Circuit design and analysis for on-FPGA communication systems

On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Integration (VLSI) design, as the trend of technology scaling favours logics more than interconnects. Interconnects often dictates the system performance, and, therefore, research for new methodologies and system architectures that deliver high-performance communication services across the chip is mandatory. The interconnect challenge is exacerbated in Field-Programmable Gate Array (FPGA), as a type of ASIC where the hardware can be programmed post-fabrication. Communication across an FPGA will be deteriorating as a result of interconnect scaling. The programmable fabrics, switches and the specific routing architecture also introduce additional latency and bandwidth degradation further hindering intra-chip communication performance. Past research efforts mainly focused on optimizing logic elements and functional units in FPGAs. Communication with programmable interconnect received little attention and is inadequately understood. This thesis is among the first to research on-chip communication systems that are built on top of programmable fabrics and proposes methodologies to maximize the interconnect throughput performance. There are three major contributions in this thesis: (i) an analysis of on-chip interconnect fringing, which degrades the bandwidth of communication channels due to routing congestions in reconfigurable architectures; (ii) a new analogue wave signalling scheme that significantly improves the interconnect throughput by exploiting the fundamental electrical characteristics of the reconfigurable interconnect structures. This new scheme can potentially mitigate the interconnect scaling challenges. (iii) a novel Dynamic Programming (DP)-network to provide adaptive routing in network-on-chip (NoC) systems. The DP-network architecture performs runtime optimization for route planning and dynamic routing which, effectively utilizes the in-silicon bandwidth. This thesis explores a new horizon in reconfigurable system design, in which new methodologies and concepts are proposed to enhance the on-FPGA communication throughput performance that is of vital importance in new technology processes

Automatic synthesis and optimization of chip multiprocessors

The microprocessor technology has experienced an enormous growth during the last decades. Rapid downscale of the CMOS technology has led to higher operating frequencies and performance densities, facing the fundamental issue of power dissipation. Chip Multiprocessors (CMPs) have become the latest paradigm to improve the power-performance efficiency of computing systems by exploiting the parallelism inherent in applications. Industrial and prototype implementations have already demonstrated the benefits achieved by CMPs with hundreds of cores.CMP architects are challenged to take many complex design decisions. Only a few of them are:- What should be the ratio between the core and cache areas on a chip?- Which core architectures to select?- How many cache levels should the memory subsystem have?- Which interconnect topologies provide efficient on-chip communication?These and many other aspects create a complex multidimensional space for architectural exploration. Design Automation tools become essential to make the architectural exploration feasible under the hard time-to-market constraints. The exploration methods have to be efficient and scalable to handle future generation on-chip architectures with hundreds or thousands of cores.Furthermore, once a CMP has been fabricated, the need for efficient deployment of the many-core processor arises. Intelligent techniques for task mapping and scheduling onto CMPs are necessary to guarantee the full usage of the benefits brought by the many-core technology. These techniques have to consider the peculiarities of the modern architectures, such as availability of enhanced power saving techniques and presence of complex memory hierarchies.This thesis has several objectives. The first objective is to elaborate the methods for efficient analytical modeling and architectural design space exploration of CMPs. The efficiency is achieved by using analytical models instead of simulation, and replacing the exhaustive exploration with an intelligent search strategy. Additionally, these methods incorporate high-level models for physical planning. The related contributions are described in Chapters 3, 4 and 5 of the document.The second objective of this work is to propose a scalable task mapping algorithm onto general-purpose CMPs with power management techniques, for efficient deployment of many-core systems. This contribution is explained in Chapter 6 of this document.Finally, the third objective of this thesis is to address the issues of the on-chip interconnect design and exploration, by developing a model for simultaneous topology customization and deadlock-free routing in Networks-on-Chip. The developed methodology can be applied to various classes of the on-chip systems, ranging from general-purpose chip multiprocessors to application-specific solutions. Chapter 7 describes the proposed model.The presented methods have been thoroughly tested experimentally and the results are described in this dissertation. At the end of the document several possible directions for the future research are proposed

