An On-line BIST RAM Architecture with Self Repair Capabilities

The emerging field of self-repair computing is expected to have a major impact on deployable systems for space missions and defense applications, where high reliability, availability, and serviceability are needed. In this context, RAM (random access memories) are among the most critical components. This paper proposes a built-in self-repair (BISR) approach for RAM cores. The proposed design, introducing minimal and technology-dependent overheads, can detect and repair a wide range of memory faults including: stuck-at, coupling, and address faults. The test and repair capabilities are used on-line, and are completely transparent to the external user, who can use the memory without any change in the memory-access protocol. Using a fault-injection environment that can emulate the occurrence of faults inside the module, the effectiveness of the proposed architecture in terms of both fault detection and repairing capability was verified. Memories of various sizes have been considered to evaluate the area-overhead introduced by this proposed architectur

Memory built-in self-repair and correction for improving yield: a review

Nanometer memories are highly prone to defects due to dense structure, necessitating memory built-in self-repair as a must-have feature to improve yield. Today’s system-on-chips contain memories occupying an area as high as 90% of the chip area. Shrinking technology uses stricter design rules for memories, making them more prone to manufacturing defects. Further, using 3D-stacked memories makes the system vulnerable to newer defects such as those coming from through-silicon-vias (TSV) and micro bumps. The increased memory size is also resulting in an increase in soft errors during system operation. Multiple memory repair techniques based on redundancy and correction codes have been presented to recover from such defects and prevent system failures. This paper reviews recently published memory repair methodologies, including various built-in self-repair (BISR) architectures, repair analysis algorithms, in-system repair, and soft repair handling using error correcting codes (ECC). It provides a classification of these techniques based on method and usage. Finally, it reviews evaluation methods used to determine the effectiveness of the repair algorithms. The paper aims to present a survey of these methodologies and prepare a platform for developing repair methods for upcoming-generation memories

Design and Verification of a Dual Port RAM Using UVM Methodology

Data-intensive applications such as Deep Learning, Big Data, and Computer Vision have resulted in more demand for on-chip memory storage. Hence, state of the art Systems on Chips (SOCs) have a memory that occupies somewhere between 50% to 90 % of the die space. Extensive Research is being done in the field of memory technology to improve the efficiency of memory packaging. This effort has not always been successful because densely packed memory structures can experience defects during the fabrication process. Thus, it is critical to test the embedded memory modules once they are taped out. Along with testing, functional verification of a module makes sure that the design works the way it has been intended to perform. This paper proposes a built-in self-test (BIST) to validate a Dual Port Static RAM module and a complete layered test bench to verify the module’s operation functionally. The BIST has been designed using a finite state machine and has been targeted against most of the general SRAM faults in a given linear time constraint of O(23n). The layered test bench has been designed using Universal Verification Methodology (UVM), a standardized class library which has increased the re-usability and automation to the existing design verification language, SystemVerilog

DRAM Bender: An Extensible and Versatile FPGA-based Infrastructure to Easily Test State-of-the-art DRAM Chips

To understand and improve DRAM performance, reliability, security and energy efficiency, prior works study characteristics of commodity DRAM chips. Unfortunately, state-of-the-art open source infrastructures capable of conducting such studies are obsolete, poorly supported, or difficult to use, or their inflexibility limit the types of studies they can conduct. We propose DRAM Bender, a new FPGA-based infrastructure that enables experimental studies on state-of-the-art DRAM chips. DRAM Bender offers three key features at the same time. First, DRAM Bender enables directly interfacing with a DRAM chip through its low-level interface. This allows users to issue DRAM commands in arbitrary order and with finer-grained time intervals compared to other open source infrastructures. Second, DRAM Bender exposes easy-to-use C++ and Python programming interfaces, allowing users to quickly and easily develop different types of DRAM experiments. Third, DRAM Bender is easily extensible. The modular design of DRAM Bender allows extending it to (i) support existing and emerging DRAM interfaces, and (ii) run on new commercial or custom FPGA boards with little effort. To demonstrate that DRAM Bender is a versatile infrastructure, we conduct three case studies, two of which lead to new observations about the DRAM RowHammer vulnerability. In particular, we show that data patterns supported by DRAM Bender uncovers a larger set of bit-flips on a victim row compared to the data patterns commonly used by prior work. We demonstrate the extensibility of DRAM Bender by implementing it on five different FPGAs with DDR4 and DDR3 support. DRAM Bender is freely and openly available at https://github.com/CMU-SAFARI/DRAM-Bender.Comment: To appear in TCAD 202

