Ultra-low power mixed-signal frontend for wearable EEGs

Electronics circuits are ubiquitous in daily life, aided by advancements in the chip design industry, leading to miniaturised solutions for typical day to day problems. One of the critical healthcare areas helped by this advancement in technology is electroencephalography (EEG). EEG is a non-invasive method of tracking a person's brain waves, and a crucial tool in several healthcare contexts, including epilepsy and sleep disorders. Current ambulatory EEG systems still suffer from limitations that affect their usability. Furthermore, many patients admitted to emergency departments (ED) for a neurological disorder like altered mental status or seizures, would remain undiagnosed hours to days after admission, which leads to an elevated rate of death compared to other conditions. Conducting a thorough EEG monitoring in early-stage could prevent further damage to the brain and avoid high mortality. But lack of portability and ease of access results in a long wait time for the prescribed patients. All real signals are analogue in nature, including brainwaves sensed by EEG systems. For converting the EEG signal into digital for further processing, a truly wearable EEG has to have an analogue mixed-signal front-end (AFE). This research aims to define the specifications for building a custom AFE for the EEG recording and use that to review the suitability of the architectures available in the literature. Another critical task is to provide new architectures that can meet the developed specifications for EEG monitoring and can be used in epilepsy diagnosis, sleep monitoring, drowsiness detection and depression study. The thesis starts with a preview on EEG technology and available methods of brainwaves recording. It further expands to design requirements for the AFE, with a discussion about critical issues that need resolving. Three new continuous-time capacitive feedback chopped amplifier designs are proposed. A novel calibration loop for setting the accurate value for a pseudo-resistor, which is a crucial block in the proposed topology, is also discussed. This pseudoresistor calibration loop achieved the resistor variation of under 8.25%. The thesis also presents a new design of a curvature corrected bandgap, as well as a novel DDA based fourth-order Sallen-Key filter. A modified sensor frontend architecture is then proposed, along with a detailed analysis of its implementation. Measurement results of the AFE are finally presented. The AFE consumed a total power of 3.2A (including ADC, amplifier, filter, and current generation circuitry) with the overall integrated input-referred noise of 0.87V-rms in the frequency band of 0.5-50Hz. Measurement results confirmed that only the proposed AFE achieved all defined specifications for the wearable EEG system with the smallest power consumption than state-of-art architectures that meet few but not all specifications. The AFE also achieved a CMRR of 131.62dB, which is higher than any studied architectures.Open Acces

A 5.5 μW 42nV/√Hz Chopper stabilized Amplifier for Biomedical Application with Input Impedance Enhancement

The continuous real-time monitoring of diverse physical parameters using biosignals like ECG and EEG requires the biomedical sensors. Such sensor consists of analog frontend unit for which low noise and low power Operational transconductance amplifier (OTA) is essential. In this paper, the novel chopper-stabilized bio-potential amplifier is proposed. The chopper stabilization technique is used to reduce the offset and flicker noise. Further, the OTA is likewise comprised of a method to enhance the input impedance without consuming more power. Also, the ripple reduction technique is used at the output branch of the OTA. The designed amplifier consumes 5.5 μW power with the mid-band gain of 40dB. The pass-band for the designed amplifier is 0.1Hz to 1KHz. The input impedance is likewise boosted with the proposed method. The noise is 42 nV/√Hz with CMRR of 82 dB. All simulations are carried out in 180nm parameters

Amplifiers in Biomedical Engineering: A Review from Application Perspectives

Continuous monitoring and treatment of various diseases with biomedical technologies and wearable electronics has become significantly important. The healthcare area is an important, evolving field that, among other things, requires electronic and micro-electromechanical technologies. Designed circuits and smart devices can lead to reduced hospitalization time and hospitals equipped with high-quality equipment. Some of these devices can also be implanted inside the body. Recently, various implanted electronic devices for monitoring and diagnosing diseases have been presented. These instruments require communication links through wireless technologies. In the transmitters of these devices, power amplifiers are the most important components and their performance plays important roles. This paper is devoted to collecting and providing a comprehensive review on the various designed implanted amplifiers for advanced biomedical applications. The reported amplifiers vary with respect to the class/type of amplifier, implemented CMOS technology, frequency band, output power, and the overall efficiency of the designs. The purpose of the authors is to provide a general view of the available solutions, and any researcher can obtain suitable circuit designs that can be selected for their problem by reading this survey

