Design and Analysis of a Discrete, PCB-Level Low-Power, Microwave Cross-Coupled Differential LC Voltage-Controlled Oscillator

Radio Frequency (RF) and Microwave devices are typically implemented in Integrated Circuit (IC) form to minimize parasitics, increase precision and tolerances, and minimize size. Although IC fabrication for students and independent engineers is cost-prohibitive, an abundance of low-cost, easily accessible printed circuit board (PCB) and electronic component manufacturers allows affordable PCB fabrication. While nearly all microwave voltage-controlled oscillator (VCO) designs are IC-based, this study presents a discrete PCB-level cross-coupled, differential LC VCO to demonstrate this more affordable and accessible approach. This thesis presents a 65 mW, discrete component VCO PCB with industry-comparable RF performance. A phase noise of -103.7 dBc/Hz is simulated at a 100 kHz offset from a 4.05 GHz carrier. This VCO achieves a 532 MHz (13.25%) tuning bandwidth. A figure of merit, FOMP, [1] value of -177.7 dB (includes phase noise and power consumption) is calculated at 4.05 GHz. This surpasses the performance of an industry standard VCO (HMC430LPx, Analog Devices), -176.5 dB, and four other commercially available VCOs. Furthermore, this study presents novel discrete design implementations to minimize both power consumption and capacitive loading effects, while optimizing phase noise. Finally, this project serves as a reference for analyzing and implementing low-level, complex RF and Microwave circuits on a PCB accessible to all students and independent engineers

Microwave CMOS VCOs and Front-Ends - using integrated passives on-chip and on-carrier

The increasing demand for high data rates in wireless communication systems is increasing the requirements on the transceiver front-ends, as they are pushed to utilize more and wider bands at higher frequencies. The work in this thesis is focused on receiver front-ends composed of Low Noise Amplifiers (LNAs), Mixers, and Voltage Controlled Oscillators (VCOs) operating at microwave frequencies. Traditionally, microwave electronics has used exclusive and more expensive semiconductor technologies (III-V materials). However, the rapid development of consumer electronics (e.g. video game consoles) the last decade has pushed the silicon CMOS IC technology towards even smaller feature sizes. This has resulted in high speed transistors (high fT and fmax) with low noise figures. However, as the breakdown voltages have decreased, a lower supply voltage must be used, which has had a negative impact on linearity and dynamic range. Nonetheless, todays downscaled CMOS technology is a feasible alternative for many microwave and even millimeter wave applications. The low quality factor (Q) of passive components on-chip usually limits the high frequency performance. For inductors realized in a standard CMOS process the substrate coupling results in a degraded Q. The quality factor can, however, be improved by moving the passive components off-chip and integrating them on a low loss carrier. This thesis therefore features microwave front-end and VCO designs in CMOS, where some designs have been flip-chip mounted on carriers featuring high Q inductors and low loss baluns. The thesis starts with an introduction to wireless communication, receiver architectures, front-end receiver blocks, and low loss carrier technology, followed by the included papers. The six included papers show the capability of CMOS and carrier technology at microwave frequencies: Papers II, III, and VI demonstrate fully integrated CMOS circuit designs. An LC-VCO using an accumulation mode varactor is presented in Paper II, a QVCO using 4-bit switched tuning is shown in Paper III, and a quadrature receiver front-end (including QVCO) is demonstrated in paper VI. Papers I and IV demonstrate receiver front-ends using low loss baluns on carrier for the LO and RF signals. Paper IV also includes a front-end using single-ended RF input which is converted to differential form in a novel merged LNA and balun. A VCO demonstrating the benefits of a high Q inductor on carrier is presented in Paper V

Investigation on LIGA-MEMS and on-chip CMOS capacitors for a VCO application

Modern communication systems require high performance radio frequency (RF) and microwave circuits and devices. This is becoming increasingly challenging to realize in the content of cost/size constraints. Integrated circuits (ICs) satisfy the cost/size requirement, but performance is often sacri¯ced. For instance, high quality factor (Q factor) passive components are difficult to achieve in standard silicon-based IC processes.In recent years, microelectromechanical systems (MEMS) devices have been receiving increasing attention as a possible replacement for various on-chip passive elements, offering potential improvement in performance while maintaining high levels of integration. Variable capacitors (varactor) are common elements used in various applications. One of the MEMS variable capacitors that has been recently developed is built using deep X-ray lithography (as part of the LIGA process). This type of capacitor exhibits high quality factor at microwave frequencies.The complementary metal oxide semiconductor (CMOS) technology dominates the silicon IC process. CMOS becomes increasingly popular for RF applications due to its advantages in level of integration, cost and power consumption. This research demonstrates a CMOS voltage-controlled oscillator (VCO) design which is used to investigate methods, advantages and problems in integrating LIGA-MEMS devices to CMOS RF circuits, and to evaluate the performance of the LIGA-MEMS variable capacitor in comparison with the conventional on-chip CMOS varactor. The VCO was designed and fabricated using TSMC 0.18 micron CMOS technology. The core of the VCO, including transistors, resistors, and on-chip inductors was designed to connect to either an on-chip CMOS varactor or an off-chip LIGA-MEMS capacitor to oscillate between 2.6 GHz and 2.7 GHz. Oscillator phase noise analysis is used to compare the performance between the two capacitors. The fabricated VCO occupied an area of 1 mm^2.This initial attempt at VCO fabrication did not produce a functional VCO, so the performance of the capacitors with the fabricated VCO could not be tested. However, the simulation results show that with this LIGA-MEMS capacitor, a 6.4 dB of phase noise improvement at 300 kHz offset from the carrier is possible in a CMOS-based VCO design