Programmable built-in self-testing of embedded RAM clusters in system-on-chip architectures

Multiport memories are widely used as embedded cores in all communication system-on-chip devices. Due to their high complexity and very low accessibility, built-in self-test (BIST) is the most common solution implemented to test the different memories embedded in the system. This article presents a programmable BIST architecture based on a single microprogrammable BIST processor and a set of memory wrappers designed to simplify the test of a system containing a large number of distributed multiport memories of different sizes (number of bits, number of words), access protocols (asynchronous, synchronous), and timing

High Performance Spacecraft Computing (HPSC) Middleware Update

High Performance Spacecraft Computing (HPSC) is a joint project between the National Aeronautics and Space Administration (NASA) and Air Force Research Lab (AFRL) to develop a high-performance multi-core radiation hardened flight processor. HPSC offers a new flight computing architecture to meet the needs of NASA missions through 2030 and beyond. Providing on the order of 100X the computational capacity of current flight processors for the same amount of power, the multicore architecture of the HPSC processor, or "Chiplet" provides unprecedented flexibility in a flight computing system by enabling the operating point to be set dynamically, trading among needs for computational performance, energy management and fault tolerance. The HPSC Chiplet is being developed by Boeing under contract to NASA, and is expected to provide prototypes, an evaluation board, system emulators, comprehensive system software, and a software development kit. In addition to the vendor deliverables, the AFRL is funding the development of a flexible Middleware to be developed by NASA Jet Propulsion Laboratory and NASA Goddard Space Flight Center. The HPSC Middleware provides a suite of thirteen high level services to manage the compute, memory and I/O resources of this complex device.This presentation will provide an HPSC project update, an overview of the latest HPSC System Software release, an overview of HPSC Middleware Release 2, and a preview of the third HPSC Middleware release. The presentation will begin with a project update that will provide a look at the high-level changes since the project was introduced at the Flight Software Workshop last year. Next, the presentation will provide an overview of the current suite of HPSC System Software which includes the vendor provided bootloaders, operating systems, emulator, and development tools. Next, the HPSC Middleware progress will be presented, which includes an overview of the features and capabilities of HPSC Middleware Release 2, followed by a look at the reference flight software applications which utilize the Middleware. Finally, the presentation will give a preview of the HPSC Middleware Release 3

The NASA Electronic Parts and Packaging (NEPP) Program: Memory and Advanced Processor Plans

No abstract availabl

Low-overhead fault-tolerant logic for field-programmable gate arrays

While allowing for the fabrication of increasingly complex and efficient circuitry, transistor shrinkage and count-per-device expansion have major downsides: chiefly increased variation, degradation and fault susceptibility. For this reason, design-time consideration of faults will have to be given to increasing numbers of electronic systems in the future to ensure yields, reliabilities and lifetimes remain acceptably high. Many mathematical operators commonly accelerated in hardware are suited to modification resulting in datapath error detection and correction capabilities with far lower area, performance and/or power consumption overheads than those incurred through the utilisation of more established, general-purpose fault tolerance methods such as modular redundancy. Field-programmable gate arrays are uniquely placed to allow further area savings to be made thanks to their dynamic reconfigurability. The majority of the technical work presented within this thesis is based upon a benchmark hardware accelerator---a matrix multiplier---that underwent several evolutions in order to detect and correct faults manifesting along its datapath at runtime. In the first instance, fault detectability in excess of 99% was achieved in return for 7.87% additional area and 45.5% extra latency. In the second, the ability to correct errors caused by those faults was added at the cost of 4.20% more area, while 50.7% of this---and 46.2% of the previously incurred latency overhead---was removed through the introduction of partial reconfiguration in the third. The fourth demonstrates further reductions in both area and performance overheads---of 16.7% and 8.27%, respectively---through systematic data width reduction by allowing errors of less than ±0.5% of the maximum output value to propagate.Open Acces