DESIGN OF SMART SENSORS FOR DETECTION OF PHYSICAL QUANTITIES

Microsystems and integrated smart sensors represent a flourishing business thanks to the manifold benefits of these devices with respect to their respective macroscopic counterparts. Miniaturization to micrometric scale is a turning point to obtain high sensitive and reliable devices with enhanced spatial and temporal resolution. Power consumption compatible with battery operated systems, and reduced cost per device are also pivotal for their success. All these characteristics make investigation on this filed very active nowadays. This thesis work is focused on two main themes: (i) design and development of a single chip smart flow-meter; (ii) design and development of readout interfaces for capacitive micro-electro-mechanical-systems (MEMS) based on capacitance to pulse width modulation conversion. High sensitivity integrated smart sensors for detecting very small flow rates of both gases and liquids aiming to fulfil emerging demands for this kind of devices in the industrial to environmental and medical applications. On the other hand, the prototyping of such sensor is a multidisciplinary activity involving the study of thermal and fluid dynamic phenomenon that have to be considered to obtain a correct design. Design, assisted by finite elements CAD tools, and fabrication of the sensing structures using features of a standard CMOS process is discussed in the first chapter. The packaging of fluidic sensors issue is also illustrated as it has a great importance on the overall sensor performances. The package is charged to allow optimal interaction between fluids and the sensors and protecting the latter from the external environment. As miniaturized structures allows a great spatial resolution, it is extremely challenging to fabricate low cost packages for multiple flow rate measurements on the same chip. As a final point, a compact anemometer prototype, usable for wireless sensor network nodes, is described. The design of the full custom circuitry for signal extraction and conditioning is coped in the second chapter, where insights into the design methods are given for analog basic building blocks such as amplifiers, transconductors, filters, multipliers, current drivers. A big effort has been put to find reusable design guidelines and trade-offs applicable to different design cases. This kind of rational design enabled the implementation of complex and flexible functionalities making the interface circuits able to interact both with on chip sensors and external sensors. In the third chapter, the chip floor-plan designed in the STMicroelectronics BCD6s process of the entire smart flow sensor formed by the sensing structures and the readout electronics is presented. Some preliminary tests are also covered here. Finally design and implementation of very low power interfaces for typical MEMS capacitive sensors (accelerometers, gyroscopes, pressure sensors, angular displacement and chemical species sensors) is discussed. Very original circuital topologies, based on chopper modulation technique, will be illustrated. A prototype, designed within a joint research activity is presented. Measured performances spurred the investigation of new techniques to enhance precision and accuracy capabilities of the interface. A brief introduction to the design of active pixel sensors interface for hybrid CMOS imagers is sketched in the appendix as a preliminary study done during an internship in the CNM-IMB institute of Barcelona

Digitally-assisted, ultra-low power circuits and systems for medical applications

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2010.Cataloged from PDF version of thesis.Includes bibliographical references (p. 219-225).In recent years, trends in the medical industry have created a growing demand for a variety of implantable medical devices. At the same time, advances in integrated circuits techniques, particularly in CMOS, have opened possibilities for advanced implantable systems that are very small and consume minimal energy. Minimizing the volume of medical implants is important as it allows for less invasive procedures and greater comfort to patients. Minimizing energy consumption is imperative as batteries must last at least a decade without replacement. Two primary functions that consume energy in medical implants are sensor interfaces that collect information from biomedical signals, and radios that allow the implant to communicate with a base-station outside of the body. The general focus of this work was the development of circuits and systems that minimize the size and energy required to carry out these two functions. The first part of this work focuses on laying down the theoretical framework for an ultra-low power radio, including advances to the literature in the area of super-regeneration. The second part includes the design of a transceiver optimized for medical implants, and its implementation in a CMOS process. The final part describes the design of a sensor interface that leverages novel analog and digital techniques to reduce the system's size and improve its functionality. This final part was developed in conjunction with Marcus Yip.by Jose L. Bohorquez.Ph.D