Circuits and Systems for On-Chip RF Chemical Sensors and RF FDD Duplexers

Integrating RF bio-chemical sensors and RF duplexers helps to reduce cost and area in the current applications. Furthermore, new applications can exist based on the large scale integration of these crucial blocks. This dissertation addresses the integration of RF bio-chemical sensors and RF duplexers by proposing these initiatives. A low power integrated LC-oscillator-based broadband dielectric spectroscopy (BDS) system is presented. The real relative permittivity ε’r is measured as a shift in the oscillator frequency using an on-chip frequency-to-digital converter (FDC). The imaginary relative permittivity ε”r increases the losses of the oscillator tank which mandates a higher dc biasing current to preserve the same oscillation amplitude. An amplitude-locked loop (ALL) is used to fix the amplitude and linearize the relation between the oscillator bias current and ε”r. The proposed BDS system employs a sensing oscillator and a reference oscillator where correlated double sampling (CDS) is used to mitigate the impact of flicker noise, temperature variations and frequency drifts. A prototype is implemented in 0.18 µm CMOS process with total chip area of 6.24 mm^2 to operate in 1-6 GHz range using three dual bands LC oscillators. The achieved standard deviation in the air is 2.1 ppm for frequency reading and 110 ppm for current reading. A tunable integrated electrical balanced duplexer (EBD) is presented as a compact alternative to multiple bulky SAW and BAW duplexers in 3G/4G cellular transceivers. A balancing network creates a replica of the transmitter signal for cancellation at the input of a single-ended low noise amplifier (LNA) to isolate the receive path from the transmitter. The proposed passive EBD is based on a cross-connected transformer topology without the need of any extra balun at the antenna side. The duplexer achieves around 50 dB TX-RX isolation within 1.6-2.2 GHz range up to 22 dBm. The cascaded noise figure of the duplexer and LNA is 6.5 dB, and TX insertion loss (TXIL) of the duplexer is about 3.2 dB. The duplexer and LNA are implemented in 0.18 µm CMOS process and occupy an active area of 0.35 mm^2

Design of CMOS integrated frequency synthesizers for ultra-wideband wireless communications systems

Ultra¬wide band (UWB) system is a breakthrough in wireless communication, as it provides data rate one order higher than existing ones. This dissertation focuses on the design of CMOS integrated frequency synthesizer and its building blocks used in UWB system. A mixer¬based frequency synthesizer architecture is proposed to satisfy the agile frequency hopping requirement, which is no more than 9.5 ns, three orders faster than conventional phase¬locked loop (PLL)¬based synthesizers. Harmonic cancela¬tion technique is extended and applied to suppress the undesired harmonic mixing components. Simulation shows that sidebands at 2.4 GHz and 5 GHz are below 36 dBc from carrier. The frequency synthesizer contains a novel quadrature VCO based on the capacitive source degeneration structure. The QVCO tackles the jeopardous ambiguity of the oscillation frequency in conventional QVCOs. Measurement shows that the 5¬GHz CSD¬QVCO in 0.18 µm CMOS technology draws 5.2 mA current from a 1.2 V power supply. Its phase noise is ¬120 dBc at 3 MHz offset. Compared with existing phase shift LC QVCOs, the proposed CSD¬QVCO presents better phase noise and power efficiency. Finally, a novel injection locking frequency divider (ILFD) is presented. Im¬plemented with three stages in 0.18 µm CMOS technology, the ILFD draws 3¬mA current from a 1.8¬V power supply. It achieves multiple large division ratios as 6, 12, and 18 with all locking ranges greater than 1.7 GHz and injection frequency up to 11 GHz. Compared with other published ILFDs, the proposed ILFD achieves the largest division ratio with satisfactory locking range

