DESIGN AND PERFORMANCE COMPARISON OF AVERAGE 8T SRAM WITH EXISTING 8T SRAM CELLS

This paper presents 8T SRAM cell by using various techniques. The conflicting design requirement of read versus write operation in a conventional 8T SRAM bit cell is eliminated using separate read/write access transistors The read stability and the write-ability can be optimized independently by optimizing the respective access transistor size. A new average-8T write/read decoupled SRAM architecture for low-power sub/near-threshold SRAM used in power-constraint applications such as biomedical implants and autonomous sensor nodes. The proposed architecture consists of several novel concepts in dealing with issues in sub/near-threshold SRAM including the differential and data-independent-leakage read port that facilitates robust and faster read operation Simulation result of 8T SRAM design using TANNER tool shows the reduction in total average power and delay. DOI: 10.17762/ijritcc2321-8169.15029

Expanded Noise Margin 10T SRAM Cell using Finfet Device

Static random access memory (SRAM) cells are being improved in order to increase resistance to device level changes and satisfy the requirements of low-power applications. A unique 10-transistor FinFET-based SRAM cell with single-ended read and differential write functionality is presented in this study. This cutting-edge architecture is more power-efficient than ST (Schmitt trigger) 10T or traditional 6T SRAM cells, using only 1.87 and 1.6 units of power respectively during read operations. The efficiency is attributable to a lower read activity factor, which saves electricity. The read static noise margin (RSNM) and write static noise margin (WSNM) of the proposed 10T SRAM cell show notable improvements over the 6T SRAM cell, increasing by 1.67 and 1.86, respectively. Additionally, compared to the 6T SRAM cell, the read access time has been significantly reduced by 1.96 seconds. Utilising the Cadence Virtuoso tool and an 18nm Advanced Node Process Design Kit (PDK) technology file, the design's efficacy has been confirmed. For low-power electronic systems and next-generation memory applications, this exciting 10T SRAM cell has a lot of potential

-Memory Computing Based Reliable and High Speed Schmitt trigger 10T SRAM cell design

Static random access memories (SRAM) are useful building blocks in various applications, including cache memories, integrated data storage systems, and microprocessors. The von Neumann bottleneck difficulties are solved by in-memory computing. It eliminates unnecessary frequent data transfer between memory and processing units simultaneously. In this research, the replica-based 10T SRAM design for in-memory computing (IMC) is designed by adapting the word line control scheme in 14nm CMOS technology. In order to achieve high reading and writing capability, the Schmitt trigger inverter was used for energy-saving and stable use. To speed up the writing process of the design, a single transistor is inserted between the cross-coupled inverters. In addition, to increase the node capacity, the voltage boosting circuitry is emphasized. The adaptive word line control scheme was utilized by integrating the replica column based circuit. The Replica approach regulates signal flow through the core by using a dummy column and a dummy row in RAM. To demonstrate the viability of the suggested design, the simulated outcomes are contrasted with those of existing designs. The various performance metrics examined are Read Static Noise Margin (RSNM), Write (WSNM), Hold (HSNM), Read Access Delay (RAD), Write Access Delay (WAD), Read performance and Write performance the varying supply voltage is evaluated

A 0.3V 1kb Sub-Threshold SRAM for Ultra-Low-Power Application in 90nm CMOS

[[notice]]缺頁數[[conferencetype]]國際[[conferencedate]]20120715~20120718[[booktype]]電子版[[iscallforpapers]]Y[[conferencelocation]]Sapporo, Japa

