Advanced sensors technology survey

This project assesses the state-of-the-art in advanced or 'smart' sensors technology for NASA Life Sciences research applications with an emphasis on those sensors with potential applications on the space station freedom (SSF). The objectives are: (1) to conduct literature reviews on relevant advanced sensor technology; (2) to interview various scientists and engineers in industry, academia, and government who are knowledgeable on this topic; (3) to provide viewpoints and opinions regarding the potential applications of this technology on the SSF; and (4) to provide summary charts of relevant technologies and centers where these technologies are being developed

Smart Platform for Low-Cost MEMS Sensors – Pressure, Flow and Thermal Conductivity

In a technological world that is trending towards smart and autonomous engineering, the collection of quality data is of unrivalled importance. This has led to a huge market demand for the development of low-cost, small and accurate sensors and thus has resulted in significant research into sensors, with the aim of advancing the price/performance ratio in commercial solutions. Micro Electro Mechanical Systems (MEMS) have recently offered an attractive solution to miniaturise and drastically improve the performance of sensors. In this thesis, MEMS technology is exploited to create a multi-sensor technology platform that is used to fabricate several sensing technologies. Piezo-resistive and piezo-electronic pressure sensors are designed, fabricated and tested. Different doping profiles, stress-engineered structures and electronic devices for pressure transduction are investigated, with focus on their sensitivity and non-linearity. A ring is fabricated in the metal layer around the circumference of the membrane that alleviates the effects of over/under etching. This is achieved by creating a new rigid edge of the membrane in the metal layer, which has tighter fabrication tolerances. A piezo-MOSFET is developed and shown to have greater sensitivity than similar state-of-the-art devices. Flow sensors based on a heated tungsten wire are designed, fabricated, tested and substantiated with numerical modelling. Calorimetric and anemometric driving modes are optimised with regards to device structure. Thermodiodes are also used as the temperature transduction devices and are compared to the traditional resistor method and showed to be preferable when further miniaturising the sensor. Thermal conductivity gas sensors based on a heated tungsten resistor are designed, tested and substantiated with numerical modelling. Holes through the membrane are used to improve the sensitivity to measuring carbon dioxide by 270%. Asymmetric holes are utilised to prove a novel method of measuring thermal conductivity in a calorimetric method. Designs improving this new concept are outlined and substantiated with analytical and numerical models. Linear statistical methods and artificial neural networks are used to differentiate flow rate and gas concentration using three on-membrane resistors. With membrane holes, the discrimination between gases in the presence of flow is improved. Neural networks provide a viable solution and show an increase in the accuracy of both flow rate and gas concentration. The main objective of the work in this thesis was to develop low-cost, low-power, small devices capable of high-volume production and monolithic integration using a single smart technology platform for fabrication. The smart technology platform was used to create pressure sensors, flow sensors and thermal conductivity gas sensors. Within each sensing technology, proof-of-concepts and optimisations have been carried out in order to maximise performance whilst using the low-cost, high-volume fabrication process, ultimately helping towards smart and autonomous engineering solutions driven by data

Resonant Magnetic Field Sensors Based On MEMS Technology

Microelectromechanical systems (MEMS) technology allows the integration of magnetic field sensors with electronic components, which presents important advantages such as small size, light weight, minimum power consumption, low cost, better sensitivity and high resolution. We present a discussion and review of resonant magnetic field sensors based on MEMS technology. In practice, these sensors exploit the Lorentz force in order to detect external magnetic fields through the displacement of resonant structures, which are measured with optical, capacitive, and piezoresistive sensing techniques. From these, the optical sensing presents immunity to electromagnetic interference (EMI) and reduces the read-out electronic complexity. Moreover, piezoresistive sensing requires an easy fabrication process as well as a standard packaging. A description of the operation mechanisms, advantages and drawbacks of each sensor is considered. MEMS magnetic field sensors are a potential alternative for numerous applications, including the automotive industry, military, medical, telecommunications, oceanographic, spatial, and environment science. In addition, future markets will need the development of several sensors on a single chip for measuring different parameters such as the magnetic field, pressure, temperature and acceleration

Integration of electronic and optical techniques in the design and fabrication of pressure sensors

