The characterization of recycled concrete aggregate as filter in removal of phosphorus

Phosphorus (P) is one of the key nutrients that lead to eutrophication problem in surface water. However, the existing conventional wastewater treatment system to remove phosphorus is expensive and require a complex process. Therefore, a system using low cost and environmental friendly should be practiced to overcome this problem. Recycled concrete aggregate (RCA) used as a filter system emerged as an alternative technology for phosphorus removal. This can overcome the problem of construction site waste by converting the waste into something valuable products. Thus, this study aim to investigate the physical and chemical characteristic of RCA that influenced adsorption of P. RCA was analyzed using Scanning Electron Microscopy (SEM) and Energy-dispersive X-ray spectroscopy (EDX) testing to determine chemical composition. Results shows that RCA is highly contained with Aluminium, Calcium and Magnesium elements that enhanced the Phosphorus adsorption

A Survey of Techniques For Improving Energy Efficiency in Embedded Computing Systems

Recent technological advances have greatly improved the performance and features of embedded systems. With the number of just mobile devices now reaching nearly equal to the population of earth, embedded systems have truly become ubiquitous. These trends, however, have also made the task of managing their power consumption extremely challenging. In recent years, several techniques have been proposed to address this issue. In this paper, we survey the techniques for managing power consumption of embedded systems. We discuss the need of power management and provide a classification of the techniques on several important parameters to highlight their similarities and differences. This paper is intended to help the researchers and application-developers in gaining insights into the working of power management techniques and designing even more efficient high-performance embedded systems of tomorrow

Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

Multilevel Power Estimation Of VLSI Circuits Using Efficient Algorithms

New and complex systems are being implemented using highly advanced Electronic Design Automation (EDA) tools. As the complexity increases day by day, the dissipation of power has emerged as one of the very important design constraints. Now low power designs are not only used in small size applications like cell phones and handheld devices but also in high-performance computing applications. Embedded memories have been used extensively in modern SOC designs. In order to estimate the power consumption of the entire design correctly, an accurate memory power model is needed. However, the memory power model commonly used in commercial EDA tools is too simple to estimate the power consumption accurately. For complex digital circuits, building their power models is a popular approach to estimate their power consumption without detailed circuit information. In the literature, most of power models are built with lookup tables. However, building the power models with lookup tables may become infeasible for large circuits because the table size would increase exponentially to meet the accuracy requirement. This thesis involves two parts. In first part it uses the Synopsys power measurement tools together with the use of synthesis and extraction tools to determine power consumed by various macros at different levels of abstraction including the Register Transfer Level (RTL), the gate and the transistor level. In general, it can be concluded that as the level of abstraction goes down the accuracy of power measurement increases depending on the tool used. In second part a novel power modeling approach for complex circuits by using neural networks to learn the relationship between power dissipation and input/output characteristic vector during simulation has been developed. Our neural power model has very low complexity such that this power model can be used for complex circuits. Using such a simple structure, the neural power models can still have high accuracy because they can automatically consider the non-linear power distributions. Unlike the power characterization process in traditional approaches, our characterization process is very simple and straightforward. More importantly, using the neural power model for power estimation does not require any transistor-level or gate-level description of the circuits. The experimental results have shown that the estimations are accurate and efficient for different test sequences with wide range of input distributions

AI/ML Algorithms and Applications in VLSI Design and Technology

An evident challenge ahead for the integrated circuit (IC) industry in the nanometer regime is the investigation and development of methods that can reduce the design complexity ensuing from growing process variations and curtail the turnaround time of chip manufacturing. Conventional methodologies employed for such tasks are largely manual; thus, time-consuming and resource-intensive. In contrast, the unique learning strategies of artificial intelligence (AI) provide numerous exciting automated approaches for handling complex and data-intensive tasks in very-large-scale integration (VLSI) design and testing. Employing AI and machine learning (ML) algorithms in VLSI design and manufacturing reduces the time and effort for understanding and processing the data within and across different abstraction levels via automated learning algorithms. It, in turn, improves the IC yield and reduces the manufacturing turnaround time. This paper thoroughly reviews the AI/ML automated approaches introduced in the past towards VLSI design and manufacturing. Moreover, we discuss the scope of AI/ML applications in the future at various abstraction levels to revolutionize the field of VLSI design, aiming for high-speed, highly intelligent, and efficient implementations

Impact of Device Parameteres of Triple Gate SOI-FINFET on the Performance of CMOS Inverter at 22NM

A simulation based design evaluation is reported for SOI FinFETs at 22nm gate length. The impact of device parameters on the static power dissipation and delay of a CMOS inverter is presented. Fin dimensions such as Fin width and height are varied. For a given gate oxide thickness increasing the fin height and fin width degrades the SCEs, while improves the performance. It was found that reducing the fin thickness was beneficial in reducing the off state leakage current (IOFF), while reducing the fin height was beneficial in reducing the gate leakage current (IGATE). It was found that Static power dissipation of the inverter increases with fin height due to the increase in leakage current, whereas delay decreased with increase fin width due to higher on current. The performance of the inverter decreased with the down scaling of the gate oxide thickness due to higher gate leakage current and gate capacitance

A 90 nm CMOS 16 Gb/s Transceiver for Optical Interconnects

Interconnect architectures which leverage high-bandwidth optical channels offer a promising solution to address the increasing chip-to-chip I/O bandwidth demands. This paper describes a dense, high-speed, and low-power CMOS optical interconnect transceiver architecture. Vertical-cavity surface-emitting laser (VCSEL) data rate is extended for a given average current and corresponding reliability level with a four-tap current summing FIR transmitter. A low-voltage integrating and double-sampling optical receiver front-end provides adequate sensitivity in a power efficient manner by avoiding linear high-gain elements common in conventional transimpedance-amplifier (TIA) receivers. Clock recovery is performed with a dual-loop architecture which employs baud-rate phase detection and feedback interpolation to achieve reduced power consumption, while high-precision phase spacing is ensured at both the transmitter and receiver through adjustable delay clock buffers. A prototype chip fabricated in 1 V 90 nm CMOS achieves 16 Gb/s operation while consuming 129 mW and occupying 0.105 mm^2