602 research outputs found

    Reliability-aware and energy-efficient system level design for networks-on-chip

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    2015 Spring.Includes bibliographical references.With CMOS technology aggressively scaling into the ultra-deep sub-micron (UDSM) regime and application complexity growing rapidly in recent years, processors today are being driven to integrate multiple cores on a chip. Such chip multiprocessor (CMP) architectures offer unprecedented levels of computing performance for highly parallel emerging applications in the era of digital convergence. However, a major challenge facing the designers of these emerging multicore architectures is the increased likelihood of failure due to the rise in transient, permanent, and intermittent faults caused by a variety of factors that are becoming more and more prevalent with technology scaling. On-chip interconnect architectures are particularly susceptible to faults that can corrupt transmitted data or prevent it from reaching its destination. Reliability concerns in UDSM nodes have in part contributed to the shift from traditional bus-based communication fabrics to network-on-chip (NoC) architectures that provide better scalability, performance, and utilization than buses. In this thesis, to overcome potential faults in NoCs, my research began by exploring fault-tolerant routing algorithms. Under the constraint of deadlock freedom, we make use of the inherent redundancy in NoCs due to multiple paths between packet sources and sinks and propose different fault-tolerant routing schemes to achieve much better fault tolerance capabilities than possible with traditional routing schemes. The proposed schemes also use replication opportunistically to optimize the balance between energy overhead and arrival rate. As 3D integrated circuit (3D-IC) technology with wafer-to-wafer bonding has been recently proposed as a promising candidate for future CMPs, we also propose a fault-tolerant routing scheme for 3D NoCs which outperforms the existing popular routing schemes in terms of energy consumption, performance and reliability. To quantify reliability and provide different levels of intelligent protection, for the first time, we propose the network vulnerability factor (NVF) metric to characterize the vulnerability of NoC components to faults. NVF determines the probabilities that faults in NoC components manifest as errors in the final program output of the CMP system. With NVF aware partial protection for NoC components, almost 50% energy cost can be saved compared to the traditional approach of comprehensively protecting all NoC components. Lastly, we focus on the problem of fault-tolerant NoC design, that involves many NP-hard sub-problems such as core mapping, fault-tolerant routing, and fault-tolerant router configuration. We propose a novel design-time (RESYN) and a hybrid design and runtime (HEFT) synthesis framework to trade-off energy consumption and reliability in the NoC fabric at the system level for CMPs. Together, our research in fault-tolerant NoC routing, reliability modeling, and reliability aware NoC synthesis substantially enhances NoC reliability and energy-efficiency beyond what is possible with traditional approaches and state-of-the-art strategies from prior work

    DeSyRe: on-Demand System Reliability

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    The DeSyRe project builds on-demand adaptive and reliable Systems-on-Chips (SoCs). As fabrication technology scales down, chips are becoming less reliable, thereby incurring increased power and performance costs for fault tolerance. To make matters worse, power density is becoming a significant limiting factor in SoC design, in general. In the face of such changes in the technological landscape, current solutions for fault tolerance are expected to introduce excessive overheads in future systems. Moreover, attempting to design and manufacture a totally defect and fault-free system, would impact heavily, even prohibitively, the design, manufacturing, and testing costs, as well as the system performance and power consumption. In this context, DeSyRe delivers a new generation of systems that are reliable by design at well-balanced power, performance, and design costs. In our attempt to reduce the overheads of fault-tolerance, only a small fraction of the chip is built to be fault-free. This fault-free part is then employed to manage the remaining fault-prone resources of the SoC. The DeSyRe framework is applied to two medical systems with high safety requirements (measured using the IEC 61508 functional safety standard) and tight power and performance constraints

    Networks on Chips: Structure and Design Methodologies

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    Fault-tolerant vertical link design for effective 3D stacking

