Interconnect yield analysis and fault tolerance for field programmable gate arrays

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Build Testbenches for Verification in Shift Register ICs using SystemVerilog

A testbench is built to verify a functionality of a shift register IC (Integrated Circuit) from stuck-at-faults, stuck-at-1 as well as stuck-at-0. The testbench is supported by components, i.e., generator, interface, driver, monitor, scoreboard, environment, test, and testbench top. The IC consists of sequential logic circuits of D-type flip-flops. The faults may occur at interconnects between the circuits inside the IC. In order to examine the functionality from the faults, both the testbench and the IC are designed using SystemVerilog and simulated using Questasim simulator. Simulation results show the faults may be detected by the testbench. Moreover, the detected faults may be indicated by error statements in transcript results of the simulato

Concepts for Short Range Millimeter-wave Miniaturized Radar Systems with Built-in Self-Test

This work explores short-range millimeter wave radar systems, with emphasis on miniaturization and overall system cost reduction. The designing and implementation processes, starting from the system level design considerations and characterization of the individual components to final implementation of the proposed architecture are described briefly. Several D-band radar systems are developed and their functionality and performances are demonstrated

Application development process for GNAT, a SOC networked system

The market for smart devices was identified years ago, and yet commercial progress into this field has not made significant progress. The reason such devices are so painfully slow to market is that the gap between the technologically possible and the market capitalizable is too vast. In order for inventions to succeed commercially, they must bridge the gap to tomorrow\u27s technology with marketability today. This thesis demonstrates a design methodology that enables such commercial success for one variety of smart device, the Ambient Intelligence Node (AIN). Commercial Off-The Shelf (COTS) design tools allowing a Model-Driven Architecture (MDA) approach are combined via custom middleware to form an end-to-end design flow for rapid prototyping and commercialization. A walkthrough of this design methodology demonstrates its effectiveness in the creation of Global Network Academic Test (GNAT), a sample AIN. It is shown how designers are given the flexibility to incorporate IP Blocks available in the Global Economy to reduce Time-To-Market and cost. Finally, new kinds of products and solutions built on the higher levels of design abstraction permitted by MDA design methods are explored

Agnostic Validation Test Bench For Efuse Connectivity Verification

In semiconductor industry, validation is an important process to discover design bugs and have it fixed before the product is released. Semiconductor integrated circuit is normally refreshed in yearly cadence and it is crucial to have a short design and validation cycle, without compromising the product quality. Nowadays, validation process often becomes the bottleneck for product readiness. Integrated circuit validation flow has to be improved in order to keep up with the advancement of integrated circuit design flow. In this work, an improvement method on validation flow is discussed, with particular focus on eFUSE (Electric FUSE) connectivity validation. eFUSE is a feature available in integrated circuit which functions as a central storage for important ‘settings’, and distribute them during system boot up process. eFUSE connectivity validation is needed to ensure each intellectual property is able to retrieve the correct eFUSE value. In this work, the concept of agnostic validation test bench for eFUSE connectivity validation is developed and tested the idea of it is to eliminate manual test development effort, improves validation efficiency and promotes reusability across different projects. By using this methodology, eFUSE connectivity validation time is reduced significantly and recorded an improvement of 28%. There is also an average improvement of 65% in eFUSE coverage percentage. In summary, the eFUSE connectivity validation time frame is shortened, without compromising the test quality

Fault-tolerant fpga for mission-critical applications.

