Investigation of Variation in Organic Thin-film Transistors (OTFT) and Design of Variation-aware Organic Circuits

This work investigates the key sources of variability in OTFT namely process variations and bias-stress induced variation, and presents circuit design techniques to build robust variation-aware digital and analog circuits using OTFT. OTFT suffer from a relatively large Vt variation due to the bias stress effects, and process mismatch variations. Though these effects are also prevalent in silicon based transistors, their magnitude is comparatively larger in the case of OTFT. This renders the well-established silicon based circuits unsuitable for organic electronics. Therefore, direct adaptation of the silicon based circuits for realising organic circuits does not effectively handle the relatively large parameter and mismatch variations associated with OTFT. In this work, we first investigate the bias-stress induced threshold voltage (Vt) variation and process variations to understand the impact of these variations on the performance of organic circuits. Then, two different strategies were employed to design robust organic circuits. The first method involves designing new load topologies that are more robust to the threshold voltage variations without compromising on gain. The other strategy was to realize the essential analog circuit functionalities like comparator, ADC using digital circuit blocks. In this direction, a digital comparator and digital A/D converter circuits were developed. Finally to demonstrate the system integration, a temperature sensing organic smart label system was designed

Circuit designs for low-power and SEU-hardened systems

The desire to have smaller and faster portable devices is one of the primary motivations for technology scaling. Though advancements in device physics are moving at a very good pace, they might not be aggressive enough for now-a-day technology scaling trends. As a result, the MOS devices used for present day integrated circuits are pushed to the limit in terms of performance, power consumption and robustness, which are the most critical criteria for almost all applications. Secondly, technology advancements have led to design of complex chips with increasing chip densities and higher operating speeds. The design of such high performance complex chips (microprocessors, digital signal processors, etc) has massively increased the power dissipation and, as a result, the operating temperatures of these integrated circuits. In addition, due to the aggressive technology scaling the heat withstanding capabilities of the circuits is reducing, thereby increasing the cost of packaging and heat sink units. This led to the increase in prominence for smarter and more robust low-power circuit and system designs. Apart from power consumption, another criterion affected by technology scaling is robustness of the design, particularly for critical applications (security, medical, finance, etc). Thus, the need for error free or error immune designs. Until recently, radiation effects were a major concern in space applications only. With technology scaling reaching nanometer level, terrestrial radiation has become a growing concern. As a result Single Event Upsets (SEUs) have become a major challenge to robust designs. Single event upset is a temporary change in the state of a device due to a particle strike (usually from the radiation belts or from cosmic rays) which may manifest as an error at the output. This thesis proposes a novel method for adaptive digital designs to efficiently work with the lowest possible power consumption. This new technique improves options in performance, robustness and power. The thesis also proposes a new dual data rate flipflop, which reduces the necessary clock speed by half, drastically reducing the power consumption. This new dual data rate flip-flop design culminates in a proposed unique radiation hardened dual data rate flip-flop, Firebird\u27. Firebird offers a valuable addition to the future circuit designs, especially with the increasing importance of the Single Event Upsets (SEUs) and power dissipation with technology scaling.\u2

An On-chip PVT Resilient Short Time Measurement Technique

As the CMOS technology nodes continue to shrink, the challenges of developing manufacturing tests for integrated circuits become more difficult to address. To detect parametric faults of new generation of integrated circuits such as 3D ICs, on-chip short-time intervals have to be accurately measured. The accuracy of an on-chip time measurement module is heavily affected by Process, supply Voltage, and Temperature (PVT) variations. This work presents a new on-chip time measurement scheme where the undesired effects of PVT variations are attenuated significantly. To overcome the effects of PVT variations on short-time measurement, phase locking methodology is utilized to implement a robust Vernier delay line. A prototype Time-to-Digital Converter (TDC) has been fabricated using TSMC 0.180 µm CMOS technology and experimental measurements have been carried out to verify the performance parameters of the TDC. The measurement results indicate that the proposed solution reduces the effects of PVT variations by more than tenfold compared to a conventional on-chip TDC. A coarse-fine time interval measurement scheme which is resilient to the PVT variations is also proposed. In this approach, two Delay Locked Loops (DLLs) are utilized to minimize the effects of PVT on the measured time intervals. The proposed scheme has been implemented using CMOS 65nm technology. Simulation results using Advanced Design System (ADS) indicate that the measurement resolution varies by less than 0.1ps with ±15% variations of the supply voltage. The proposed method also presents a robust performance against process and temperature variations. The measurement accuracy changes by a maximum of 0.05ps from slow to fast corners. The implemented TDC presents a robust performance against temperature variations too and its measurement accuracy varies a few femto-seconds from -40 ºC to +100 ºC. The principle of robust short-time measurement was used in practice to design and implement a state-of-the-art Coordinate Measuring Machine (CMM) for an industry partner to measure geometrical features of transmission parts with micrometer resolution. The solution developed for the industry partner has resulted in a patent and a product in the market. The on-chip short-time measurement technology has also been utilized to develop a solution to detect Hardware Trojans