ULTRALOW-POWER, LOW-VOLTAGE DIGITAL CIRCUITS FOR BIOMEDICAL SENSOR NODES

Ph.DDOCTOR OF PHILOSOPH

A Review on Enhancement of SRAM Memory Cell

In this field research paper explores the design and analysis of Static Random Access Memory (SRAMs) that focuses on optimizing delay and power. CMOS SRAM cell consumes very little power and has less read and write time. Higher cell ratios will decrease the read and write time and improve stability. PMOS semiconductor unit with fewer dimensions reduces the ability consumption. During this paper, 6T SRAM cell is implemented with reduced power and performance is good according to read and write time, delay and power consumption. It's been noticed typically that increased memory capability will increase the bit-line parasitic capacitance that successively slows down voltage sensing, to avoid this drawback use optimized scaling techniques and more, get improve performance of the design. Memories are a core part of most of the electronic systems. Performance in terms of speed and power dissipation is the major area of concern in today's memory technology. During this paper SRAM cells supported 6T, 9T, and 8T configurations are compared based on performance for reading and write operations. During this paper completely different static random access memory is designed to satisfy low power, high-performance circuit and also the extensive survey on options of various static random access memory (SRAM) designs were reported. Improve performance static random access memory based on designing a low power SRAM cell structure with optimum write access power

Power Efficient Data-Aware SRAM Cell for SRAM-Based FPGA Architecture

The design of low-power SRAM cell becomes a necessity in today\u27s FPGAs, because SRAM is a critical component in FPGA design and consumes a large fraction of the total power. The present chapter provides an overview of various factors responsible for power consumption in FPGA and discusses the design techniques of low-power SRAM-based FPGA at system level, device level, and architecture levels. Finally, the chapter proposes a data-aware dynamic SRAM cell to control the power consumption in the cell. Stack effect has been adopted in the design to reduce the leakage current. The various peripheral circuits like address decoder circuit, write/read enable circuits, and sense amplifier have been modified to implement a power-efficient SRAM-based FPGA

A Read-Decoupled Gated-Ground SRAM Architecture for Low-Power Embedded Memories

In order to meet the incessantly growing demand of performance, the amount of embedded or on-chip memory in microprocessors and systems-on-chip (SOC) is increasing. As much as 70% of the chip area is now dedicated to the embedded memory, which is primarily realized by the static random access memory (SRAM). Because of the large size of the SRAM, its yield and leakage power consumption dominate the overall yield and leakage power consumption of the chip. However, as the CMOS technology continues to scale in the sub-65 nanometer regime to reduce the transistor cost and the dynamic power, it poses a number of challenges on the SRAM design. In this thesis, we address these challenges and propose cell-level and architecture level solutions to increase the yield and reduce the leakage power consumption of the SRAM in nanoscale CMOS technologies. The conventional six transistor (6T) SRAM cell inherently suffers from a trade-off between the read stability and write-ability because of using the same bit line pair for both the read and write operations. An optimum design at a given process and voltage condition is a key to ensuring the yield and reliability of the SRAM. However, with technology scaling, process-induced variations in the transistor dimensions and electrical parameters coupled with variation in the operating conditions make it difficult to achieve a reasonably high yield. In this work, a gated SRAM architecture based on a seven transistor (7T) SRAM bit-cell is proposed to address these concerns. The proposed cell decouples the read bit line from the write bit lines. As a result, the storage node is not affected by any read induced noise during the read operation. Consequently, the proposed cell shows higher data stability and yield under varying process, voltage, and temperature (PVT) conditions. A single-ended sense amplifier is also presented to read from the proposed 7T cell while a unique write mechanism is used to reduce the write power to less than half of the write power of the conventional 6T cell. The proposed cell consumes similar silicon area and leakage power as the 6T cell when laid out and simulated using a commercial 65-nm CMOS technology. However, as much as 77% reduction in leakage power can be achieved by coupling the 7T cell with the column virtual grounding (CVG) technique, where a non-zero voltage is applied to the source terminals of driver NMOS transistors in the cell. The CVG technique also enables implementing multiple words per row, which is a key requirement for memories to avoid multiple-bit data upset in the event of radiation induced single event upset or soft error. In addition, the proposed cell inherently has a 30% larger soft error critical charge, making its soft error rate (SER) less than the half of that of the 6T cell

Energy optimization of 6T SRAM cell using low-voltage and high-performance inverter structures

