Extending the performance of hybrid NoCs beyond the limitations of network heterogeneity

To meet the performance and scalability demands of the fast-paced technological growth towards exascale and Big-Data processing with the performance bottleneck of conventional metal based interconnects (wireline), alternative interconnect fabrics such as inhomogeneous three-dimensional integrated Network-on-Chip (3D NoC) and hybrid wired-wireless Network-on-Chip (WiNoC) have emanated as a cost-effective solution for emerging System-on-Chip (SoC) design. However, these interconnects trade-off optimized performance for cost by restricting the number of area and power hungry 3D routers and wireless nodes. Moreover, the non-uniform distributed traffic in chip multiprocessor (CMP) demands an on-chip communication infrastructure which can avoid congestion under high traffic conditions while possessing minimal pipeline delay at low-load conditions. To this end, in this paper, we propose a low-latency adaptive router with a low-complexity single-cycle bypassing mechanism to alleviate the performance degradation due to the slow 2D routers in such emerging hybrid NoCs. The proposed router transmits a flit using dimension-ordered routing (DoR) in the bypass datapath at low-loads. When the output port required for intra-dimension bypassing is not available, the packet is routed adaptively to avoid congestion. The router also has a simplified virtual channel allocation (VA) scheme that yields a non-speculative low-latency pipeline. By combining the low-complexity bypassing technique with adaptive routing, the proposed router is able balance the traffic in hybrid NoCs to achieve low-latency communication under various traffic loads. Simulation shows that, the proposed router can reduce applications’ execution time by an average of 16.9% compared to low-latency routers such as SWIFT. By reducing the latency between 2D routers (or wired nodes) and 3D routers (or wireless nodes) the proposed router can improve performance efficiency in terms of average packet delay by an average of 45% (or 50%) in 3D NoCs (or WiNoCs)

Reliability-aware and energy-efficient system level design for networks-on-chip

2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

Embedded dynamic programming networks for networks-on-chip

PhD ThesisRelentless technology downscaling and recent technological advancements in three dimensional integrated circuit (3D-IC) provide a promising prospect to realize heterogeneous system-on-chip (SoC) and homogeneous chip multiprocessor (CMP) based on the networks-onchip (NoCs) paradigm with augmented scalability, modularity and performance. In many cases in such systems, scheduling and managing communication resources are the major design and implementation challenges instead of the computing resources. Past research efforts were mainly focused on complex design-time or simple heuristic run-time approaches to deal with the on-chip network resource management with only local or partial information about the network. This could yield poor communication resource utilizations and amortize the benefits of the emerging technologies and design methods. Thus, the provision for efficient run-time resource management in large-scale on-chip systems becomes critical. This thesis proposes a design methodology for a novel run-time resource management infrastructure that can be realized efficiently using a distributed architecture, which closely couples with the distributed NoC infrastructure. The proposed infrastructure exploits the global information and status of the network to optimize and manage the on-chip communication resources at run-time. There are four major contributions in this thesis. First, it presents a novel deadlock detection method that utilizes run-time transitive closure (TC) computation to discover the existence of deadlock-equivalence sets, which imply loops of requests in NoCs. This detection scheme, TC-network, guarantees the discovery of all true-deadlocks without false alarms in contrast to state-of-the-art approximation and heuristic approaches. Second, it investigates the advantages of implementing future on-chip systems using three dimensional (3D) integration and presents the design, fabrication and testing results of a TC-network implemented in a fully stacked three-layer 3D architecture using a through-silicon via (TSV) complementary metal-oxide semiconductor (CMOS) technology. Testing results demonstrate the effectiveness of such a TC-network for deadlock detection with minimal computational delay in a large-scale network. Third, it introduces an adaptive strategy to effectively diffuse heat throughout the three dimensional network-on-chip (3D-NoC) geometry. This strategy employs a dynamic programming technique to select and optimize the direction of data manoeuvre in NoC. It leads to a tool, which is based on the accurate HotSpot thermal model and SystemC cycle accurate model, to simulate the thermal system and evaluate the proposed approach. Fourth, it presents a new dynamic programming-based run-time thermal management (DPRTM) system, including reactive and proactive schemes, to effectively diffuse heat throughout NoC-based CMPs by routing packets through the coolest paths, when the temperature does not exceed chip’s thermal limit. When the thermal limit is exceeded, throttling is employed to mitigate heat in the chip and DPRTM changes its course to avoid throttled paths and to minimize the impact of throttling on chip performance. This thesis enables a new avenue to explore a novel run-time resource management infrastructure for NoCs, in which new methodologies and concepts are proposed to enhance the on-chip networks for future large-scale 3D integration.Iraqi Ministry of Higher Education and Scientific Research (MOHESR)

