Extending the performance of hybrid NoCs beyond the limitations of network heterogeneity

To meet the performance and scalability demands of the fast-paced technological growth towards exascale and Big-Data processing with the performance bottleneck of conventional metal based interconnects (wireline), alternative interconnect fabrics such as inhomogeneous three-dimensional integrated Network-on-Chip (3D NoC) and hybrid wired-wireless Network-on-Chip (WiNoC) have emanated as a cost-effective solution for emerging System-on-Chip (SoC) design. However, these interconnects trade-off optimized performance for cost by restricting the number of area and power hungry 3D routers and wireless nodes. Moreover, the non-uniform distributed traffic in chip multiprocessor (CMP) demands an on-chip communication infrastructure which can avoid congestion under high traffic conditions while possessing minimal pipeline delay at low-load conditions. To this end, in this paper, we propose a low-latency adaptive router with a low-complexity single-cycle bypassing mechanism to alleviate the performance degradation due to the slow 2D routers in such emerging hybrid NoCs. The proposed router transmits a flit using dimension-ordered routing (DoR) in the bypass datapath at low-loads. When the output port required for intra-dimension bypassing is not available, the packet is routed adaptively to avoid congestion. The router also has a simplified virtual channel allocation (VA) scheme that yields a non-speculative low-latency pipeline. By combining the low-complexity bypassing technique with adaptive routing, the proposed router is able balance the traffic in hybrid NoCs to achieve low-latency communication under various traffic loads. Simulation shows that, the proposed router can reduce applications’ execution time by an average of 16.9% compared to low-latency routers such as SWIFT. By reducing the latency between 2D routers (or wired nodes) and 3D routers (or wireless nodes) the proposed router can improve performance efficiency in terms of average packet delay by an average of 45% (or 50%) in 3D NoCs (or WiNoCs)

Hybrid Router Design for High Performance Photonic Network-On-Chip

With rising density of cores in Chip-Multiprocessors, traditional metallic interconnects won't be able to cater to the high demand in communication bandwidth at lower power consumption. Photonic interconnects are emerging as a very competitive and promising alternative to address these bottlenecks in recent times. The infrastructure for realizing such a communication architecture comprises of Micro Ring-resonator based silicon nano-photonic routers and waveguides. We propose a novel 5x5 photonic router microarchitecture employing mode-division-multiplexing along with wavelength-division-multiplexing and time-division-multiplexing. It increases the aggregate bandwidth almost four times in a network consuming almost 30% less power as compared to other recent photonic routers and laying the foundation of a high performance photonic network-on-chip(PNoC). We validated the feasibility of the proposed architecture and developed a new circuit switched based network simulator(PhotoNoxim) based on the router microarchitecture proposed by us to validate it under various synthetic traffics and benchmark applications

Efficient Sharing of Optical Resources in Low-Power Optical Networks-on-Chip

With the ever-growing core counts in modern computing systems, NoCs consume an increasing part of the power budget due to bandwidth and power density limitations of electrical interconnects. To maintain performance and power scaling, alternative technologies are required, with silicon photonics, sophisticated network designs are required to minimize static power overheads. In this paper, we propose Amon, a low-power ONoC that decreases number of μRings, wavelengths and path losses to reduce power consumption. Amom performs destination checking prior to data transmission on an underlying control network, allowing the sharing per-Watt by at least 23% (up to 70%), while reducing power without latency overheads on both synthetic and realistic applications. For aggressive optical technology parameters, Amom considerably outperforms all alternative NoCs in terms of power, outlining its increasing superiority as technology matures

OrthoNoC: a broadcast-oriented dual-plane wireless network-on-chip architecture

© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksOn-chip communication remains as a key research issue at the gates of the manycore era. In response to this, novel interconnect technologies have opened the door to new Network-on-Chip (NoC) solutions towards greater scalability and architectural flexibility. Particularly, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. This work presents ORTHONOC, a wired-wireless architecture that differs from existing proposals in that both network planes are decoupled and driven by traffic steering policies enforced at the network interfaces. With these and other design decisions, ORTHONOC seeks to emphasize the ordered broadcast advantage offered by the wireless technology. The performance and cost of ORTHONOC are first explored using synthetic traffic, showing substantial improvements with respect to other wired-wireless designs with a similar number of antennas. Then, the applicability of ORTHONOC in the multiprocessor scenario is demonstrated through the evaluation of a simple architecture that implements fast synchronization via ordered broadcast transmissions. Simulations reveal significant execution time speedups and communication energy savings for 64-threaded benchmarks, proving that the value of ORTHONOC goes beyond simply improving the performance of the on-chip interconnect.Peer ReviewedPostprint (author's final draft

A survey of system level power management schemes in the dark-silicon era for many-core architectures

Power consumption in Complementary Metal Oxide Semiconductor (CMOS) technology has escalated to a point that only a fractional part of many-core chips can be powered-on at a time. Fortunately, this fraction can be increased at the expense of performance through the dark-silicon solution. However, with many-core integration set to be heading towards its thousands, power consumption and temperature increases per time, meaning the number of active nodes must be reduced drastically. Therefore, optimized techniques are demanded for continuous advancement in technology. Existing efforts try to overcome this challenge by activating nodes from different parts of the chip at the expense of communication latency. Other efforts on the other hand employ run-time power management techniques to manage the power performance of the cores trading-off performance for power. We found out that, for a significant amount of power to saved and high temperature to be avoided, focus should be on reducing the power consumption of all the on-chip components. Especially, the memory hierarchy and the interconnect. Power consumption can be minimized by, reducing the size of high leakage power dissipating elements, turning-off idle resources and integrating power saving materials

Locality-oblivious cache organization leveraging single-cycle multi-hop NoCs

Locality has always been a critical factor in on-chip data placement on CMPs as accessing further-away caches has in the past been more costly than accessing nearby ones. Substantial research on locality-aware designs have thus focused on keeping a copy of the data private. However, this complicatesthe problem of data tracking and search/invalidation; tracking the state of a line at all on-chip caches at a directory or performing full-chip broadcasts are both non-scalable and extremely expensive solutions. In this paper, we make the case for Locality-Oblivious Cache Organization (LOCO), a CMP cache organization that leverages the on-chip network to create virtual single-cycle paths between distant caches, thus redefining the notion of locality. LOCO is a clustered cache organization, supporting both homogeneous and heterogeneous cluster sizes, and provides near single-cycle accesses to data anywhere within the cluster, just like a private cache. Globally, LOCO dynamically creates a virtual mesh connecting all the clusters, and performs an efficient global data search and migration over this virtual mesh, without having to resort to full-chip broadcasts or perform expensive directory lookups. Trace-driven and full system simulations running SPLASH-2 and PARSEC benchmarks show that LOCO improves application run time by up to 44.5% over baseline private and shared cache.Semiconductor Research CorporationUnited States. Defense Advanced Research Projects Agency (Semiconductor Technology Advanced Research Network