The performance of the cell deteriorates, when static random access memory (SRAM) cell is operated below 1V supply voltage with continuous scale down of the complementary metal oxide semiconductor (CMOS) technology. The conventional 6T, 8T-SRAM cells suffer writeability and read static noise margins (SNM) at low-voltages leads to degradation of cell stability. To improve the cell stability and reduce the dynamic power dissipation at low- voltages of the SRAM cell, we proposed four SRAM cells based on inverter structures with less energy consumption using voltage divider bias current sink/source inverter and NOR/NAND gate using a pseudo-nMOS inverter. The design and implementation of SRAM cell using proposed inverter structures are compared with standard 6T, 8T and ST-11T SRAM cells for different supply voltages at 22-nm CMOS technology exhibit better performance of the cell. The read/write static noise margin of the cell significantly increases due to voltage divider bias network built with larger cell-ratio during read path. The load capacitance of the cell is reduced with minimized switching transitions of the devices during high-to-low and low- to-high of the pull-up and pull-down networks from VDD to ground leads to on an average 54% of dynamic power consumption. When compared with the existing ones, the read/write power of the proposed cells is reduced to 30%. The static power gets reduced by 24% due to stacking of transistors takes place in the proposed SRAM cells as compare to existing ones. The layout of the proposed cells is drawn at a 45-nm technology, and occupies an area of 1.5 times greater and 1.8 times greater as compared with 6T-SRAM cell

Subthreshold SRAM Design for Energy Efficient Applications in Nanometric CMOS Technologies

Embedded SRAM circuits are vital components in a modern system on chip (SOC) that can occupy up to 90% of the total area. Therefore, SRAM circuits heavily affect SOC performance, reliability, and yield. In addition, most of the SRAM bitcells are in standby mode and significantly contribute to the total leakage current and leakage power consumption. The aggressive demand in portable devices and billions of connected sensor networks requires long battery life. Therefore, careful design of SRAM circuits with minimal power consumption is in high demand. Reducing the power consumption is mainly achieved by reducing the power supply voltage in the idle mode. However, simply reducing the supply voltage imposes practical limitations on SRAM circuits such as reduced static noise margin, poor write margin, reduced number of cells per bitline, and reduced bitline sensing margin that might cause read/write failures. In addition, the SRAM bitcell has contradictory requirements for read stability and writability. Improving the read stability can cause difficulties in a write operation or vice versa. In this thesis, various techniques for designing subthreshold energy-efficient SRAM circuits are proposed. The proposed techniques include improvement in read margin and write margin, speed improvement, energy consumption reduction, new bitcell architecture and utilizing programmable wordline boosting. A programmable wordline boosting technique is exploited on a conventional 6T SRAM bitcell to improve the operational speed. In addition, wordline boosting can reduce the supply voltage while maintaining the operational frequency. The reduction of the supply voltage allows the memory macro to operate with reduced power consumption. To verify the design, a 16-kb SRAM was fabricated using the TSMC 65 nm CMOS technology. Measurement results show that the maximum operational frequency increases up to 33.3% when wordline boosting is applied. Besides, the supply voltage can be reduced while maintaining the same frequency. This allows reducing the energy consumption to be reduced by 22.2%. The minimum energy consumption achieved is 0.536 fJ/b at 400 mV. Moreover, to improve the read margin, a 6T bitcell SRAM with a PMOS access transistor is proposed. Utilizing a PMOS access transistor results in lower zero level degradation, and hence higher read stability. In addition, the access transistor connected to the internal node holding V DD acts as a stabilizer and counterbalances the effect of zero level degradation. In order to improve the writability, wordline boosting is exploited. Wordline boosting also helps to compensate for the lower speed of the PMOS access transistor compared to a NMOS transistor. To verify our design, a 2kb SRAM is fabricated in the TSMC 65 nm CMOS technology. Measurement results show that the maximum operating frequency of the test chip is at 3.34 MHz at 290 mV. The minimum energy consumption is measured as 1.1 fJ/b at 400 mV