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    [EN] Recently, 3D stacking has been proposed to alleviate the memory bandwidth limitation arising in chip multiprocessors (CMPs). As the number of integrated cores in the chip increases the access to external memory becomes the bottleneck, thus demanding larger memory amounts inside the chip. The most accepted solution to implement vertical links between stacked dies is by using Through Silicon Vias (TSVs). However, TSVs are exposed to misalignment and random defects compromising the yield of the manufactured 3D chip. A common solution to this problem is by over-provisioning, thus impacting on area and cost. In this paper, we propose a fault-tolerant vertical link design. With its adoption, fault-tolerant vertical links can be implemented in a 3D chip design at low cost without the need of adding redundant TSVs (no over-provision). Preliminary results are very promising as the fault-tolerant vertical link design increases switch area only by 6.69% while the achieved interconnect yield tends to 100%.This work was supported by the Spanish MEC and MICINN, as well as European Comission FEDER funds, under Grants CSD2006-00046 and TIN2009-14475-C04. It was also partly supported by the project NaNoC (project label 248972) which is funded by the European Commission within the Research Programme FP7.Hernández Luz, C.; Roca Pérez, A.; Flich Cardo, J.; Silla Jiménez, F.; Duato Marín, JF. (2011). Fault-tolerant vertical link design for effective 3D stacking. IEEE Computer Architecture Letters. 10(2):41-44. https://doi.org/10.1109/L-CA.2011.17S414410

    Reconfigurable High Performance Secured NoC Design Using Hierarchical Agent-based Monitoring System

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    With the rapid increase in demand for high performance computing, there is also a significant growth of data communication that leads to leverage the significance of network on chip. This paper proposes a reconfigurable fault tolerant on chip architecture with hierarchical agent based monitoring system for enhancing the performance of network based multiprocessor system on chip against faulty links and nodes. These distributed agents provide healthy status and congestion information of the network. This status information is used for further packet routing in the network with the help of XY routing algorithm. The functionality of Agent is enhanced not only to work as information provider but also to take decision for packet to either pass or stop to the processing element by setting the firewall in order to provide security. Proposed design provides a better performance and area optimization by avoiding deadlock and live lock as compared to existing approaches over network design

    Adaptive Routing Approaches for Networked Many-Core Systems

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    Through advances in technology, System-on-Chip design is moving towards integrating tens to hundreds of intellectual property blocks into a single chip. In such a many-core system, on-chip communication becomes a performance bottleneck for high performance designs. Network-on-Chip (NoC) has emerged as a viable solution for the communication challenges in highly complex chips. The NoC architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication challenges such as wiring complexity, communication latency, and bandwidth. Furthermore, the combined benefits of 3D IC and NoC schemes provide the possibility of designing a high performance system in a limited chip area. The major advantages of 3D NoCs are the considerable reductions in average latency and power consumption. There are several factors degrading the performance of NoCs. In this thesis, we investigate three main performance-limiting factors: network congestion, faults, and the lack of efficient multicast support. We address these issues by the means of routing algorithms. Congestion of data packets may lead to increased network latency and power consumption. Thus, we propose three different approaches for alleviating such congestion in the network. The first approach is based on measuring the congestion information in different regions of the network, distributing the information over the network, and utilizing this information when making a routing decision. The second approach employs a learning method to dynamically find the less congested routes according to the underlying traffic. The third approach is based on a fuzzy-logic technique to perform better routing decisions when traffic information of different routes is available. Faults affect performance significantly, as then packets should take longer paths in order to be routed around the faults, which in turn increases congestion around the faulty regions. We propose four methods to tolerate faults at the link and switch level by using only the shortest paths as long as such path exists. The unique characteristic among these methods is the toleration of faults while also maintaining the performance of NoCs. To the best of our knowledge, these algorithms are the first approaches to bypassing faults prior to reaching them while avoiding unnecessary misrouting of packets. Current implementations of multicast communication result in a significant performance loss for unicast traffic. This is due to the fact that the routing rules of multicast packets limit the adaptivity of unicast packets. We present an approach in which both unicast and multicast packets can be efficiently routed within the network. While suggesting a more efficient multicast support, the proposed approach does not affect the performance of unicast routing at all. In addition, in order to reduce the overall path length of multicast packets, we present several partitioning methods along with their analytical models for latency measurement. This approach is discussed in the context of 3D mesh networks.Siirretty Doriast

