97,286 research outputs found

    From FPGA to ASIC: A RISC-V processor experience

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    This work document a correct design flow using these tools in the Lagarto RISC- V Processor and the RTL design considerations that must be taken into account, to move from a design for FPGA to design for ASIC

    Tensor Computation: A New Framework for High-Dimensional Problems in EDA

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    Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

    Adaptive Multi-Rate Wavelet Method for Circuit Simulation

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    In this paper a new adaptive algorithm for multi-rate circuit simulation encountered in the design of RF circuits based on spline wavelets is presented. The ordinary circuit differential equations are first rewritten by a system of (multi-rate) partial differential equations (MPDEs) in order to decouple the different time scales. Second, a semi-discretization by Rothe's method of the MPDEs results in a system of differential algebraic equations DAEs with periodic boundary conditions. These boundary value problems are solved by a Galerkin discretization using spline functions. An adaptive spline grid is generated, using spline wavelets for non-uniform grids. Moreover the instantaneous frequency is chosen adaptively to guarantee a smooth envelope resulting in large time steps and therefore high run time efficiency. Numerical tests on circuits exhibiting multi-rate behavior including mixers and PLL conclude the paper

    SIRENA: A CAD environment for behavioural modelling and simulation of VLSI cellular neural network chips

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    This paper presents SIRENA, a CAD environment for the simulation and modelling of mixed-signal VLSI parallel processing chips based on cellular neural networks. SIRENA includes capabilities for: (a) the description of nominal and non-ideal operation of CNN analogue circuitry at the behavioural level; (b) performing realistic simulations of the transient evolution of physical CNNs including deviations due to second-order effects of the hardware; and, (c) evaluating sensitivity figures, and realize noise and Monte Carlo simulations in the time domain. These capabilities portray SIRENA as better suited for CNN chip development than algorithmic simulation packages (such as OpenSimulator, Sesame) or conventional neural networks simulators (RCS, GENESIS, SFINX), which are not oriented to the evaluation of hardware non-idealities. As compared to conventional electrical simulators (such as HSPICE or ELDO-FAS), SIRENA provides easier modelling of the hardware parasitics, a significant reduction in computation time, and similar accuracy levels. Consequently, iteration during the design procedure becomes possible, supporting decision making regarding design strategies and dimensioning. SIRENA has been developed using object-oriented programming techniques in C, and currently runs under the UNIX operating system and X-Windows framework. It employs a dedicated high-level hardware description language: DECEL, fitted to the description of non-idealities arising in CNN hardware. This language has been developed aiming generality, in the sense of making no restrictions on the network models that can be implemented. SIRENA is highly modular and composed of independent tools. This simplifies future expansions and improvements.Comisión Interministerial de Ciencia y Tecnología TIC96-1392-C02-0

    Communication Subsystems for Emerging Wireless Technologies

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    The paper describes a multi-disciplinary design of modern communication systems. The design starts with the analysis of a system in order to define requirements on its individual components. The design exploits proper models of communication channels to adapt the systems to expected transmission conditions. Input filtering of signals both in the frequency domain and in the spatial domain is ensured by a properly designed antenna. Further signal processing (amplification and further filtering) is done by electronics circuits. Finally, signal processing techniques are applied to yield information about current properties of frequency spectrum and to distribute the transmission over free subcarrier channels

    SIM-DSP: A DSP-Enhanced CAD Platform for Signal Integrity Macromodeling and Simulation

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    Macromodeling-Simulation process for signal integrity verifications has become necessary for the high speed circuit system design. This paper aims to introduce a “VLSI Signal Integrity Macromodeling and Simulation via Digital Signal Processing Techniques” framework (known as SIM-DSP framework), which applies digital signal processing techniques to facilitate the SI verification process in the pre-layout design phase. Core identification modules and peripheral (pre-/post-)processing modules have been developed and assembled to form a verification flow. In particular, a single-step discrete cosine transform truncation (DCTT) module has been developed for modeling-simulation process. In DCTT, the response modeling problem is classified as a signal compression problem, wherein the system response can be represented by a truncated set of non-pole based DCT bases, and error can be analyzed through Parseval’s theorem. Practical examples are given to show the applicability of our proposed framework

    Efficient Simulation of Structural Faults for the Reliability Evaluation at System-Level

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    In recent technology nodes, reliability is considered a part of the standard design ¿ow at all levels of embedded system design. While techniques that use only low-level models at gate- and register transfer-level offer high accuracy, they are too inefficient to consider the overall application of the embedded system. Multi-level models with high abstraction are essential to efficiently evaluate the impact of physical defects on the system. This paper provides a methodology that leverages state-of-the-art techniques for efficient fault simulation of structural faults together with transaction-level modeling. This way it is possible to accurately evaluate the impact of the faults on the entire hardware/software system. A case study of a system consisting of hardware and software for image compression and data encryption is presented and the method is compared to a standard gate/RT mixed-level approac

    When self-consistency makes a difference

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    Compound semiconductor power RF and microwave device modeling requires, in many cases, the use of selfconsistent electrothermal equivalent circuits. The slow thermal dynamics and the thermal nonlinearity should be accurately included in the model; otherwise, some response features subtly related to the detailed frequency behavior of the slow thermal dynamics would be inaccurately reproduced or completely distorted. In this contribution we show two examples, concerning current collapse in HBTs and modeling of IMPs in GaN HEMTs. Accurate thermal modeling is proved to be be made compatible with circuit-oriented CAD tools through a proper choice of system-level approximations; in the discussion we exploit a Wiener approach, but of course the strategy should be tailored to the specific problem under consideratio
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