Low power VCO-based analog-to-digital conversion

textThis dissertation presents novel two stage ADC architecture with a VCO based second stage. With the scaling of the supply voltages in modern CMOS process it is difficult to design high gain operational amplifiers needed for traditional voltage domain two-stage analog to digital converters. However time resolution continues to improve with the advancement in CMOS technology making VCO-based ADC more attractive. The nonlinearity in voltage-to-frequency transfer function is the biggest challenge in design of VCO based ADC. The hybrid approach used in this work uses a voltage domain first stage to determine the most significant bits and uses a VCO based second stage to quantize the small residue obtained from first stage. The architecture relaxes the gain requirement on the the first stage opamp and also relaxes the linearity requirements on the second stage VCO. The prototype ADC built in 65nm CMOS process achieves 63.7dB SNDR in 10MHz bandwidth while only consuming 1.1mW of power. The performance of the prototype chip is comparable to the state-of-art in terms of figure-of-merit but this new architecture uses significantly less circuit area.Electrical and Computer Engineerin

Design and debugging of multi-step analog to digital converters

With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

Interface Circuits for Microsensor Integrated Systems

ca. 200 words; this text will present the book in all promotional forms (e.g. flyers). Please describe the book in straightforward and consumer-friendly terms. [Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. Among these, low voltage and low power circuit architectures have gained growing attention, being suitable for portable long battery life devices. The aim is to improve the performances of actual interface circuits and systems, both in terms of voltage mode and current mode, in order to overcome the potential problems due to technology scaling and different technology integrations. Related problems, especially those concerning parasitics, lead to a severe interface design attention, especially concerning the analog front-end and novel and smart architecture must be explored and tested, both at simulation and prototype level. Moreover, the growing demand for autonomous systems gets even harder the interface design due to the need of energy-aware cost-effective circuit interfaces integrating, where possible, energy harvesting solutions. The objective of this Special Issue is to explore the potential solutions to overcome actual limitations in sensor interface circuits and systems, especially those for low voltage and low power Microsensor Integrated Systems. The present Special Issue aims to present and highlight the advances and the latest novel and emergent results on this topic, showing best practices, implementations and applications. The Guest Editors invite to submit original research contributions dealing with sensor interfacing related to this specific topic. Additionally, application oriented and review papers are encouraged.

Automatic compensation of pressure effects on smart flow sensors in the analog and digital domain

Two different approaches for the automatic compensation of pressure effects on thermal flow sensors are investigated. One approach operates in the analog domain and it is based on a closed-loop circuit that uses a pressure dependent signal to keep the sensor output constant. The digital approach operates in an open loop fashion and is capable of producing also a pressure reading. The effectiveness of the proposed methods has been verified by means of a smart flow sensor integrating on the same chip the sensing structures and a configurable electronic interface performing signal reading and non idealities compensation. The chip has been designed with a commercial CMOS process and fabricated by means of a post-processing technique. The experimental results performed in nitrogen confirm that both methods are capable of reducing the sensitivity of the flow sensor output signal to pressure variation

Integrated circuit design for implantable neural interfaces

Progress in microfabrication technology has opened the way for new possibilities in neuroscience and medicine. Chronic, biocompatible brain implants with recording and stimulation capabilities provided by embedded electronics have been successfully demonstrated. However, more ambitious applications call for improvements in every aspect of existing implementations. This thesis proposes two prototypes that advance the field in significant ways. The first prototype is a neural recording front-end with spectral selectivity capabilities that implements a design strategy that leads to the lowest reported power consumption as compared to the state of the art. The second one is a bidirectional front-end for closed-loop neuromodulation that accounts for self-interference and impedance mismatch thus enabling simultaneous recording and stimulation. The design process and experimental verification of both prototypes is presented herein