Design Space Exploration for MPSoC Architectures

Multiprocessor system-on-chip (MPSoC) designs utilize the available technology and communication architectures to meet the requirements of the upcoming applications. In MPSoC, the communication platform is both the key enabler, as well as the key differentiator for realizing efficient MPSoCs. It provides product differentiation to meet a diverse, multi-dimensional set of design constraints, including performance, power, energy, reconfigurability, scalability, cost, reliability and time-to-market. The communication resources of a single interconnection platform cannot be fully utilized by all kind of applications, such as the availability of higher communication bandwidth for computation but not data intensive applications is often unfeasible in the practical implementation. This thesis aims to perform the architecture-level design space exploration towards efficient and scalable resource utilization for MPSoC communication architecture. In order to meet the performance requirements within the design constraints, careful selection of MPSoC communication platform, resource aware partitioning and mapping of the application play important role. To enhance the utilization of communication resources, variety of techniques such as resource sharing, multicast to avoid re-transmission of identical data, and adaptive routing can be used. For implementation, these techniques should be customized according to the platform architecture. To address the resource utilization of MPSoC communication platforms, variety of architectures with different design parameters and performance levels, namely Segmented bus (SegBus), Network-on-Chip (NoC) and Three-Dimensional NoC (3D-NoC), are selected. Average packet latency and power consumption are the evaluation parameters for the proposed techniques. In conventional computing architectures, fault on a component makes the connected fault-free components inoperative. Resource sharing approach can utilize the fault-free components to retain the system performance by reducing the impact of faults. Design space exploration also guides to narrow down the selection of MPSoC architecture, which can meet the performance requirements with design constraints.Siirretty Doriast

Simulation Of Multi-core Systems And Interconnections And Evaluation Of Fat-Mesh Networks

Simulators are very important in computer architecture research as they enable the exploration of new architectures to obtain detailed performance evaluation without building costly physical hardware. Simulation is even more critical to study future many-core architectures as it provides the opportunity to assess currently non-existing computer systems. In this thesis, a multiprocessor simulator is presented based on a cycle accurate architecture simulator called SESC. The shared L2 cache system is extended into a distributed shared cache (DSC) with a directory-based cache coherency protocol. A mesh network module is extended and integrated into SESC to replace the bus for scalable inter-processor communication. While these efforts complete an extended multiprocessor simulation infrastructure, two interconnection enhancements are proposed and evaluated. A novel non-uniform fat-mesh network structure similar to the idea of fat-tree is proposed. This non-uniform mesh network takes advantage of the average traffic pattern, typically all-to-all in DSC, to dedicate additional links for connections with heavy traffic (e.g., near the center) and fewer links for lighter traffic (e.g., near the periphery). Two fat-mesh schemes are implemented based on different routing algorithms. Analytical fat-mesh models are constructed by presenting the expressions for the traffic requirements of personalized all-to-all traffic. Performance improvements over the uniform mesh are demonstrated in the results from the simulator. A hybrid network consisting of one packet switching plane and multiple circuit switching planes is constructed as the second enhancement. The circuit switching planes provide fast paths between neighbors with heavy communication traffic. A compiler technique that abstracts the symbolic expressions of benchmarks' communication patterns can be used to help facilitate the circuit establishment