Floorplan-Aware High Performance NoC Design

Las actuales arquitecturas de m�ltiples n�cleos como los chip multiprocesadores (CMP) y soluciones multiprocesador para sistemas dentro del chip (MPSoCs) han adoptado a las redes dentro del chip (NoC) como elemento -ptimo para la inter-conexi-n de los diversos elementos de dichos sistemas. En este sentido, fabricantes de CMPs y MPSoCs han adoptado NoCs sencillas, generalmente con una topolog'a en malla o anillo, ya que son suficientes para satisfacer las necesidades de los sistemas actuales. Sin embargo a medida que los requerimientos del sistema -- baja latencia y alto rendimiento -- se hacen m�s exigentes, estas redes tan simples dejan de ser una soluci-n real. As', la comunidad investigadora ha propuesto y analizado NoCs m�s complejas. No obstante, estas soluciones son m�s dif'ciles de implementar -- especialmente los enlaces largos -- haciendo que este tipo de topolog'as complejas sean demasiado costosas o incluso inviables. En esta tesis, presentamos una metodolog'a de dise-o que minimiza la p�rdida de prestaciones de la red debido a su implementaci-n real. Los principales problemas que se encuentran al implementar una NoC son los conmutadores y los enlaces largos. En esta tesis, el conmutador se ha hecho modular, es decir, formado como uni-n de m-dulos m�s peque-os. En nuestro caso, los m-dulos son id�nticos, donde cada m-dulo es capaz de arbitrar, conmutar, y almacenar los mensajes que le llegan. Posteriormente, flexibilizamos la colocaci-n de estos m-dulos en el chip, permitiendo que m-dulos de un mismo conmutador est�n distribuidos por el chip. Esta metodolog'a de dise-o la hemos aplicado a diferentes escenarios. Primeramente, hemos introducido nuestro conmutador modular en NoCs con topolog'as conocidas como la malla 2D. Los resultados muestran como la modularidad y la distribuci-n del conmutador reducen la latencia y el consumo de potencia de la red. En segundo lugar, hemos utilizado nuestra metodolog'a de dise-o para implementar un crossbar distribuidRoca Pérez, A. (2012). Floorplan-Aware High Performance NoC Design [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/17844Palanci

DDRNoC: Dual Data-Rate Network-on-Chip

This article introduces DDRNoC, an on-chip interconnection network capable of routing packets at Dual Data Rate. The cycle time of current 2D-mesh Network-on-Chip routers is limited by their control as opposed to the datapath (switch and link traversal), which exhibits significant slack. DDRNoC capitalizes on this observation, allowing two flits per cycle to share the same datapath. Thereby, DDRNoC achieves higher throughput than a Single Data Rate (SDR) network. Alternatively, using lower voltage circuits, the above slack can be exploited to reduce power consumption while matching the SDR network throughput. In addition, DDRNoC exhibits reduced clock distribution power, improving energy efficiency, as it needs a slower clock than a SDR network that routes packets at the same rate. Post place and route results in 28nm technology show that, compared to an iso-voltage (1.1V) SDR network, DDRNoC improves throughput proportionally to the SDR datapath slack. Moreover, a low-voltage (0.95V) DDRNoC implementation converts that slack to power reduction offering the 1.1V SDR throughput at a substantially lower energy cost

