Modelling methods for testability analysis of analog integrated circuits based on pole-zero analysis

Testability analysis for analog circuits provides valuable information for designers and test engineers. Such information includes a number of testable and nontestable elements of a circuit, ambiguity groups, and nodes to be tested. This information is useful for solving the fault diagnosis problem. In order to verify the functionality of analog circuits, a large number of specifications have to be checked. However, checking all circuit specifications can result in prohibitive testing times on expensive automated test equipment. Therefore, the test engineer has to select a finite subset of specifications to be measured. This subset of specifications must result in reducing the test time and guaranteeing that no faulty chips are shipped. This research develops a novel methodology for testability analysis of linear analog circuits based on pole-zero analysis and on pole-zero sensitivity analysis. Based on this methodology, a new interpretation of ambiguity groups is provided relying on the circuit theory. The testability analysis methodology can be employed as a guideline for constructing fault diagnosis equations and for selecting the test nodes. We have also proposed an algorithm for selecting specifications that need to be measured. The element testability concept will be introduced. This concept provides the degree of difficulty in testing circuit elements. The value of the element testability can easily be obtained using the pole sensitivities. Then, specifications which need to be measured can be selected based on this concept. Consequently, the selected measurements can be utilized for reducing the test time without sacrificing the fault coverage and maximizing the information for fault diagnosis

Fault simulation for structural testing of analogue integrated circuits

In this thesis the ANTICS analogue fault simulation software is described which provides a statistical approach to fault simulation for accurate analogue IC test evaluation. The traditional figure of fault coverage is replaced by the average probability of fault detection. This is later refined by considering the probability of fault occurrence to generate a more realistic, weighted test metric. Two techniques to reduce the fault simulation time are described, both of which show large reductions in simulation time with little loss of accuracy. The final section of the thesis presents an accurate comparison of three test techniques and an evaluation of dynamic supply current monitoring. An increase in fault detection for dynamic supply current monitoring is obtained by removing the DC component of the supply current prior to measurement

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Phase Locked Loop Test Methodology

Phase locked loops are incorporated into almost every large-scale mixed signal and digital system on chip (SOC). Various types of PLL architectures exist including fully analogue, fully digital, semi-digital, and software based. Currently the most commonly used PLL architecture for SOC environments and chipset applications is the Charge-Pump (CP) semi-digital type. This architecture is commonly used for clock synthesis applications, such as the supply of a high frequency on-chip clock, which is derived from a low frequency board level clock. In addition, CP-PLL architectures are now frequently used for demanding RF (Radio Frequency) synthesis, and data synchronization applications. On chip system blocks that rely on correct PLL operation may include third party IP cores, ADCs, DACs and user defined logic (UDL). Basically, any on-chip function that requires a stable clock will be reliant on correct PLL operation. As a direct consequence it is essential that the PLL function is reliably verified during both the design and debug phase and through production testing. This chapter focuses on test approaches related to embedded CP-PLLs used for the purpose of clock generation for SOC. However, methods discussed will generally apply to CP-PLLs used for other applications

High level behavioural modelling of boundary scan architecture.

This project involves the development of a software tool which enables the integration of the IEEE 1149.1/JTAG Boundary Scan Test Architecture automatically into an ASIC (Application Specific Integrated Circuit) design. The tool requires the original design (the ASIC) to be described in VHDL-IEEE 1076 Hardware Description Language. The tool consists of the two major elements: i) A parsing and insertion algorithm developed and implemented in 'C'; ii) A high level model of the Boundary Scan Test Architecture implemented in 'VHDL'. The parsing and insertion algorithm is developed to deal with identifying the design Input/Output (I/O) terminals, their types and the order they appear in the ASIC design. It then attaches suitable Boundary Scan Cells to each I/O, except power and ground and inserts the high level models of the full Boundary Scan Architecture into the ASIC without altering the design core structure

Verifying analog circuits based on a digital signature

Verification of analog circuit specifications is a challenging task requiring expensive test equipment and time consuming procedures. This paper presents a method for low cost parameter verification based on statistical analysis of a digital signature. A CMOS on-chip monitor and sampler circuit generates the digital signature of the CUT. The monitor composes two signals (x(t); y(t)) and divides the X-Y plane with nonlinear boundaries in order to generate a digital code for every analog (x; y) location. A metric to be used to discriminate the golden and defective signatures is also proposed. The metric is based on the definition of a discrepancy factor performing circuit parameter identification via statistical and pre-training procedures. The proposed method is applied to verify possible deviations on the natural frequency of a Biquad filter. Simulation results show the possibilities of the proposal.Postprint (published version

Symbolic tolerance and sensitivity analysis of large scale electronic circuits

Available from British Library Document Supply Centre-DSC:DXN029693 / BLDSC - British Library Document Supply CentreSIGLEGBUnited Kingdo

Quiescent current testing of CMOS data converters

Power supply quiescent current (IDDQ) testing has been very effective in VLSI circuits designed in CMOS processes detecting physical defects such as open and shorts and bridging defects. However, in sub-micron VLSI circuits, IDDQ is masked by the increased subthreshold (leakage) current of MOSFETs affecting the efficiency of I¬DDQ testing. In this work, an attempt has been made to perform robust IDDQ testing in presence of increased leakage current by suitably modifying some of the test methods normally used in industry. Digital CMOS integrated circuits have been tested successfully using IDDQ and IDDQ methods for physical defects. However, testing of analog circuits is still a problem due to variation in design from one specific application to other. The increased leakage current further complicates not only the design but also testing. Mixed-signal integrated circuits such as the data converters are even more difficult to test because both analog and digital functions are built on the same substrate. We have re-examined both IDDQ and IDDQ methods of testing digital CMOS VLSI circuits and added features to minimize the influence of leakage current. We have designed built-in current sensors (BICS) for on-chip testing of analog and mixed-signal integrated circuits. We have also combined quiescent current testing with oscillation and transient current test techniques to map large number of manufacturing defects on a chip. In testing, we have used a simple method of injecting faults simulating manufacturing defects invented in our VLSI research group. We present design and testing of analog and mixed-signal integrated circuits with on-chip BICS such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs. The designed circuits are fabricated in 0.5 μm and 1.5 μm n-well CMOS processes and tested. Experimentally observed results of the fabricated devices are compared with simulations from SPICE using MOS level 3 and BSIM3.1 model parameters for 1.5 μm and 0.5 μm n-well CMOS technologies, respectively. We have also explored the possibility of using noise in VLSI circuits for testing defects and present the method we have developed