Numerical solutions of differential equations on FPGA-enhanced computers

Conventionally, to speed up scientific or engineering (S&E) computation programs on general-purpose computers, one may elect to use faster CPUs, more memory, systems with more efficient (though complicated) architecture, better software compilers, or even coding with assembly languages. With the emergence of Field Programmable Gate Array (FPGA) based Reconfigurable Computing (RC) technology, numerical scientists and engineers now have another option using FPGA devices as core components to address their computational problems. The hardware-programmable, low-cost, but powerful “FPGA-enhanced computer” has now become an attractive approach for many S&E applications. A new computer architecture model for FPGA-enhanced computer systems and its detailed hardware implementation are proposed for accelerating the solutions of computationally demanding and data intensive numerical PDE problems. New FPGAoptimized algorithms/methods for rapid executions of representative numerical methods such as Finite Difference Methods (FDM) and Finite Element Methods (FEM) are designed, analyzed, and implemented on it. Linear wave equations based on seismic data processing applications are adopted as the targeting PDE problems to demonstrate the effectiveness of this new computer model. Their sustained computational performances are compared with pure software programs operating on commodity CPUbased general-purpose computers. Quantitative analysis is performed from a hierarchical set of aspects as customized/extraordinary computer arithmetic or function units, compact but flexible system architecture and memory hierarchy, and hardwareoptimized numerical algorithms or methods that may be inappropriate for conventional general-purpose computers. The preferable property of in-system hardware reconfigurability of the new system is emphasized aiming at effectively accelerating the execution of complex multi-stage numerical applications. Methodologies for accelerating the targeting PDE problems as well as other numerical PDE problems, such as heat equations and Laplace equations utilizing programmable hardware resources are concluded, which imply the broad usage of the proposed FPGA-enhanced computers

POWER AND PERFORMANCE STUDIES OF THE EXPLICIT MULTI-THREADING (XMT) ARCHITECTURE

Power and thermal constraints gained critical importance in the design of microprocessors over the past decade. Chipmakers failed to keep power at bay while sustaining the performance growth of serial computers at the rate expected by consumers. As an alternative, they turned to fitting an increasing number of simpler cores on a single die. While this is a step forward for relaxing the constraints, the issue of power is far from resolved and it is joined by new challenges which we explain next. As we move into the era of many-cores, processors consisting of 100s, even 1000s of cores, single-task parallelism is the natural path for building faster general-purpose computers. Alas, the introduction of parallelism to the mainstream general-purpose domain brings another long elusive problem to focus: ease of parallel programming. The result is the dual challenge where power efficiency and ease-of-programming are vital for the prevalence of up and coming many-core architectures. The observations above led to the lead goal of this dissertation: a first order validation of the claim that even under power/thermal constraints, ease-of-programming and competitive performance need not be conflicting objectives for a massively-parallel general-purpose processor. As our platform, we choose the eXplicit Multi-Threading (XMT) many-core architecture for fine grained parallel programs developed at the University of Maryland. We hope that our findings will be a trailblazer for future commercial products. XMT scales up to thousand or more lightweight cores and aims at improving single task execution time while making the task for the programmer as easy as possible. Performance advantages and ease-of-programming of XMT have been shown in a number of publications, including a study that we present in this dissertation. Feasibility of the hardware concept has been exhibited via FPGA and ASIC (per our partial involvement) prototypes. Our contributions target the study of power and thermal envelopes of an envisioned 1024-core XMT chip (XMT1024) under programs that exist in popular parallel benchmark suites. First, we compare XMT against an area and power equivalent commercial high-end many-core GPU. We demonstrate that XMT can provide an average speedup of 8.8x in irregular parallel programs that are common and important in general purpose computing. Even under the worst-case power estimation assumptions for XMT, average speedup is only reduced by half. We further this study by experimentally evaluating the performance advantages of Dynamic Thermal Management (DTM), when applied to XMT1024. DTM techniques are frequently used in current single and multi-core processors, however until now their effects on single-tasked many-cores have not been examined in detail. It is our purpose to explore how existing techniques can be tailored for XMT to improve performance. Performance improvements up to 46% over a generic global management technique has been demonstrated. The insights we provide can guide designers of other similar many-core architectures. A significant infrastructure contribution of this dissertation is a highly configurable cycle-accurate simulator, XMTSim. To our knowledge, XMTSim is currently the only publicly-available shared-memory many-core simulator with extensive capabilities for estimating power and temperature, as well as evaluating dynamic power and thermal management algorithms. As a major component of the XMT programming toolchain, it is not only used as the infrastructure in this work but also contributed to other publications and dissertations

Accelerating the Performance of a Novel Meshless Method Based on Collocation With Radial Basis Functions By Employing a Graphical Processing Unit as a Parallel Coprocessor