On Energy Efficient Computing Platforms

In accordance with the Moore's law, the increasing number of on-chip integrated transistors has enabled modern computing platforms with not only higher processing power but also more affordable prices. As a result, these platforms, including portable devices, work stations and data centres, are becoming an inevitable part of the human society. However, with the demand for portability and raising cost of power, energy efficiency has emerged to be a major concern for modern computing platforms. As the complexity of on-chip systems increases, Network-on-Chip (NoC) has been proved as an efficient communication architecture which can further improve system performances and scalability while reducing the design cost. Therefore, in this thesis, we study and propose energy optimization approaches based on NoC architecture, with special focuses on the following aspects. As the architectural trend of future computing platforms, 3D systems have many bene ts including higher integration density, smaller footprint, heterogeneous integration, etc. Moreover, 3D technology can signi cantly improve the network communication and effectively avoid long wirings, and therefore, provide higher system performance and energy efficiency. With the dynamic nature of on-chip communication in large scale NoC based systems, run-time system optimization is of crucial importance in order to achieve higher system reliability and essentially energy efficiency. In this thesis, we propose an agent based system design approach where agents are on-chip components which monitor and control system parameters such as supply voltage, operating frequency, etc. With this approach, we have analysed the implementation alternatives for dynamic voltage and frequency scaling and power gating techniques at different granularity, which reduce both dynamic and leakage energy consumption. Topologies, being one of the key factors for NoCs, are also explored for energy saving purpose. A Honeycomb NoC architecture is proposed in this thesis with turn-model based deadlock-free routing algorithms. Our analysis and simulation based evaluation show that Honeycomb NoCs outperform their Mesh based counterparts in terms of network cost, system performance as well as energy efficiency.Siirretty Doriast

CROSS-LAYER DESIGN, OPTIMIZATION AND PROTOTYPING OF NoCs FOR THE NEXT GENERATION OF HOMOGENEOUS MANY-CORE SYSTEMS

This thesis provides a whole set of design methods to enable and manage the runtime heterogeneity of features-rich industry-ready Tile-Based Networkon- Chips at different abstraction layers (Architecture Design, Network Assembling, Testing of NoC, Runtime Operation). The key idea is to maintain the functionalities of the original layers, and to improve the performance of architectures by allowing, joint optimization and layer coordinations. In general purpose systems, we address the microarchitectural challenges by codesigning and co-optimizing feature-rich architectures. In application-specific NoCs, we emphasize the event notification, so that the platform is continuously under control. At the network assembly level, this thesis proposes a Hold Time Robustness technique, to tackle the hold time issue in synchronous NoCs. At the network architectural level, the choice of a suitable synchronization paradigm requires a boost of synthesis flow as well as the coexistence with the DVFS. On one hand this implies the coexistence of mesochronous synchronizers in the network with dual-clock FIFOs at network boundaries. On the other hand, dual-clock FIFOs may be placed across inter-switch links hence removing the need for mesochronous synchronizers. This thesis will study the implications of the above approaches both on the design flow and on the performance and power quality metrics of the network. Once the manycore system is composed together, the issue of testing it arises. This thesis takes on this challenge and engineers various testing infrastructures. At the upper abstraction layer, the thesis addresses the issue of managing the fully operational system and proposes a congestion management technique named HACS. Moreover, some of the ideas of this thesis will undergo an FPGA prototyping. Finally, we provide some features for emerging technology by characterizing the power consumption of Optical NoC Interfaces

DDRNoC: Dual Data-Rate Network-on-Chip

Networks-on-Chip (NoCs) are becoming increasing important for the performance of modern multi-core system-on-chip. For various on-chip networks with virtual channel (VC) ow control, the slow control logic (VC and switch allocation logic) of the NoC routers limits the NoC clock period while their datapath (switch and link) possesses signifcant slack. This slack results in wasted performance potential of the datapath, limits the saturation throughput of the network and reduces its energy efficiency. The aim of this thesis is to improve NoC performance by eliminating this slack and removing control logic from the router critical path. To this end, this thesis presents the Dual Data-Rate (DDR) network architecture called the DDRNoC. It utilizes the NoC datapath twice with in a clock cycle to forward its at DDR. This not only exploits the slack present in the datapath but also requires a clock with period twice the datapath delay, thus removing the shorter control logic from the critical path. This enables the DDRNoC to achieve throughput higher than single data-rate networks. Moreover, the DDRNoC also employs lookahead signalling to reduce end-to-end packet latency. FreewayNoC, an extension to the DDRNoC supplements the DDRNoC with simplified pipeline stage bypassing to reduce the zero-load latency of packets in the network. Implementation of the DDRNoC and FreewayNoC architectures require redesign of the switch allocation (SA) mechanism to resolve contention among competing its by granting up to two its access to each switch input and output port per clock cycle. It further requires separate paths for the propagation of lookahead control signals. FreewayNoC also requires implementation of multiple checks to guarantee con ict-free bypassing of the SA stage. Physical implementation results using 28nm process technology show that DDRNoC and FreewayNoC have 5% and 15% area overhead, respectively, compared to a simple 3-stage network with VCs. Performance evaluation shows that for a 16X16 mesh network, FreewayNoC supports 25% higher throughput compared to current state-of-the-art NoC, ShortPath. Moreover, FreewayNoC achieves a zero-load latency which scales better than ShortPath and equally well with an ideal network that has no control overheads. For application driven traffic, FreewayNoC reduces average packet latency by 18% compared to ShortPath. Alternatively, low voltage implementation of the DDRNoC and FreewayNoC can be used to conserve power and improve energy efficiency at the cost of higher packet latency