One of the devices that play a great role in electronic circuits design, specifically safety-critical design applications, is Field programmable Gate Arrays (FPGAs). This is because of its high performance, re-configurability and low development cost. FPGAs are used in many applications such as data processing, networks, automotive, space and industrial applications. Negative impacts on the reliability of such applications result from moving to smaller feature sizes in the latest FPGA architectures. This increases the need for fault-tolerant techniques to improve reliability and extend system lifetime of FPGA-based applications. In this thesis, two fault-tolerant techniques for FPGA-based applications are proposed with a built-in fault detection region. A low cost fault detection scheme is proposed for detecting faults using the fault detection region used in both schemes. The fault detection scheme primarily detects open faults in the programmable interconnect resources in the FPGAs. In addition, Stuck-At faults and Single Event Upsets (SEUs) fault can be detected. For fault recovery, each scheme has its own fault recovery approach. The first approach uses a spare module and a 2-to-1 multiplexer to recover from any fault detected. On the other hand, the second approach recovers from any fault detected using the property of Partial Reconfiguration (PR) in the FPGAs. It relies on identifying a Partially Reconfigurable block (P_b) in the FPGA that is used in the recovery process after the first faulty module is identified in the system. This technique uses only one location to recover from faults in any of the FPGA’s modules and the FPGA interconnects. Simulation results show that both techniques can detect and recover from open faults. In addition, Stuck-At faults and Single Event Upsets (SEUs) fault can also be detected. Finally, both techniques require low area overhead

Logic synthesis and testing techniques for switching nano-crossbar arrays

Beyond CMOS, new technologies are emerging to extend electronic systems with features unavailable to silicon-based devices. Emerging technologies provide new logic and interconnection structures for computation, storage and communication that may require new design paradigms, and therefore trigger the development of a new generation of design automation tools. In the last decade, several emerging technologies have been proposed and the time has come for studying new ad-hoc techniques and tools for logic synthesis, physical design and testing. The main goal of this project is developing a complete synthesis and optimization methodology for switching nano-crossbar arrays that leads to the design and construction of an emerging nanocomputer. New models for diode, FET, and four-terminal switch based nanoarrays are developed. The proposed methodology implements logic, arithmetic, and memory elements by considering performance parameters such as area, delay, power dissipation, and reliability. With combination of logic, arithmetic, and memory elements a synchronous state machine (SSM), representation of a computer, is realized. The proposed methodology targets variety of emerging technologies including nanowire/nanotube crossbar arrays, magnetic switch-based structures, and crossbar memories. The results of this project will be a foundation of nano-crossbar based circuit design techniques and greatly contribute to the construction of emerging computers beyond CMOS. The topic of this project can be considered under the research area of â\u80\u9cEmerging Computing Modelsâ\u80\u9d or â\u80\u9cComputational Nanoelectronicsâ\u80\u9d, more specifically the design, modeling, and simulation of new nanoscale switches beyond CMOS