    Network-on-Chip

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    Limitations of bus-based interconnections related to scalability, latency, bandwidth, and power consumption for supporting the related huge number of on-chip resources result in a communication bottleneck. These challenges can be efficiently addressed with the implementation of a network-on-chip (NoC) system. This book gives a detailed analysis of various on-chip communication architectures and covers different areas of NoCs such as potentials, architecture, technical challenges, optimization, design explorations, and research directions. In addition, it discusses current and future trends that could make an impactful and meaningful contribution to the research and design of on-chip communications and NoC systems

    Resilient Routing Implementation in 2D Mesh NoC

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    With the rapid shrinking of technology and growing integration capacity, the probability of failures in Networks-on-Chip (NoCs) increases and thus, fault tolerance is essential. Moreover, the unpredictable locations of these failures may influence the regularity of the underlying topology, and a regular 2D mesh is likely to become irregular. Thus, for these failure-prone networks, a viable routing framework should comprise a topology-agnostic routing algorithm along with a cost-effective, scalable routing mechanism able to handle failures, irrespective of any particular failure patterns. Existing routing techniques designed to route irregular topologies efficiently lack flexibility (logic-based), scalability (table-based) or relaxed switch design (uLBDR-based). Designing an efficient routing implementation technique to address irregular topologies remains a pressing research problem. To address this, we present a fault resilient routing mechanism for irregular 2D meshes resulting from failures. To handle irregularities, it avoids using routing tables and employs a few fixed configuration bits per switch resulting in a scalable approach. Experiments demonstrate that the proposed approach is guaranteed to tolerate all locations of single and double-link failures and most multiple failures. Also, unlike uLBDR it is not restricted to any particular switching technique and does not replicate any extra messages. Along with fault tolerance, the proposed mechanism can achieve better network performance in fault-free cases. The proposed technique achieves graceful performance degradation during failure. Compared to uLBDR, our method has 14% less area requirements and 16% less overall power consumption

    Tree-structured small-world connected wireless network-on-chip with adaptive routing

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    Traditional Network-on-Chip (NoC) systems comprised of many cores suffer from debilitating bottlenecks of latency and significant power dissipation due to the overhead inherent in multi-hop communication. In addition, these systems remain vulnerable to malicious circuitry incorporated into the design by untrustworthy vendors in a world where complex multi-stage design and manufacturing processes require the collective specialized services of a variety of contractors. This thesis proposes a novel small-world tree-based network-on-chip (SWTNoC) structure designed for high throughput, acceptable energy consumption, and resiliency to attacks and node failures resulting from the insertion of hardware Trojans. This tree-based implementation was devised as a means of reducing average network hop count, providing a large degree of local connectivity, and effective long-range connectivity by means of a novel wireless link approach based on carbon nanotube (CNT) antenna design. Network resiliency is achieved by means of a devised adaptive routing algorithm implemented to work with TRAIN (Tree-based Routing Architecture for Irregular Networks). Comparisons are drawn with benchmark architectures with optimized wireless link placement by means of the simulated annealing (SA) metaheuristic. Experimental results demonstrate a 21% throughput improvement and a 23% reduction in dissipated energy per packet over the closest competing architecture. Similar trends are observed at increasing system sizes. In addition, the SWTNoC maintains this throughput and energy advantage in the presence of a fault introduced into the system. By designing a hierarchical topology and designating a higher level of importance on a subset of the nodes, much higher network throughput can be attained while simultaneously guaranteeing deadlock freedom as well as a high degree of resiliency and fault-tolerance
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