Efficient bypass mechanisms for low latency networks on-chip

RESUMEN: La importancia de las redes en-chip en los procesadores multi-núcleo es cada vez mayor. Los routers con baipás son una solución eficiente para reducir la latencia de estas redes. Existen dos tipos de redes con baipás: single-hop y multi-hop. Las redes con baipás single-hop minimizan la latencia individual de cada router al asignar los recursos del router con antelación a la recepción de los paquetes. Las redes con baipás multi-hop, conocidas como SMART, permiten que los paquetes atraviesen múltiples routers en un único ciclo. La primera propuesta de esta tesis es Non-Empty Buffer Bypass (NEBB), un mecanismo que incrementa la utilización del baipás de tipo single-hop, eliminando la necesidad de usar canales virtuales. Para redes con baipás multi-hop propone SMART++ y S-SMART++. SMART++ elimina la necesidad de SMART de usar una gran cantidad de canales virtuales para aprovechar el ancho de banda de la red, permitiendo el diseño de configuraciones de bajo coste. S-SMART++ hace uso de la asignación de recursos de forma especulativa para preparar el baipás de tipo multi-hop. Este mecanismo reduce la latencia y su dependencia con la longitud máxima de los saltos de tipo multi-hop, aspecto clave para su viabilidad en diseños reales. La contribución final es un conjunto de herramientas de código abierto llamada Bypass Simulation Toolset (BST) compuesto por versiones extendidas de BookSim y OpenSMART, una API para integrar BookSim en otros simuladores y una serie de scripts para facilitar el diseño y evaluación de este tipo de redes.ABSTRACT: Networks on-Chip (NoCs) are becoming more important in many-core processors as the number of cores grows. Bypass routers are an efficient solution that skips pipeline stages. There are two types of bypass mechanisms: single-hop and multi-hop bypass. Single-hop bypass minimizes the router delay by skipping allocation stages in each hop. Multi-hop bypass, called SMART, minimizes the effective number of hops by traversing multiple routers in a single cycle. The first proposal of this dissertation is Non-Empty Buffer Bypass (NEBB) for single-hop bypass, which increases the bypass utilization without requiring VCs to match traditional bypass routers. It proposes SMART++ and S-SMART++ for multi-hop bypass. SMART++ removes the requirement of using multiple VCs of SMART to exploit the bandwidth of the network, enabling low-cost configurations. S-SMART++ relies on speculative allocation to set up multi-hop bypass paths. Thus, it reduces latency and its dependency with the maximum length of multi-hops, relaxing the requirements to integrate multi-hop bypass in real designs. The final contribution is an open-source set of tools to simulate bypass NoCs called Bypass Simulation Toolset (BST) conformed by extended versions of BookSim and OpenSMART, an API to integrate BookSim in other simulators, and scripts to simplify the designing and evaluation of such NoCs.This work was supported by the Spanish Ministry of Science, Innovation and Universities, FPI grant BES-2017-079971, and contracts TIN2010-21291-C02-02, TIN2013- 46957-C2-2-P, TIN2015-65316-P, TIN2016-76635-C2-2-R (AEI/FEDER, UE) and TIC PID2019-105660RB-C22; the European HiPEAC Network of Excellence; the European Community's Seventh Framework Programme (FP7/2007-2013), under the Mont-Blanc 1 and 2 projects (grant agreements n 288777 and 610402); the European Union's Horizon 2020 research and innovation programme under the Mont-Blanc 3 project (grant agreement nº 671697). Bluespec Inc. provided access to Bluespec tools