Since the introduction of micro-electro-mechanical systems fabrication methods, piezoresistive pressure sensors have become the more popular pressure transducers. They dominate pressure sensor commercialization due to their high performance, stability and repeatability. However, increasing demand for harsh environment sensing devices has made sensors based on Fabry-Perot interferometry the more promising optical pressure sensors due to their high degree of sensitivity, small size, high temperature performance, versatility, and improved immunity to environmental noise and interference. The work presented in this dissertation comprises the design, fabrication, and testing of sensors that fuse these two pressure sensing technologies into one integrated unit. A key innovation is introduction of a silicon diaphragm with a center rigid body (or boss), denoted as an embossed diaphragm, that acts as the sensing element for both the electronic and optical parts of the sensor. Physical principles of piezoresistivity and Fabry-Perot interferometry were applied in designing an integrated sensor and in determining analytic models for the respective electronic and optical outputs. Several test pressure sensors were produced and their performance was evaluated by collecting response and noise data. Diaphragm deflection under applied pressure was detected electronically using the principle of piezoresistivity and optically using Fabry-Perot interferometry. The electronic part of the sensor contained four p-type silicon piezoresistors that were set into the diaphragm. They were connected in a Wheatstone bridge configuration for detecting strain-dependent changes in resistance induced by diaphragm deflection. In the optical part of the sensor, an optical cavity was formed between the embossed surface of the diaphragm and the end face of a single mode optical fiber. An infrared laser operating at 1.55 was used for optical excitation. Deflection of the diaphragm, which causes the length of the optical cavity to change, was detected by Fabry-Perot interference in the reflected light. Data collected on several sensors fabricated for this dissertation were shown to validate the theoretical models. In particular, the principle of operation of a Fabry-Perot interferometer as a mechanism for pressure sensing was demonstrated. The physical characteristics and behavior of the embossed diaphragm facilitated the integration of the electronic and optical approaches because the embossed diaphragm remained flat under diaphragm deflection. Consequently, it made the electronic sensor respond more linearly to applied pressure. Further, it eliminated a fundamental deficiency of previous applications of Fabry-Perot methods, which suffered from non-parallelism between the two cavity surfaces (diaphragm and fiber), owing to diaphragm curvature after pressure was applied. It also permitted the sensor to be less sensitive to lateral misalignment during the fabrication process and considerably reduced back pressure, which otherwise reduced the sensitivity of the sensor. As an integrated sensor, it offered two independent outputs in one sensor and therefore the capability for measurements of: (a) static and dynamic pressures simultaneously, and (b) two different physical quantities such as temperature and pressure

Teaching old sensors New tricks: archetypes of intelligence

In this paper a generic intelligent sensor software architecture is described which builds upon the basic requirements of related industry standards (IEEE 1451 and SEVA BS- 7986). It incorporates specific functionalities such as real-time fault detection, drift compensation, adaptation to environmental changes and autonomous reconfiguration. The modular based structure of the intelligent sensor architecture provides enhanced flexibility in regard to the choice of specific algorithmic realizations. In this context, the particular aspects of fault detection and drift estimation are discussed. A mixed indicative/corrective fault detection approach is proposed while it is demonstrated that reversible/irreversible state dependent drift can be estimated using generic algorithms such as the EKF or on-line density estimators. Finally, a parsimonious density estimator is presented and validated through simulated and real data for use in an operating regime dependent fault detection framework

Intelligent Detector of Internal Combustion Engine Cylinder Pressure and Sensitivity Temperature Coefficient Compensation

The detecting device based on mechanical mechanism is far from the measurement of internal combustion engine cylinder explosion and compression pressure. This pressure detection is under the environment of pulsed gas (over 500 times per one minute) and mechanical impactive vibration. Piezoresistive detection with silicon on insulator (SOI) strain gauges to pressure seems to be a good solution to meet such special applications. In this work, separation by implanted oxygen (SIMOX) wafer was used to fabricate the high temperature pressure sensor chip. For high accuracy and wide temperature range application, this paper also presents a novel pressure sensitivity temperature coefficient (TCS) compensation method, using integrated constant current network. A quantitative compensation formula is introduced in mathematics. During experiments, the absolute value of the compensated TCS is easy to be 10 × 10−6/°C~100 × 10−6/°C by individual adjustment and calibration of each device’s temperature compensation. Therefore, the feasibility and practicability of this technology are tested. Again, the disadvantages are discussed after the research of the experiment data and the improvement methods are also given in the designing period. This technology exhibits the great potential practical value of internal combustion engine cylinder pressure with volume manufacturing