Constraint-driven RF test stimulus generation and built-in test

With the explosive growth in wireless applications, the last decade witnessed an ever-increasing test challenge for radio frequency (RF) circuits. While the design community has pushed the envelope far into the future, by expanding CMOS process to be used with high-frequency wireless devices, test methodology has not advanced at the same pace. Consequently, testing such devices has become a major bottleneck in high-volume production, further driven by the growing need for tighter quality control. RF devices undergo testing during the prototype phase and during high-volume manufacturing (HVM). The benchtop test equipment used throughout prototyping is very precise yet specialized for a subset of functionalities. HVM calls for a different kind of test paradigm that emphasizes throughput and sufficiency, during which the projected performance parameters are measured one by one for each device by automated test equipment (ATE) and compared against defined limits called specifications. The set of tests required for each product differs greatly in terms of the equipment required and the time taken to test individual devices. Together with signal integrity, precision, and repeatability concerns, the initial cost of RF ATE is prohibitively high. As more functionality and protocols are integrated into a single RF device, the required number of specifications to be tested also increases, adding to the overall cost of testing, both in terms of the initial and recurring operating costs. In addition to the cost problem, RF testing proposes another challenge when these components are integrated into package-level system solutions. In systems-on-packages (SOP), the test problems resulting from signal integrity, input/output bandwidth (IO), and limited controllability and observability have initiated a paradigm shift in high-speed analog testing, favoring alternative approaches such as built-in tests (BIT) where the test functionality is brought into the package. This scheme can make use of a low-cost external tester connected through a low-bandwidth link in order to perform demanding response evaluations, as well as make use of the analog-to-digital converters and the digital signal processors available in the package to facilitate testing. Although research on analog built-in test has demonstrated hardware solutions for single specifications, the paradigm shift calls for a rather general approach in which a single methodology can be applied across different devices, and multiple specifications can be verified through a single test hardware unit, minimizing the area overhead. Specification-based alternate test methodology provides a suitable and flexible platform for handling the challenges addressed above. In this thesis, a framework that integrates ATE and system constraints into test stimulus generation and test response extraction is presented for the efficient production testing of high-performance RF devices using specification-based alternate tests. The main components of the presented framework are as follows: Constraint-driven RF alternate test stimulus generation: An automated test stimulus generation algorithm for RF devices that are evaluated by a specification-based alternate test solution is developed. The high-level models of the test signal path define constraints in the search space of the optimized test stimulus. These models are generated in enough detail such that they inherently define limitations of the low-cost ATE and the I/O restrictions of the device under test (DUT), yet they are simple enough that the non-linear optimization problem can be solved empirically in a reasonable amount of time. Feature extractors for BIT: A methodology for the built-in testing of RF devices integrated into SOPs is developed using additional hardware components. These hardware components correlate the high-bandwidth test response to low bandwidth signatures while extracting the test-critical features of the DUT. Supervised learning is used to map these extracted features, which otherwise are too complicated to decipher by plain mathematical analysis, into the specifications under test. Defect-based alternate testing of RF circuits: A methodology for the efficient testing of RF devices with low-cost defect-based alternate tests is developed. The signature of the DUT is probabilistically compared with a class of defect-free device signatures to explore possible corners under acceptable levels of process parameter variations. Such a defect filter applies discrimination rules generated by a supervised classifier and eliminates the need for a library of possible catastrophic defects.Ph.D.Committee Chair: Chatterjee, Abhijit; Committee Member: Durgin, Greg; Committee Member: Keezer, David; Committee Member: Milor, Linda; Committee Member: Sitaraman, Sures

High Speed Test Interface Module Using MEMS Technology

With the transient frequency of available CMOS technologies exceeding hundreds of gigahertz and the increasing complexity of Integrated Circuit (IC) designs, it is now apparent that the architecture of current testers needs to be greatly improved to keep up with the formidable challenges ahead. Test requirements for modern integrated circuits are becoming more stringent, complex and costly. These requirements include an increasing number of test channels, higher test-speeds and enhanced measurement accuracy and resolution. In a conventional test configuration, the signal path from Automatic Test Equipment (ATE) to the Device-Under-Test (DUT) includes long traces of wires. At frequencies above a few gigahertz, testing integrated circuits becomes a challenging task. The effects on transmission lines become critical requiring impedance matching to minimize signal reflection. AC resistance due to the skin effect and electromagnetic coupling caused by radiation can also become important factors affecting the test results. In the design of a Device Interface Board (DIB), the greater the physical separation of the DUT and the ATE pin electronics, the greater the distortion and signal degradation. In this work, a new Test Interface Module (TIM) based on MEMS technology is proposed to reduce the distance between the tester and device-under-test by orders of magnitude. The proposed solution increases the bandwidth of test channels and reduces the undesired effects of transmission lines on the test results. The MEMS test interface includes a fixed socket and a removable socket. The removable socket incorporates MEMS contact springs to provide temporary with the DUT pads and the fixed socket contains a bed of micro-pins to establish electrical connections with the ATE pin electronics. The MEMS based contact springs have been modified to implement a high-density wafer level test probes for Through Silicon Vias (TSVs) in three dimensional integrated circuits (3D-IC). Prototypes have been fabricated using Silicon On Insulator SOI wafer. Experimental results indicate that the proposed architectures can operate up to 50 GHz without much loss or distortion. The MEMS probes can also maintain a good elastic performance without any damage or deformation in the test phase