The Rolf of Test Chips in Coordinating Logic and Circuit Design and Layout Aids for VLSI

This paper emphasizes the need for multipurpose test chips and comprehensive procedures for use in supplying accurate input data to both logic and circuit simulators and chip layout aids. It is shown that the location of test structures within test chips is critical in obtaining representative data, because geometrical distortions introduced during the photomasking process can lead to significant intrachip parameter variations. In order to transfer test chip designs quickly, accurately, and economically, a commonly accepted portable chip layout notation and commonly accepted parametric tester language are needed. In order to measure test chips more accurately and more rapidly, parametric testers with improved architecture need to be developed in conjunction with innovative test structures with on-chip signal conditioning

Extending systems-on-chip to the third dimension : performance, cost and technological tradeoffs.

Because of the today's market demand for high-performance, high-density portable hand-held applications, electronic system design technology has shifted the focus from 2-D planar SoC single-chip solutions to different alternative options as tiled silicon and single-level embedded modules as well as 3-D integration. Among the various choices, finding an optimal solution for system implementation dealt usually with cost, performance and other technological trade-off analysis at the system conceptual level. It has been identified that the decisions made within the first 20% of the total design cycle time will ultimately result up to 80% of the final product cost. In this paper, we discuss appropriate and realistic metric for performance and cost trade-off analysis both at system conceptual level (up-front in the design phase) and at implementation phase for verification in the three-dimensional integration. In order to validate the methodology, two ubiquitous electronic systems are analyzed under various implementation schemes and discuss the pros and cons of each of them

Silicon compilation

Silicon compilation is a term used for many different purposes. In this paper we define silicon compilation as a mapping from some higher level description into layout. We define the basic issues in structural and behavioral silicon compilation and some possible solutions to those issues. Finally, we define the concept of an intelligent silicon compiler in which the compiler evaluates the quality of the generated design and attempts to improve it if it is not satisfactory

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

A 64-point Fourier transform chip for high-speed wireless LAN application using OFDM

In this article, we present a novel fixed-point 16-bit word-width 64-point FFT/IFFT processor developed primarily for the application in the OFDM based IEEE 802.11a Wireless LAN (WLAN) baseband processor. The 64-point FFT is realized by decomposing it into a 2-D structure of 8-point FFTs. This approach reduces the number of required complex multiplications compared to the conventional radix-2 64-point FFT algorithm. The complex multiplication operations are realized using shift-and-add operations. Thus, the processor does not use any 2-input digital multiplier. It also does not need any RAM or ROM for internal storage of coefficients. The proposed 64-point FFT/IFFT processor has been fabricated and tested successfully using our in-house 0.25 ?m BiCMOS technology. The core area of this chip is 6.8 mm2. The average dynamic power consumption is 41 mW @ 20 MHz operating frequency and 1.8 V supply voltage. The processor completes one parallel-to-parallel (i. e., when all input data are available in parallel and all output data are generated in parallel) 64-point FFT computation in 23 cycles. These features show that though it has been developed primarily for application in the IEEE 802.11a standard, it can be used for any application that requires fast operation as well as low power consumption

A Hierachical Infrastrucutre for SOC Test Management

HD2BIST - a complete hierarchical framework for BIST scheduling, data-patterns delivery, and diagnosis of complex systems - maximizes and simplifies the reuse of built-in test architectures. HD2BIST optimizes the flexibility for chip designers in planning an overall SoC test strategy by defining a test access method that provides direct virtual access to each core of the system

Semiconductor technology program: Progress briefs

Measurement technology for semiconductor materials, process control, and devices, is discussed. Silicon and silicon based devices are emphasized. Highlighted activities include semiinsulating GaAs characterization, an automatic scanning spectroscopic ellipsometer, linewidth measurement and coherence, bandgap narrowing effects in silicon, the evaluation of electrical linewidth uniformity, and arsenicomplanted profiles in silicon