Design of CMOS LC voltage controlled oscillators

This work presents the design and implementation of CMOS LC voltage controlled oscillators. On-chip planar spiral inductors and PMOS inversion mode varactors were utilized to implement the resonator. Two voltage controlled oscillators (VCOs) were realized as a part of this work, one designed to operate at 1.1 GHz while the second at 1.8 GHz. Both VCOs were implemented in a scalable digital CMOS process, with the former in a 1.5 micron CMOS process and the latter in a 0.5 micron technology. A simulation based methodology was adopted to arrive at a simple pi model used to model the metal and substrate related losses responsible for deteriorating the integrated inductor\u27s performance. Geometry based optimization techniques were utilized to arrive at an inductor geometry that ensures reasonable quality factor. In addition to the core VCO structure a host of test structures have been incorporated in order to carry out two-port network measurements in the future. Such measurements should enable one to gain a greater insight into the integrated inductor and varactor\u27s performance

DESIGN OF A FOUR STAGES VCO USING A NOVEL DELAY CIRCUIT FOR OPERATION IN DISTRIBUTED BAND FREQUENCIES

The manuscript proposes a novel architecture of a delay cell that is implemented in 4-stage VCO which has the ability to operate in two distributed frequency bands. The operating frequency is chosen based on the principle of carrier mobility and the transistor resistance. The VCO uses dual delay input techniques to improve the frequency of operation. The design is implemented in Cadence 90nm GPDK CMOS technology and simulated results show that it is capable of operating in dual frequency bands of 55 MHz to 606 MHz and 857 MHz to 1049 MHz. At normal temperature (270) power consumption of the circuit is found to be 151μW at 606 MHz and 157μW at 1049 MHz respectively and consumes an area of 171.42µm2. The design shows good tradeoff between the parameters-operating frequency, phase noise and power consumption

Clock Generation Design for Continuous-Time Sigma-Delta Analog-To-Digital Converter in Communication Systems

Software defined radio, a highly digitized wireless receiver, has drawn huge attention in modern communication system because it can not only benefit from the advanced technologies but also exploit large digital calibration of digital signal processing (DSP) to optimize the performance of receivers. Continuous-time (CT) bandpass sigma-delta (ΣΔ) modulator, used as an RF-to-digital converter, has been regarded as a potential solution for software defined ratio. The demand to support multiple standards motivates the development of a broadband CT bandpass ΣΔ which can cover the most commercial spectrum of 1GHz to 4GHz in a modern communication system. Clock generation, a major building block in radio frequency (RF) integrated circuits (ICs), usually uses a phase-locked loop (PLL) to provide the required clock frequency to modulate/demodulate the informative signals. This work explores the design of clock generation in RF ICs. First, a 2-16 GHz frequency synthesizer is proposed to provide the sampling clocks for a programmable continuous-time bandpass sigma-delta (ΣΔ) modulator in a software radio receiver system. In the frequency synthesizer, a single-sideband mixer combines feed-forward and regenerative mixing techniques to achieve the wide frequency range. Furthermore, to optimize the excess loop delay in the wideband system, a phase-tunable clock distribution network and a clock-controlled quantizer are proposed. Also, the false locking of regenerative mixing is solved by controlling the self-oscillation frequency of the CML divider. The proposed frequency synthesizer performs excellent jitter performance and efficient power consumption. Phase noise and quadrature phase accuracy are the common tradeoff in a quadrature voltage-controlled oscillator. A larger coupling ratio is preferred to obtain good phase accuracy but suffer phase noise performance. To address these fundamental trade-offs, a phasor-based analysis is used to explain bi-modal oscillation and compute the quadrature phase errors given by inevitable mismatches of components. Also, the ISF is used to estimate the noise contribution of each major noise source. A CSD QVCO is first proposed to eliminate the undesired bi-modal oscillation and enhance the quadrature phase accuracy. The second work presents a DCC QVCO. The sophisticated dynamic current-clipping coupling network reduces injecting noise into LC tank at most vulnerable timings (zero crossing points). Hence, it allows the use of strong coupling ratio to minimize the quadrature phase sensitivity to mismatches without degrading the phase noise performance. The proposed DCC QVCO is implemented in a 130-nm CMOS technology. The measured phase noise is -121 dBc/Hz at 1MHz offset from a 5GHz carrier. The QVCO consumes 4.2mW with a 1-V power supply, resulting in an outstanding Figure of Merit (FoM) of 189 dBc/Hz. Frequency divider is one of the most power hungry building blocks in a PLL-based frequency synthesizer. The complementary injection-locked frequency divider is proposed to be a low-power solution. With the complimentary injection schemes, the dividers can realize both even and odd division modulus, performing a more than 100% locking range to overcome the PVT variation. The proposed dividers feature excellent phase noise. They can be used for multiple-phase generation, programmable phase-switching frequency dividers, and phase-skewing circuits