fully-integrated terahertz imaging system is described. The system is composed of a phase-locked high-power transmitter and a coherent high-sensitivity subharmonic-mixing receiver, which are fabricated using a 0.13-um SiGe BiCMOS technology. To enhance the imaging sensitivity, a heterodyne coherent detection scheme is utilized. To obtain frequency coherency, fully-integrated phase-locked loops are implemented on both the transmitter and receiver chips. According to the measurement, consuming a total dc power of 605 mW, the transmitter chip achieves a peak radiated power of 2 mW and a peak EIRP of 21.1 dBm. The receiver chip achieves an equivalent incoherent responsivity of more than 7.26 MV/W and a sensitivity of 70.1 pW under an integration bandwidth of 1 kHz, with a total dc power consumption of 117 mW. The achieved sensitivity with this proposed coherent imaging transceiver is around ten times better compared with other state-of-the-art incoherent imagers. In Chapter 4, a spatial-orthogonal ASK transmitter architecture for high-speed terahertz wireless communication is presented. The self-sustaining oscillator-based transmitter architecture has an ultra-compact size and excellent power efficiency. With the proposed high-speed constant-load switch, significantly reduced modulation loss is achieved. Using polarization diversity and multi-level modulation, the throughput is largely enhanced. Array configuration is also adopted to enhance the link budget for higher signal quality and longer communication range. Fabricated in a 0.13-um SiGe BiCMOS technology, the 220-GHz transmitter prototype achieves an EIRP of 21 dBm and dc-to- THz-radiation efficiency of 0.7% in each spatial channel. A 24.4-Gb/s total data rate over a 10-cm communication range is demonstrated. With an external Teflon lens system, the demonstrated communication range is further extended to 52 cm. Compared with prior art, this prototype demonstrates much higher transmitter efficiency. In Chapter 5, an entirely-on-chip frequency-stabilization feedback mechanism is proposed, which avoids the use of both frequency dividers and off-chip references, achieving much lower system integration cost and power consumption. Using this mechanism, a 301.7-to-331.8-GHz source prototype is designed in a 0.13-um SiGe BiCMOS technology. According to the measurement, the source consumes a dc power of only 51.7 mW. The output phase noise is -71.1 and -75.2 dBc/Hz at 100 kHz and 1 MHz offset, respectively. A -13.9-dBm probed output power is also achieved. Overall, the prototype source demonstrates the largest output frequency range and lowest power consumption while achieving comparable phase noise and output power performances with respect to the state of the art. All the designs demonstrated in this thesis achieve good performances and push the state of the art forward, paving the way for implementation of more sophisticated terahertz circuits and systems for future applications