In recent times, a variety of industries, applications and numerical methods including the meshless method have enjoyed a great deal of success by utilizing the graphical processing unit (GPU) as a parallel coprocessor. These benefits often include performance improvement over the previous implementations. Furthermore, applications running on graphics processors enjoy superior performance per dollar and performance per watt than implementations built exclusively on traditional central processing technologies. The GPU was originally designed for graphics acceleration but the modern GPU, known as the General Purpose Graphical Processing Unit (GPGPU) can be used for scientific and engineering calculations. The GPGPU consists of massively parallel array of integer and floating point processors. There are typically hundreds of processors per graphics card with dedicated high-speed memory. This work describes an application written by the author, titled GaussianRBF to show the implementation and results of a novel meshless method that in-cooperates the collocation of the Gaussian radial basis function by utilizing the GPU as a parallel co-processor. Key phases of the proposed meshless method have been executed on the GPU using the NVIDIA CUDA software development kit. Especially, the matrix fill and solution phases have been carried out on the GPU, along with some post processing. This approach resulted in a decreased processing time compared to similar algorithm implemented on the CPU while maintaining the same accuracy

Overcoming the Challenges for Multichip Integration: A Wireless Interconnect Approach

The physical limitations in the area, power density, and yield restrict the scalability of the single-chip multicore system to a relatively small number of cores. Instead of having a large chip, aggregating multiple smaller chips can overcome these physical limitations. Combining multiple dies can be done either by stacking vertically or by placing side-by-side on the same substrate within a single package. However, in order to be widely accepted, both multichip integration techniques need to overcome significant challenges. In the horizontally integrated multichip system, traditional inter-chip I/O does not scale well with technology scaling due to limitations of the pitch. Moreover, to transfer data between cores or memory components from one chip to another, state-of-the-art inter-chip communication over wireline channels require data signals to travel from internal nets to the peripheral I/O ports and then get routed over the inter-chip channels to the I/O port of the destination chip. Following this, the data is finally routed from the I/O to internal nets of the target chip over a wireline interconnect fabric. This multi-hop communication increases energy consumption while decreasing data bandwidth in a multichip system. On the other hand, in vertically integrated multichip system, the high power density resulting from the placement of computational components on top of each other aggravates the thermal issues of the chip leading to degraded performance and reduced reliability. Liquid cooling through microfluidic channels can provide cooling capabilities required for effective management of chip temperatures in vertical integration. However, to reduce the mechanical stresses and at the same time, to ensure temperature uniformity and adequate cooling competencies, the height and width of the microchannels need to be increased. This limits the area available to route Through-Silicon-Vias (TSVs) across the cooling layers and make the co-existence and co-design of TSVs and microchannels extreamly challenging. Research in recent years has demonstrated that on-chip and off-chip wireless interconnects are capable of establishing radio communications within as well as between multiple chips. The primary goal of this dissertation is to propose design principals targeting both horizontally and vertically integrated multichip system to provide high bandwidth, low latency, and energy efficient data communication by utilizing mm-wave wireless interconnects. The proposed solution has two parts: the first part proposes design methodology of a seamless hybrid wired and wireless interconnection network for the horizontally integrated multichip system to enable direct chip-to-chip communication between internal cores. Whereas the second part proposes a Wireless Network-on-Chip (WiNoC) architecture for the vertically integrated multichip system to realize data communication across interlayer microfluidic coolers eliminating the need to place and route signal TSVs through the cooling layers. The integration of wireless interconnect will significantly reduce the complexity of the co-design of TSV based interconnects and microchannel based interlayer cooling. Finally, this dissertation presents a combined trade-off evaluation of such wireless integration system in both horizontal and vertical sense and provides future directions for the design of the multichip system

Effective network grid synthesis and optimization for high performance very large scale integration system design

制度:新 ; 文部省報告番号:甲2642号 ; 学位の種類:博士(工学) ; 授与年月日:2008/3/15 ; 早大学位記番号:新480