Doctor of Philosophy

dissertationNew hydrogel-based micropressure sensor arrays for use in the fields of chemical sensing, physiological monitoring, and medical diagnostics are developed and demonstrated. This sensor technology provides reliable, linear, and accurate measurements of hydrogel swelling pressures, a function of ambient chemical concentrations. For the first time, perforations were implemented into the pressure sensors piezoresistive diaphragms, used to simultaneously increase sensor sensitivity and permit diffusion of analytes into the hydrogel cavity. It was shown through analytical and numerical (finite element) methods that pore shape, location, and size can be used to modify the diaphragm mechanics and concentrate stress within the piezoresistors, thus improving electrical output (sensitivity). An optimized pore pattern was chosen based on these numerical calculations. Fabrication was performed using a 14-step semiconductor fabrication process implementing a combination of potassium hydroxide (KOH) and deep reactive ion etching (DRIE) to create perforations. The sensor arrays (2×2) measure approximately 3 × 5 mm2 and used to measure full scale pressures of 50, 25, and 5 kPa, respectively. These specifications were defined by the various swelling pressures of ionic strength, pH and glucose specific hydrogels that were targeted in this work. Initial characterization of the sensor arrays was performed using a custom built bulge testing apparatus that simultaneously measured deflection (optical profilometry), pressure, and electrical output. The new perforated diaphragm sensors were found to be fully functional with sensitivities ranging from 23 to 252 μV/V-kPa with full scale output (FSO) ranging from 5 to 80 mV. To demonstrate proof of concept, hydrogels sensitive to changes in ionic strength were synthesized using hydroxypropyl-methacrylate (HPMA), N,N-dimethylaminoethyl-methacrylate (DMA) and a tetra-ethyleneglycol-dimethacrylate (TEGDMA) crosslinker. This hydrogel quickly and reversibly swells when placed environments of physiological buffer solutions (PBS) with ionic strengths ranging from 0.025 to 0.15 M. Chemical testing showed sensors with perforated diaphragms have higher sensitivity than those with solid diaphragms, and sensitivities ranging from 53.3±6.5 to 271.47±27.53 mV/V-M, depending on diaphragm size. Additionally, recent experiments show sensors utilizing Ultra Violet (UV) polymerized glucose sensitive hydrogels respond reversibly to physiologically relevant glucose concentrations from 0 to 20 mM

Integrated Circuits and Systems for Smart Sensory Applications

Connected intelligent sensing reshapes our society by empowering people with increasing new ways of mutual interactions. As integration technologies keep their scaling roadmap, the horizon of sensory applications is rapidly widening, thanks to myriad light-weight low-power or, in same cases even self-powered, smart devices with high-connectivity capabilities. CMOS integrated circuits technology is the best candidate to supply the required smartness and to pioneer these emerging sensory systems. As a result, new challenges are arising around the design of these integrated circuits and systems for sensory applications in terms of low-power edge computing, power management strategies, low-range wireless communications, integration with sensing devices. In this Special Issue recent advances in application-specific integrated circuits (ASIC) and systems for smart sensory applications in the following five emerging topics: (I) dedicated short-range communications transceivers; (II) digital smart sensors, (III) implantable neural interfaces, (IV) Power Management Strategies in wireless sensor nodes and (V) neuromorphic hardware

An Implantable Low Pressure, Low Drift, Dual BioPressure Sensor and In-Vivo Calibration Methods Thereof

The human body’s intracranial pressure (ICP) is a critical component in sustaining healthy blood flow to the brain while allowing adequate volume for brain tissue within the rigid structures of the cranium. Disruptions in the body’s autoregulation of intracranial pressure are often caused by hemorrhage, tumors, edema, or excess cerebral spinal fluid resulting in treatments that are estimated to globally cost up to approximately five billion dollars annually. A critical element in the contemporary management of acute head injury, intracranial hemorrhage, stroke, or other conditions resulting in intracranial hypertension, is the real-time monitoring of ICP. Currently, such mainstream clinical monitoring can only take place short-term within an acute care hospital. The monitoring is prone to measurement drift and is comprised of externally tethered pressure sensors that are temporarily implanted into the brain, thus carrying a significant risk of infection. To date, reliable, low drift, completely internalized, long-term ICP monitoring devices remain elusive. The successful development of such a device would not only be safer and more reliable in the short-term but would expand the use of ICP monitoring for the management of chronic intracranial hypertension and enable further clinical research into these disorders. The research herein reviews the current challenges of existing ICP monitoring systems, develops a new novel sensing technology, and evaluates the same for potentially facilitating long-term implantable ICP sensing. Based upon the findings of this research, this dissertation proposes and evaluates a dual matched-die piezo-resistive strain sensing device, with a novel in-vivo calibration system and method thereof, for application to long-term implantable ICP sensing