Latency Optimized Asynchronous Early Output Ripple Carry Adder based on Delay-Insensitive Dual-Rail Data Encoding

Asynchronous circuits employing delay-insensitive codes for data representation i.e. encoding and following a 4-phase return-to-zero protocol for handshaking are generally robust. Depending upon whether a single delay-insensitive code or multiple delay-insensitive code(s) are used for data encoding, the encoding scheme is called homogeneous or heterogeneous delay-insensitive data encoding. This article proposes a new latency optimized early output asynchronous ripple carry adder (RCA) that utilizes single-bit asynchronous full adders (SAFAs) and dual-bit asynchronous full adders (DAFAs) which incorporate redundant logic and are based on the delay-insensitive dual-rail code i.e. homogeneous data encoding, and follow a 4-phase return-to-zero handshaking. Amongst various RCA, carry lookahead adder (CLA), and carry select adder (CSLA) designs, which are based on homogeneous or heterogeneous delay-insensitive data encodings which correspond to the weak-indication or the early output timing model, the proposed early output asynchronous RCA that incorporates SAFAs and DAFAs with redundant logic is found to result in reduced latency for a dual-operand addition operation. In particular, for a 32-bit asynchronous RCA, utilizing 15 stages of DAFAs and 2 stages of SAFAs leads to reduced latency. The theoretical worst-case latencies of the different asynchronous adders were calculated by taking into account the typical gate delays of a 32/28nm CMOS digital cell library, and a comparison is made with their practical worst-case latencies estimated. The theoretical and practical worst-case latencies show a close correlation....Comment: arXiv admin note: text overlap with arXiv:1704.0761

Asynchronous Early Output Dual-Bit Full Adders Based on Homogeneous and Heterogeneous Delay-Insensitive Data Encoding

This paper presents the designs of asynchronous early output dual-bit full adders without and with redundant logic (implicit) corresponding to homogeneous and heterogeneous delay-insensitive data encoding. For homogeneous delay-insensitive data encoding only dual-rail i.e. 1-of-2 code is used, and for heterogeneous delay-insensitive data encoding 1-of-2 and 1-of-4 codes are used. The 4-phase return-to-zero protocol is used for handshaking. To demonstrate the merits of the proposed dual-bit full adder designs, 32-bit ripple carry adders (RCAs) are constructed comprising dual-bit full adders. The proposed dual-bit full adders based 32-bit RCAs incorporating redundant logic feature reduced latency and area compared to their non-redundant counterparts with no accompanying power penalty. In comparison with the weakly indicating 32-bit RCA constructed using homogeneously encoded dual-bit full adders containing redundant logic, the early output 32-bit RCA comprising the proposed homogeneously encoded dual-bit full adders with redundant logic reports corresponding reductions in latency and area by 22.2% and 15.1% with no associated power penalty. On the other hand, the early output 32-bit RCA constructed using the proposed heterogeneously encoded dual-bit full adder which incorporates redundant logic reports respective decreases in latency and area than the weakly indicating 32-bit RCA that consists of heterogeneously encoded dual-bit full adders with redundant logic by 21.5% and 21.3% with nil power overhead. The simulation results obtained are based on a 32/28nm CMOS process technology